Y. L. Lin

1.0k total citations
25 papers, 859 citations indexed

About

Y. L. Lin is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Y. L. Lin has authored 25 papers receiving a total of 859 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 4 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Y. L. Lin's work include Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (14 papers) and Intermetallics and Advanced Alloy Properties (5 papers). Y. L. Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (14 papers) and Intermetallics and Advanced Alloy Properties (5 papers). Y. L. Lin collaborates with scholars based in Taiwan, China and United States. Y. L. Lin's co-authors include C. R. Kao, Cheng–En Ho, Rung‐Ywan Tsai, Cheng‐Hsien Tsai, Jang‐Zern Tsai, Yuan Lin, Yi‐Shao Lai, Yu Hu, Yan‐Cheng Lin and Y. S. Lai and has published in prestigious journals such as Chemistry of Materials, Materials Science and Engineering A and Expert Systems with Applications.

In The Last Decade

Y. L. Lin

24 papers receiving 821 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Y. L. Lin Taiwan	13	770	504	162	52	42	25	859
Alessandro Giustiniani Italy	18	433 0.6×	229 0.5×	219 1.4×	22 0.4×	53 1.3×	49	869
M. Kärkkäinen Finland	16	252 0.3×	154 0.3×	76 0.5×	150 2.9×	122 2.9×	42	623
Lihua Liang China	12	114 0.1×	82 0.2×	70 0.4×	14 0.3×	6 0.1×	41	437
Xiaoqiang Wu China	15	226 0.3×	122 0.2×	23 0.1×	20 0.4×	14 0.3×	46	564
Chan Kyu Kim South Korea	12	131 0.2×	74 0.1×	58 0.4×	24 0.5×	15 0.4×	34	424
Akio Kitagawa Japan	19	566 0.7×	31 0.1×	38 0.2×	73 1.4×	60 1.4×	73	869
Dong‐Min Kim South Korea	14	281 0.4×	98 0.2×	56 0.3×	54 1.0×	3 0.1×	42	459

Countries citing papers authored by Y. L. Lin

Since Specialization

Citations

This map shows the geographic impact of Y. L. Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Y. L. Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Y. L. Lin more than expected).

Fields of papers citing papers by Y. L. Lin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Y. L. Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Y. L. Lin. The network helps show where Y. L. Lin may publish in the future.

Co-authorship network of co-authors of Y. L. Lin

This figure shows the co-authorship network connecting the top 25 collaborators of Y. L. Lin. A scholar is included among the top collaborators of Y. L. Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Y. L. Lin. Y. L. Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Lin, Y. L., et al.. (2022). The impact of animal welfare regulations on firms' product offerings: Humane or organic product?. Naval Research Logistics (NRL). 70(1). 89–104. 2 indexed citations

Kim, Dong‐Young, et al.. (2020). Customer degree centrality and supplier performance: the moderating role of resource dependence. Operations Management Research. 13(1-2). 22–38. 22 indexed citations

Lin, Y. L., et al.. (2018). A manufacturer’s responsible sourcing strategy: going organic or participating in fair trade?. Annals of Operations Research. 291(1-2). 195–218. 11 indexed citations

Tsai, Min‐Yeh, Y. L. Lin, Mong‐Hsun Tsai, Yi‐Jane Chen, & C. R. Kao. (2011). Experimental Evidence for Formation of Ni-Al Compound in Flip-Chip Joints Under Current Stressing. Journal of Electronic Materials. 40(10). 2076–2080. 1 indexed citations

Lin, Y. L., et al.. (2010). Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints. Journal of Electronic Materials. 39(12). 2528–2535. 1 indexed citations

Chang, Chia‐Ming, et al.. (2009). Efficient transfer and concentration of energy between explosive dual bubbles via time-delayed interactions. Microfluidics and Nanofluidics. 9(2-3). 329–340. 4 indexed citations

Lin, Yan‐Cheng, et al.. (2007). Tin Whisker Growth Induced by High Electron Current Density. Journal of Electronic Materials. 37(1). 17–22. 20 indexed citations

Chang, Chia‐Ming, et al.. (2007). Inkjet Printhead Arrays with No Separating Wall Between Bubbles. TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference. 14. 175–178. 2 indexed citations

Lin, Y. L., Y. S. Lai, Cheng‐Hsien Tsai, & C. R. Kao. (2006). Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration. Journal of Electronic Materials. 35(12). 2147–2153. 30 indexed citations

10.

Tsai, Cheng‐Hsien, et al.. (2006). In-situ observation of material migration in flip-chip solder joints under current stressing. Journal of Electronic Materials. 35(10). 1781–1786. 9 indexed citations

11.

Tsai, Cheng‐Hsien, Y. L. Lin, Jang‐Zern Tsai, Yi‐Shao Lai, & C. R. Kao. (2006). Local melting induced by electromigration in flip-chip solder joints. Journal of Electronic Materials. 35(5). 1005–1009. 54 indexed citations

12.

Yang, Hsu‐Hao, et al.. (2005). Applying rough sets to prevent customer complaints for IC packaging foundry. Expert Systems with Applications. 32(1). 151–156. 22 indexed citations

13.

Ho, Cheng–En, et al.. (2005). Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations. Materials Science and Engineering A. 396(1-2). 385–391. 97 indexed citations

14.

Lin, Yuan, Cheng‐Hsien Tsai, Yu Hu, Y. L. Lin, & C. R. Kao. (2005). Electromigration-induced failure in flip-chip solder joints. Journal of Electronic Materials. 34(1). 27–33. 83 indexed citations

15.

Lin, Y. L., et al.. (2004). Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints. Journal of Electronic Materials. 33(10). 1092–1097. 15 indexed citations

16.

Ho, Cheng–En, et al.. (2003). Chemical Reaction in Solder Joints of Microelectronic Packages. Journal of The Chinese Institute of Chemical Engineers. 34(4). 387–391. 7 indexed citations

17.

Lin, Y. L., Jang‐Zern Tsai, & C. R. Kao. (2003). Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages. 19. 324–329.

18.

Ho, Cheng–En, Rung‐Ywan Tsai, Y. L. Lin, & C. R. Kao. (2002). Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni. Journal of Electronic Materials. 31(6). 584–590. 281 indexed citations

19.

Ho, Cheng–En, Y. L. Lin, & C. R. Kao. (2002). Strong Effect of Cu Concentration on the Reaction between Lead-Free Microelectronic Solders and Ni. Chemistry of Materials. 14(3). 949–951. 75 indexed citations

20.

Yang, De-Nian, Wanjiun Liao, & Y. L. Lin. (2001). MQ: an integrated mechanism for multimedia multicasting. IEEE Transactions on Multimedia. 3(1). 82–97. 11 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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