Hiroaki Tatsumi
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Materials Chemistry
- Electronic, Optical and Magnetic Materials
- Atmospheric Science
- Co-authors
- Akio HiroseHiroshi NishikawaEiichi IdeToshiaki MoritaTakuto YamaguchiJianhao WangC. R. KaoTomo Ogura
- Topics
- Electronic Packaging and Soldering Technologies (44 papers)3D IC and TSV technologies (28 papers)Aluminum Alloys Composites Properties (20 papers)
In The Last Decade
Hiroaki Tatsumi
44 papers receiving 435 citations
Peers
Comparison fields: 5 of 24
- Electrical and Electronic Engineering 387
- Mechanical Engineering 294
- Materials Chemistry 56
- Electronic, Optical and Magnetic Materials 42
- Atmospheric Science 21
Countries citing papers authored by Hiroaki Tatsumi
This map shows the geographic impact of Hiroaki Tatsumi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hiroaki Tatsumi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hiroaki Tatsumi more than expected).
Fields of papers citing papers by Hiroaki Tatsumi
This network shows the impact of papers produced by Hiroaki Tatsumi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hiroaki Tatsumi. The network helps show where Hiroaki Tatsumi may publish in the future.
Co-authorship network of co-authors of Hiroaki Tatsumi
This figure shows the co-authorship network connecting the top 25 collaborators of Hiroaki Tatsumi. A scholar is included among the top collaborators of Hiroaki Tatsumi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hiroaki Tatsumi. Hiroaki Tatsumi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 0 | |
| 3 | 2 | |
| 4 | 0 | |
| 5 | 1 | |
| 6 | 6 | |
| 7 | 1 | |
| 8 | 0 | |
| 9 | 2 | |
| 10 | 6 | |
| 11 | 1 | |
| 12 | 10 | |
| 13 | 14 | |
| 14 | 7 | |
| 15 | 0 | |
| 16 | 5 | |
| 17 | 3 | |
| 18 | 18 | |
| 19 | 1 | |
| 20 | 7 |
About Hiroaki Tatsumi
Hiroaki Tatsumi is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Ceramics and Composites, having authored 52 papers that have together received 452 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (44 papers), 3D IC and TSV technologies (28 papers) and Aluminum Alloys Composites Properties (20 papers). The work is most often cited by research in Mechanical Engineering (294 citations), Electrical and Electronic Engineering (387 citations) and Electronic, Optical and Magnetic Materials (42 citations). Hiroaki Tatsumi has collaborated with scholars based in Japan, Taiwan and China. Frequent co-authors include Akio Hirose, Hiroshi Nishikawa, Eiichi Ide, Toshiaki Morita, Takuto Yamaguchi, Jianhao Wang, C. R. Kao, Tomo Ogura, Hiroshi Yamaguchi and N. Takeda. Their work appears in journals such as Scientific Reports, Materials Science and Engineering A and Journal of Materials Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.