Gerd Schlottig
Impact in
- Mechanical Engineering top 5%
- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
- Heat Transfer Mechanisms
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Nanomaterials and Printing Technologies
Papers in
-
- Mechanical Behavior of Composites 10
- Adhesion, Friction, and Surface Interactions 7
-
- Electronic Packaging and Soldering Technologies 30
- 3D IC and TSV technologies 29
- Nanomaterials and Printing Technologies 10
- Silicon Carbide Semiconductor Technologies 7
- Co-authors
- Thomas BrunschwilerBruno MichelChander Shekhar SharmaDimos PoulikakosManish K. TiwariBernhard WunderleH. PapeSeverin Zimmermann
- Journals
- Journal of Electronic Packaging (4 papers)International Journal of Heat and Mass Transfer (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)Applied Energy (1 paper)Microelectronics Reliability (1 paper)
- Partner nations
- SwitzerlandGermanyNetherlands
In The Last Decade
Gerd Schlottig
57 papers receiving 675 citations
Peers
Comparison fields: 5 of 39
- Mechanical Engineering 356
- Electrical and Electronic Engineering 378
- Mechanics of Materials 160
- Computational Mechanics 58
- Materials Chemistry 113
Countries citing papers authored by Gerd Schlottig
This map shows the geographic impact of Gerd Schlottig's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Gerd Schlottig with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Gerd Schlottig more than expected).
Fields of papers citing papers by Gerd Schlottig
This network shows the impact of papers produced by Gerd Schlottig. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Gerd Schlottig. The network helps show where Gerd Schlottig may publish in the future.
Co-authors
The 25 scholars most cited alongside Gerd Schlottig, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2023 | 0 | |
| 2 | 2017 | 1 | |
| 3 | 2017 | 6 | |
| 4 | 2016 | 16 | |
| 5 | 2016 | 2 | |
| 6 | 2016 | 3 | |
| 7 | 2015 | 1 | |
| 8 | 2015 | 32 | |
| 9 | 2015 | 2 | |
| 10 | 2015 | 87 | |
| 11 | 2014 | 2 | |
| 12 | 2014 | 4 | |
| 13 | 2013 | 18 | |
| 14 | 2013 | 5 | |
| 15 | 2013 | 1 | |
| 16 | 2012 | 20 | |
| 17 | 2010 | 10 | |
| 18 | 2010 | 18 | |
| 19 | 2009 | 11 | |
| 20 | 2009 | 8 |
About Gerd Schlottig
Gerd Schlottig is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering, Mechanical Engineering, Automotive Engineering and Materials Chemistry, having authored 58 papers that have together received 684 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (29 papers), Nanomaterials and Printing Technologies (10 papers), Mechanical Behavior of Composites (10 papers), Heat Transfer and Optimization (8 papers), Adhesion, Friction, and Surface Interactions (7 papers), Silicon Carbide Semiconductor Technologies (7 papers) and Thermal properties of materials (6 papers). The work is most often cited by research in Mechanical Engineering (356 citations), Electrical and Electronic Engineering (378 citations), Mechanics of Materials (160 citations), Computational Mechanics (58 citations) and Materials Chemistry (113 citations). Gerd Schlottig has collaborated with scholars based in Switzerland, Germany and Netherlands. Frequent co-authors include Thomas Brunschwiler, Bruno Michel, Chander Shekhar Sharma, Dimos Poulikakos, Manish K. Tiwari, Bernhard Wunderle, H. Pape, Severin Zimmermann, L.J. Ernst and K.M.B. Jansen. Their work appears in journals such as Journal of Electronic Packaging, International Journal of Heat and Mass Transfer, IEEE Transactions on Components Packaging and Manufacturing Technology, Applied Energy and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.