Jiaqi Wu
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- Electronic Packaging and Soldering Technologies 12
- 3D IC and TSV technologies 8
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- Conducting polymers and applications 4
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- Polyoxometalates: Synthesis and Applications 3
- Microstructure and mechanical properties 3
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- Aluminum Alloys Composites Properties 6
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- Copper Interconnects and Reliability 4
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- Chemical Synthesis and Reactions 4
- Journals
- Journal of The Electrochemical Society (1 paper)The Journal of Physical Chemistry C (1 paper)The Journal of Organic Chemistry (1 paper)
- Partner nations
- ChinaUnited StatesAustralia
In The Last Decade
Jiaqi Wu
33 papers receiving 403 citations
Peers
Comparison fields: 5 of 46
- Electrical and Electronic Engineering 274
- Polymers and Plastics 63
- Materials Chemistry 143
- Bioengineering 16
- Inorganic Chemistry 34
Countries citing papers authored by Jiaqi Wu
This map shows the geographic impact of Jiaqi Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jiaqi Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jiaqi Wu more than expected).
Fields of papers citing papers by Jiaqi Wu
This network shows the impact of papers produced by Jiaqi Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jiaqi Wu. The network helps show where Jiaqi Wu may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Jiaqi Wu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2025 | 3 | |
| 3 | 2025 | 0 | |
| 4 | 2025 | 4 | |
| 5 | 2025 | 0 | |
| 6 | 2024 | 2 | |
| 7 | 2024 | 3 | |
| 8 | 2023 | 13 | |
| 9 | 2023 | 9 | |
| 10 | 2022 | 43 | |
| 11 | 2022 | 12 | |
| 12 | 2022 | 12 | |
| 13 | 2019 | 3 | |
| 14 | 2018 | 19 | |
| 15 | 2018 | 3 | |
| 16 | 2018 | 6 | |
| 17 | 2016 | 8 | |
| 18 | 2014 | 10 | |
| 19 | 2014 | 4 | |
| 20 | 2012 | 88 |
About Jiaqi Wu
Jiaqi Wu is a scholar working on Electrical and Electronic Engineering, Polymers and Plastics and Materials Chemistry, having authored 37 papers that have together received 409 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (8 papers), Aluminum Alloys Composites Properties (6 papers), Copper Interconnects and Reliability (4 papers), Conducting polymers and applications (4 papers), Chemical Synthesis and Reactions (4 papers), Polyoxometalates: Synthesis and Applications (3 papers) and Microstructure and mechanical properties (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (274 citations), Polymers and Plastics (63 citations) and Materials Chemistry (143 citations). Jiaqi Wu has collaborated with scholars based in China, United States and Australia. Frequent co-authors include Chin C. Lee, Yongjun Huo, Jian‐Mei Lu, Li‐Xiong Shao, Fushan Li, Qian Shi, Ly Mai, Stuart Wenham, Brett Hallam and Jingjia Ji. Their work appears in journals such as Journal of The Electrochemical Society, The Journal of Physical Chemistry C and The Journal of Organic Chemistry.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.