Shih‐kang Lin
- Electrical and Electronic Engineering top 2%
- Mechanical Engineering top 2%
- Materials Chemistry top 10%
- Electronic, Optical and Magnetic Materials top 10%
- Automotive Engineering top 5%
- Co-authors
- Sinn-wen ChenAtsuo YamadaHiroshi NishikawaYuchen LiuPing‐Chun TsaiChe‐an LinWen-Dung HsuShiqi Zhou
- Topics
- Electronic Packaging and Soldering Technologies (53 papers)Advancements in Battery Materials (32 papers)3D IC and TSV technologies (31 papers)
- Partner nations
- TaiwanJapanUnited States
In The Last Decade
Shih‐kang Lin
108 papers receiving 2.1k citations
Peers
Comparison fields: 5 of 55
- Electrical and Electronic Engineering 1.8k
- Mechanical Engineering 941
- Materials Chemistry 434
- Electronic, Optical and Magnetic Materials 299
- Automotive Engineering 273
Countries citing papers authored by Shih‐kang Lin
This map shows the geographic impact of Shih‐kang Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Shih‐kang Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Shih‐kang Lin more than expected).
Fields of papers citing papers by Shih‐kang Lin
This network shows the impact of papers produced by Shih‐kang Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Shih‐kang Lin. The network helps show where Shih‐kang Lin may publish in the future.
Co-authorship network of co-authors of Shih‐kang Lin
This figure shows the co-authorship network connecting the top 25 collaborators of Shih‐kang Lin. A scholar is included among the top collaborators of Shih‐kang Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Shih‐kang Lin. Shih‐kang Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 1 | |
| 3 | 0 | |
| 4 | 1 | |
| 5 | 2 | |
| 6 | 2 | |
| 7 | 7 | |
| 8 | 1 | |
| 9 | 8 | |
| 10 | 1 | |
| 11 | 9 | |
| 12 | 17 | |
| 13 | 1 | |
| 14 | 2 | |
| 15 | 18 | |
| 16 | 22 | |
| 17 | 71 | |
| 18 | 21 | |
| 19 | 6 | |
| 20 | 16 |
About Shih‐kang Lin
Shih‐kang Lin is a scholar working on Electrical and Electronic Engineering, General Materials Science and Mechanical Engineering, having authored 118 papers that have together received 2.2k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (53 papers), Advancements in Battery Materials (32 papers) and 3D IC and TSV technologies (31 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.8k citations), General Materials Science (93 citations) and Mechanical Engineering (941 citations). Shih‐kang Lin has collaborated with scholars based in Taiwan, Japan and United States. Frequent co-authors include Sinn-wen Chen, Atsuo Yamada, Hiroshi Nishikawa, Yuchen Liu, Ping‐Chun Tsai, Che‐an Lin, Wen-Dung Hsu, Shiqi Zhou, Ngoc Thanh Thuy Tran and Wojciech Gierlotka. Their work appears in journals such as ACS Nano, Journal of Applied Physics and Chemistry of Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.