Siliang He
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Materials Chemistry
- Electronic, Optical and Magnetic Materials
- Aerospace Engineering
- Topics
- Electronic Packaging and Soldering Technologies (32 papers)3D IC and TSV technologies (19 papers)Aluminum Alloys Composites Properties (14 papers)
In The Last Decade
Siliang He
46 papers receiving 461 citations
Peers
Comparison fields: 5 of 38
- Electrical and Electronic Engineering 387
- Mechanical Engineering 312
- Materials Chemistry 59
- Electronic, Optical and Magnetic Materials 38
- Aerospace Engineering 31
Countries citing papers authored by Siliang He
This map shows the geographic impact of Siliang He's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Siliang He with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Siliang He more than expected).
Fields of papers citing papers by Siliang He
This network shows the impact of papers produced by Siliang He. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Siliang He. The network helps show where Siliang He may publish in the future.
Co-authorship network of co-authors of Siliang He
This figure shows the co-authorship network connecting the top 25 collaborators of Siliang He. A scholar is included among the top collaborators of Siliang He based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Siliang He. Siliang He is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 2 | |
| 3 | 1 | |
| 4 | 0 | |
| 5 | 0 | |
| 6 | 4 | |
| 7 | 2 | |
| 8 | 5 | |
| 9 | 4 | |
| 10 | 2 | |
| 11 | 13 | |
| 12 | 9 | |
| 13 | 6 | |
| 14 | 4 | |
| 15 | 1 | |
| 16 | 0 | |
| 17 | 7 | |
| 18 | 13 | |
| 19 | 20 | |
| 20 | 1 |
About Siliang He
Siliang He is a scholar working on Mechanical Engineering, Ceramics and Composites and Electrical and Electronic Engineering, having authored 52 papers that have together received 474 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (32 papers), 3D IC and TSV technologies (19 papers) and Aluminum Alloys Composites Properties (14 papers). The work is most often cited by research in Mechanical Engineering (312 citations), Electrical and Electronic Engineering (387 citations) and Ceramics and Composites (24 citations). Siliang He has collaborated with scholars based in China, Japan and Taiwan. Frequent co-authors include Hiroshi Nishikawa, Xiangdong Liu, Yu-An Shen, Runhua Gao, Jiahui Li, Shiqi Zhou, Wangyun Li, Chuan Hu, Zhiliang Pan and Y.C. Chan. Their work appears in journals such as Journal of Applied Physics, Scientific Reports and Materials Science and Engineering A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.