Patrick McCluskey
- Polymers and Plastics top 5%
-
- Electronic Packaging and Soldering Technologies 48
- 3D IC and TSV technologies 23
- Silicon Carbide Semiconductor Technologies 23
- Advanced MEMS and NEMS Technologies 11
- Integrated Circuits and Semiconductor Failure Analysis 9
- Mechanical Engineering top 5%
- Heat Transfer and Optimization 18
- Heat Transfer and Boiling Studies 7
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- Thermal properties of materials 6
- Automotive Engineering top 10%
- Co-authors
- Bongtae HanByeng D. YounHyunseok OhKen GallChangwoon HanMartin L. DunnYiping LiuAvram Bar‐Cohen
- Journals
- Microelectronics Reliability (8 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)Journal of Electronic Packaging (3 papers)
- Partner nations
- United StatesDenmarkJapan
In The Last Decade
Patrick McCluskey
105 papers receiving 1.7k citations
Peers
Comparison fields: 5 of 78
- Polymers and Plastics 320
- Electrical and Electronic Engineering 1.0k
- Mechanical Engineering 587
- Materials Chemistry 305
- Automotive Engineering 75
Countries citing papers authored by Patrick McCluskey
This map shows the geographic impact of Patrick McCluskey's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Patrick McCluskey with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Patrick McCluskey more than expected).
Fields of papers citing papers by Patrick McCluskey
This network shows the impact of papers produced by Patrick McCluskey. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Patrick McCluskey. The network helps show where Patrick McCluskey may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Patrick McCluskey, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 0 | |
| 2 | 2023 | 8 | |
| 3 | 2023 | 9 | |
| 4 | 2023 | 1 | |
| 5 | 2019 | 2 | |
| 6 | 2018 | 4 | |
| 7 | 2018 | 13 | |
| 8 | 2017 | 4 | |
| 9 | 2016 | 6 | |
| 10 | 2015 | 3 | |
| 11 | 2011 | 3 | |
| 12 | 2011 | 6 | |
| 13 | 2010 | 17 | |
| 14 | 2008 | 9 | |
| 15 | 2007 | 22 | |
| 16 | 2007 | 16 | |
| 17 | 2005 | 18 | |
| 18 | 2003 | 19 | |
| 19 | 2002 | 9 | |
| 20 | 2000 | 25 |
About Patrick McCluskey
Patrick McCluskey is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Condensed Matter Physics and Aerospace Engineering, having authored 111 papers that have together received 1.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (23 papers), Silicon Carbide Semiconductor Technologies (23 papers), Heat Transfer and Optimization (18 papers), Advanced MEMS and NEMS Technologies (11 papers), Integrated Circuits and Semiconductor Failure Analysis (9 papers), Heat Transfer and Boiling Studies (7 papers) and Thermal properties of materials (6 papers). The work is most often cited by research in Polymers and Plastics (320 citations), Electrical and Electronic Engineering (1.0k citations), Mechanical Engineering (587 citations), Materials Chemistry (305 citations) and Automotive Engineering (75 citations). Patrick McCluskey has collaborated with scholars based in United States, Denmark and Japan. Frequent co-authors include Bongtae Han, Byeng D. Youn, Hyunseok Oh, Ken Gall, Changwoon Han, Martin L. Dunn, Yiping Liu, Avram Bar‐Cohen, Peng Wang and Nicholas R. Jankowski. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electronic Packaging, IEEE Transactions on Components and Packaging Technologies and Smart Materials and Structures.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.