Beth Keser
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Silicon and Solar Cell Technologies
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- Copper Interconnects and Reliability
Papers in
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- 3D IC and TSV technologies 26
- Electronic Packaging and Soldering Technologies 24
- Electromagnetic Compatibility and Noise Suppression 5
- Integrated Circuits and Semiconductor Failure Analysis 4
- Semiconductor materials and devices 3
- Semiconductor Lasers and Optical Devices 2
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- Copper Interconnects and Reliability 4
- Co-authors
- Trung Q. Duong (4 shared papers)R.J. Wenzel (4 shared papers)Christine Hau-Riege (4 shared papers)M. Philip Schwarz (5 shared papers)Sean Hayes (1 shared paper)Jong‐Kai Lin (1 shared paper)Michael J. Topper (1 shared paper)O. Ehrmann (1 shared paper)
- Journals
- Microelectronics Reliability (1 paper)IEEE Transactions on Advanced Packaging (1 paper)IMAPSource Proceedings (1 paper)Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) (1 paper)2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (1 paper)
- Partner nations
- United StatesUnited KingdomGermany
In The Last Decade
Beth Keser
27 papers receiving 281 citations
Peers
Comparison fields: 5 of 22
- Electrical and Electronic Engineering 290
- Electronic, Optical and Magnetic Materials 50
- Automotive Engineering 27
- Hardware and Architecture 10
- Mechanical Engineering 39
Countries citing papers authored by Beth Keser
This map shows the geographic impact of Beth Keser's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Beth Keser with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Beth Keser more than expected).
Fields of papers citing papers by Beth Keser
This network shows the impact of papers produced by Beth Keser. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Beth Keser. The network helps show where Beth Keser may publish in the future.
Co-authors
The 15 scholars most cited alongside Beth Keser, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 27 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 83 | |
| 2 | 2008 | 33 | |
| 3 | 2000 | 30 | |
| 4 | 2002 | 20 | |
| 5 | 2003 | 16 | |
| 6 | 2011 | 14 | |
| 7 | 2013 | 12 | |
| 8 | 2008 | 11 | |
| 9 | 2004 | 11 | |
| 10 | 2011 | 10 | |
| 11 | 2014 | 8 | |
| 12 | 2013 | 8 | |
| 13 | 2003 | 7 | |
| 14 | 2014 | 6 | |
| 15 | 2015 | 6 | |
| 16 | 2019 | 5 | |
| 17 | Design and reliability of a new WL-CSP | 2002 | 3 |
| 18 | 2017 | 3 | |
| 19 | 2015 | 3 | |
| 20 | 2011 | 3 |
About Beth Keser
Beth Keser is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Automotive Engineering and General Health Professions, having authored 27 papers that have together received 304 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (24 papers), Electromagnetic Compatibility and Noise Suppression (5 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), Copper Interconnects and Reliability (4 papers), Semiconductor materials and devices (3 papers), Semiconductor Lasers and Optical Devices (2 papers) and Additive Manufacturing and 3D Printing Technologies (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (290 citations), Electronic, Optical and Magnetic Materials (50 citations), Automotive Engineering (27 citations), Hardware and Architecture (10 citations) and Mechanical Engineering (39 citations). Beth Keser has collaborated with scholars based in United States, United Kingdom and Germany. Frequent co-authors include Trung Q. Duong, R.J. Wenzel, Christine Hau-Riege, M. Philip Schwarz, Sean Hayes, Jong‐Kai Lin, Michael J. Topper, O. Ehrmann, H. Reichl and Ahmer Syed. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Advanced Packaging, IMAPSource Proceedings, Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) and 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.