Guo‐Quan Lu
- Ceramics and Composites top 1%
-
- Electronic Packaging and Soldering Technologies 175
- 3D IC and TSV technologies 128
- Silicon Carbide Semiconductor Technologies 102
- Electromagnetic Compatibility and Noise Suppression 44
- Advanced DC-DC Converters 27
- Nanomaterials and Printing Technologies 25
- Mechanical Engineering top 0.5%
- Aluminum Alloys Composites Properties 35
- Materials Chemistry top 5%
- Thermal properties of materials 26
Guo‐Quan Lu
324 papers receiving 7.5k citations
Peers
Comparison fields: 5 of 105
- Ceramics and Composites 622
- Electrical and Electronic Engineering 6.2k
- Mechanical Engineering 3.2k
- Electronic, Optical and Magnetic Materials 793
- Materials Chemistry 1.5k
Countries citing papers authored by Guo‐Quan Lu
This map shows the geographic impact of Guo‐Quan Lu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Guo‐Quan Lu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Guo‐Quan Lu more than expected).
Fields of papers citing papers by Guo‐Quan Lu
This network shows the impact of papers produced by Guo‐Quan Lu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Guo‐Quan Lu. The network helps show where Guo‐Quan Lu may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Guo‐Quan Lu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 3 | |
| 2 | 2024 | 4 | |
| 3 | 2023 | 7 | |
| 4 | 2023 | 15 | |
| 5 | 2023 | 12 | |
| 6 | 2022 | 3 | |
| 7 | 2022 | 29 | |
| 8 | 2021 | 4 | |
| 9 | 2021 | 42 | |
| 10 | 2021 | 11 | |
| 11 | 2021 | 9 | |
| 12 | 2021 | 41 | |
| 13 | 2020 | 3 | |
| 14 | 2019 | 9 | |
| 15 | 2019 | 54 | |
| 16 | 2018 | 17 | |
| 17 | 2018 | 19 | |
| 18 | 2017 | 9 | |
| 19 | Low-pressure (< 5 MPa) Low-temperature Joining of Large-area Chips on Copper Using Nanosilver Paste | 2012 | 19 |
| 20 | 1994 | 2 |
About Guo‐Quan Lu
Guo‐Quan Lu is a scholar working on Electrical and Electronic Engineering, Ceramics and Composites and Mechanical Engineering, having authored 330 papers that have together received 7.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (175 papers), 3D IC and TSV technologies (128 papers), Silicon Carbide Semiconductor Technologies (102 papers), Electromagnetic Compatibility and Noise Suppression (44 papers), Aluminum Alloys Composites Properties (35 papers), Advanced DC-DC Converters (27 papers), Thermal properties of materials (26 papers) and Nanomaterials and Printing Technologies (25 papers). The work is most often cited by research in Ceramics and Composites (622 citations), Electrical and Electronic Engineering (6.2k citations) and Mechanical Engineering (3.2k citations). Guo‐Quan Lu has collaborated with scholars based in United States, China and France. Frequent co-authors include Yunhui Mei, Xu Chen, Khai D. T. Ngo, John G. Bai, Jesus N. Calata, Gang Chen, Xin Li, Xingsheng Liu, Xin Li and Guangyin Lei. Their work appears in journals such as IEEE Transactions on Power Electronics, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Device and Materials Reliability, Microelectronics Reliability and Journal of Electronic Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.