Sung‐Hoon Choa

2.7k total citations
118 papers, 2.2k citations indexed

About

Sung‐Hoon Choa is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Polymers and Plastics. According to data from OpenAlex, Sung‐Hoon Choa has authored 118 papers receiving a total of 2.2k indexed citations (citations by other indexed papers that have themselves been cited), including 96 papers in Electrical and Electronic Engineering, 55 papers in Biomedical Engineering and 20 papers in Polymers and Plastics. Recurrent topics in Sung‐Hoon Choa's work include Advanced Sensor and Energy Harvesting Materials (35 papers), 3D IC and TSV technologies (30 papers) and Electronic Packaging and Soldering Technologies (26 papers). Sung‐Hoon Choa is often cited by papers focused on Advanced Sensor and Energy Harvesting Materials (35 papers), 3D IC and TSV technologies (30 papers) and Electronic Packaging and Soldering Technologies (26 papers). Sung‐Hoon Choa collaborates with scholars based in South Korea, United States and Vietnam. Sung‐Hoon Choa's co-authors include Kyoungtae Eun, Han‐Ki Kim, Seok‐In Na, Da-Young Cho, Jong‐Kuk Kim, Jinwon Joo, Daesung Lee, Won Jae Lee, Dongsik Kim and Sunghoon Lee and has published in prestigious journals such as Advanced Materials, Nano Letters and Journal of Applied Physics.

In The Last Decade

Sung‐Hoon Choa

109 papers receiving 2.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Sung‐Hoon Choa South Korea 27 1.6k 1.2k 498 489 216 118 2.2k
Siya Huang China 21 1.0k 0.6× 1.5k 1.3× 655 1.3× 420 0.9× 125 0.6× 41 2.2k
Toan Dinh Australia 34 1.9k 1.2× 2.2k 1.9× 628 1.3× 805 1.6× 330 1.5× 158 3.5k
Shinill Kang South Korea 25 1.2k 0.8× 1.2k 1.0× 306 0.6× 464 0.9× 172 0.8× 110 2.3k
Dongwoo Kang South Korea 25 1.9k 1.2× 856 0.7× 295 0.6× 1.1k 2.3× 169 0.8× 81 3.3k
Joseph B. Geddes United States 11 959 0.6× 1.2k 1.1× 346 0.7× 308 0.6× 253 1.2× 29 1.9k
Fabien Sorin Switzerland 31 1.8k 1.1× 1.9k 1.6× 567 1.1× 518 1.1× 378 1.8× 81 3.4k
Chengming Jiang China 28 1.1k 0.7× 906 0.8× 490 1.0× 846 1.7× 107 0.5× 118 2.2k
Zheren Cai China 24 1.2k 0.8× 996 0.9× 735 1.5× 620 1.3× 79 0.4× 54 3.1k
Yizhu Xie China 15 903 0.6× 1.0k 0.9× 394 0.8× 563 1.2× 111 0.5× 38 2.0k
Jong Soo Ko South Korea 29 987 0.6× 1.1k 1.0× 210 0.4× 446 0.9× 235 1.1× 112 2.1k

Countries citing papers authored by Sung‐Hoon Choa

Since Specialization
Citations

This map shows the geographic impact of Sung‐Hoon Choa's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sung‐Hoon Choa with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sung‐Hoon Choa more than expected).

Fields of papers citing papers by Sung‐Hoon Choa

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Sung‐Hoon Choa. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sung‐Hoon Choa. The network helps show where Sung‐Hoon Choa may publish in the future.

Co-authorship network of co-authors of Sung‐Hoon Choa

This figure shows the co-authorship network connecting the top 25 collaborators of Sung‐Hoon Choa. A scholar is included among the top collaborators of Sung‐Hoon Choa based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sung‐Hoon Choa. Sung‐Hoon Choa is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Park, Se-Hoon, et al.. (2024). Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor Applications. Materials. 17(21). 5142–5142. 1 indexed citations
2.
Kim, Taehyun, et al.. (2024). Wafer-level Packaging Platform for MEMS Sensor Applications. 238–239.
3.
Le, Xuan-Bach D., Jiho Joo, Gwang‐Mun Choi, et al.. (2023). Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding. Micromachines. 14(3). 601–601. 11 indexed citations
4.
Choa, Sung‐Hoon, et al.. (2022). Enhancement of the Bond Strength and Reduction of Wafer Edge Voids in Hybrid Bonding. Micromachines. 13(4). 537–537. 18 indexed citations
5.
Kim, Dasom, Jiyeah Rhie, Parinda Vasa, et al.. (2021). Topology-Changing Broadband Metamaterials Enabled by Closable Nanotrenches. Nano Letters. 21(10). 4202–4208. 26 indexed citations
6.
Kim, Yoon Jin, et al.. (2021). Enhanced Conductivity in Highly Stretchable Silver and Polymer Nanocomposite Conductors. Journal of Nanoscience and Nanotechnology. 21(6). 3218–3226. 2 indexed citations
7.
Cho, Youngmin & Sung‐Hoon Choa. (2020). Experimental and Numerical Analysis of Microvia Reliability for SLP (Substrate Like PCB). Journal of the Microelectronics and Packaging Society. 27(1). 45–54. 1 indexed citations
8.
Choa, Sung‐Hoon, et al.. (2020). Graphene Oxide Coated Silver Nanofiber Transparent Conducting Electrode. Korean Journal of Metals and Materials. 58(9). 626–632. 5 indexed citations
9.
Kim, Kyoung‐Ho & Sung‐Hoon Choa. (2019). Recent Overview on Power Semiconductor Devices and Package Module Technology. Journal of the Microelectronics and Packaging Society. 26(3). 15–22. 4 indexed citations
10.
Lee, Won Jae, et al.. (2018). Mechanical and Optical Characteristics of Transparent Stretchable Hybrid Substrate using PDMS and Ecoflex Material. Journal of the Microelectronics and Packaging Society. 25(4). 129–135. 3 indexed citations
11.
Choa, Sung‐Hoon, et al.. (2018). Effects of Encapsulation Layer on Center Crack and Fracture of Thin Silicon Chip using Numerical Analysis. Journal of the Microelectronics and Packaging Society. 25(1). 1–10. 1 indexed citations
12.
Lee, Jung H., et al.. (2017). Numerical Analysis of Warpage Induced by Thermo-Compression Bonding Process of Cu Pillar Bump Flip Chip Package. Transactions of the Korean Society of Mechanical Engineers A. 41(6). 443–453. 1 indexed citations
13.
Choa, Sung‐Hoon, et al.. (2017). Recent Trends of MEMS Packaging and Bonding Technology. Journal of the Microelectronics and Packaging Society. 24(4). 9–17. 1 indexed citations
14.
Choa, Sung‐Hoon, et al.. (2015). Lower Protrusion of a Copper-Nickel Alloy in a Through-Silicon via and Its Numerical Simulation. MATERIALS TRANSACTIONS. 56(12). 2034–2041. 9 indexed citations
15.
Choa, Sung‐Hoon, et al.. (2013). Reliability of flexible transparent electrode under high-temperature environments. 609–610. 1 indexed citations
16.
Choa, Sung‐Hoon, et al.. (2013). Electromechanical properties of graphene transparent conducting films for flexible electronics. Current Applied Physics. 13(7). 1331–1334. 25 indexed citations
17.
Jung, Sunghoon, Kyounga Lim, Jae‐Wook Kang, et al.. (2013). Electromechanical properties of indium–tin–oxide/poly(3,4-ethylenedioxythiophene): Poly(styrenesulfonate) hybrid electrodes for flexible transparent electrodes. Thin Solid Films. 550. 435–443. 17 indexed citations
18.
19.
Choa, Sung‐Hoon, et al.. (2010). Numerical Study of Warpage and Stress for the Ultra Thin Package. Journal of the Microelectronics and Packaging Society. 17(4). 49–60. 4 indexed citations
20.
Choa, Sung‐Hoon, et al.. (2005). A high yield rate MEMS gyroscope with a packaged SiOG process. Journal of Micromechanics and Microengineering. 15(11). 2003–2010. 41 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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