Sean Hayes

1.3k total citations
14 papers, 292 citations indexed

About

Sean Hayes is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Sean Hayes has authored 14 papers receiving a total of 292 indexed citations (citations by other indexed papers that have themselves been cited), including 6 papers in Mechanical Engineering, 4 papers in Electrical and Electronic Engineering and 3 papers in Materials Chemistry. Recurrent topics in Sean Hayes's work include Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (4 papers) and Advanced Welding Techniques Analysis (3 papers). Sean Hayes is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (4 papers) and Advanced Welding Techniques Analysis (3 papers). Sean Hayes collaborates with scholars based in United States, Netherlands and France. Sean Hayes's co-authors include D. R. Frear, Nikhilesh Chawla, J.D. Strachan, H. W. Hendel, R. L. Boivin, S. J. Zweben, M. Diesso, Myriam Witvrouw, Jin‐Wook Jang and Jong‐Kai Lin and has published in prestigious journals such as ACS Nano, Surface and Coatings Technology and Journal of Chemical Information and Modeling.

In The Last Decade

Sean Hayes

13 papers receiving 280 citations

Peers

Sean Hayes

EEE

NHEP

Tong Yang China

Yoshihiro Ohara Japan

M. É. Pinchuk Russia

R. Uhlemann Germany

K.A. Thompson United States

M. Ohta Japan

N. Smale Germany

Helmut Huegel Germany

N. Allen United States

Tong Yang China

Sean Hayes

140 ×0.9

EEE

44 ×0.5

102 ×1.4

NHEP

32 ×0.7

43 ×1.0

Citations per year, relative to Sean Hayes Sean Hayes (= 1×) peers Tong Yang

Countries citing papers authored by Sean Hayes

Since Specialization

Citations

This map shows the geographic impact of Sean Hayes's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sean Hayes with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sean Hayes more than expected).

Fields of papers citing papers by Sean Hayes

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Sean Hayes. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sean Hayes. The network helps show where Sean Hayes may publish in the future.

Co-authorship network of co-authors of Sean Hayes

This figure shows the co-authorship network connecting the top 25 collaborators of Sean Hayes. A scholar is included among the top collaborators of Sean Hayes based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sean Hayes. Sean Hayes is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

14 of 14 papers shown

Tiwari, Akash, et al.. (2024). Detecting anomalous motions in ultraprecision shell-polishing process combining unsupervised spectral-band identification and Explainable-AI. Journal of Manufacturing Systems. 75. 278–287. 1 indexed citations

Tiwari, Akash, Sean Hayes, Monika M. Biener, et al.. (2024). Precision Polishing of Ablator Capsules via in situ Process Monitoring and Machine Learning–Based Optimization. Fusion Science & Technology. 81(3). 219–231.

Forien, Jean‐Baptiste, et al.. (2023). Magnetron sputter deposition of ultrathick boron carbide coatings on spherical substrates for inertial confinement fusion. Surface and Coatings Technology. 477. 130321–130321. 7 indexed citations

Bukkapatnam, Satish, et al.. (2023). Vibration Signal-Assisted Endpoint Detection for Long-Stretch, Ultraprecision Polishing Processes. Journal of Manufacturing Science and Engineering. 145(6). 6 indexed citations

Meshot, Eric R., Alexander A. Baker, Daniel R. Malone, et al.. (2023). High-Resolution X-ray Spectromicroscopy Reveals Process-Structure Correlations in sub-5-μm Diameter Carbon Nanotube-Polymer Composite Dry-Spun Yarns. ACS Nano. 17(11). 10589–10597. 3 indexed citations

Smit, Mathijs G.D., et al.. (2023). Effectively scaling assessment efforts in the evaluation of environmental risks of offshore produced water discharges using a tiered approach. Environmental Impact Assessment Review. 104. 107350–107350. 1 indexed citations

Smit, Mathijs G.D., et al.. (2020). New Produced Water Risk Based Approach Guidance. 2 indexed citations

Queffelec, Clémence, Fabrice Bailly, Gladys Mbemba, et al.. (2008). Synthesis and antiviral properties of some polyphenols related to Salvia genus. Bioorganic & Medicinal Chemistry Letters. 18(16). 4736–4740. 25 indexed citations

Duong, Trung Q., et al.. (2008). Advanced Packaging: The Redistributed Chip Package. IEEE Transactions on Advanced Packaging. 31(1). 39–43. 33 indexed citations

10.

Hayes, Sean, Nikhilesh Chawla, & D. R. Frear. (2008). Interfacial fracture toughness of Pb-free solders. Microelectronics Reliability. 49(3). 269–287. 74 indexed citations

11.

Tintori, Cristina, Fabrizio Manetti, Nevena Veljković, et al.. (2007). Novel Virtual Screening Protocol Based on the Combined Use of Molecular Modeling and Electron-Ion Interaction Potential Techniques To Design HIV-1 Integrase Inhibitors. Journal of Chemical Information and Modeling. 47(4). 1536–1544. 19 indexed citations

12.

Lin, Jong‐Kai, Jin‐Wook Jang, Sean Hayes, & D. R. Frear. (2004). Lead-free flip chip interconnect reliability for DCA and FC-PBGA packages. 643. 642–649. 6 indexed citations

13.

Lin, Jong‐Kai, et al.. (2002). Characterization of lead-free solders and under bump metallurgies for flip-chip package. IEEE Transactions on Electronics Packaging Manufacturing. 25(4). 300–307. 36 indexed citations

14.

Zweben, S. J., R. L. Boivin, M. Diesso, et al.. (1990). Loss of alpha-like MeV fusion products from TFTR. Nuclear Fusion. 30(8). 1551–1574. 79 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact