Yanhong Tian
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- Electronic Packaging and Soldering Technologies 138
- 3D IC and TSV technologies 89
- Nanomaterials and Printing Technologies 42
- Mechanical Engineering top 1%
- Advanced Welding Techniques Analysis 44
- Aluminum Alloys Composites Properties 26
- Intermetallics and Advanced Alloy Properties 21
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- Copper Interconnects and Reliability 17
- Polymers and Plastics top 5%
- Biomedical Engineering top 2%
- Advanced Sensor and Energy Harvesting Materials 33
- Cited by
- Electrical and Electronic EngineeringMechanical EngineeringElectronic, Optical and Magnetic Materials
- Journals
- Advanced Materials (3 papers)SHILAP Revista de lepidopterología (1 paper)ACS Nano (2 papers)
In The Last Decade
Yanhong Tian
262 papers receiving 4.5k citations
Hit Papers
Peers
Comparison fields: 5 of 104
- Electrical and Electronic Engineering 3.4k
- Mechanical Engineering 1.8k
- Electronic, Optical and Magnetic Materials 638
- Polymers and Plastics 441
- Biomedical Engineering 1.1k
Countries citing papers authored by Yanhong Tian
This map shows the geographic impact of Yanhong Tian's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yanhong Tian with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yanhong Tian more than expected).
Fields of papers citing papers by Yanhong Tian
This network shows the impact of papers produced by Yanhong Tian. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yanhong Tian. The network helps show where Yanhong Tian may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Yanhong Tian, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 2 | |
| 2 | 2025 | 1 | |
| 3 | 2024 | 1 | |
| 4 | 2024 | 12 | |
| 5 | 2024 | 10 | |
| 6 | 2024 | 1 | |
| 7 | 2024 | 1 | |
| 8 | 2024 | 14 | |
| 9 | 2023 | 4 | |
| 10 | 2023 | 1 | |
| 11 | 2023 | 5 | |
| 12 | 2023 | 44 | |
| 13 | 2023 | 10 | |
| 14 | 2023 | 32 | |
| 15 | 2022 | 34 | |
| 16 | 2021 | 3 | |
| 17 | 2019 | 18 | |
| 18 | Volume effect on shear strength of SnAgCu lead-free solder joints | 2011 | 3 |
| 19 | Contrast Research on the Reliability of Gold and Copper Wire/Ball Bonding | 2006 | 1 |
| 20 | PREDICTION ON RESPONSE TO THE THERMAL FATIGUE OF THROUGH-HOLE SOLDER JOINT I. Experimental Research of Solder Joint Response to the Thermal Fatigue | 2003 | 1 |
About Yanhong Tian
Yanhong Tian is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials, having authored 277 papers that have together received 4.6k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (138 papers), 3D IC and TSV technologies (89 papers), Advanced Welding Techniques Analysis (44 papers), Nanomaterials and Printing Technologies (42 papers), Advanced Sensor and Energy Harvesting Materials (33 papers), Aluminum Alloys Composites Properties (26 papers), Intermetallics and Advanced Alloy Properties (21 papers) and Copper Interconnects and Reliability (17 papers). The work is most often cited by research in Electrical and Electronic Engineering (3.4k citations), Mechanical Engineering (1.8k citations) and Electronic, Optical and Magnetic Materials (638 citations). Yanhong Tian has collaborated with scholars based in China, Spain and Canada. Frequent co-authors include Chunqing Wang, Chenxi Wang, Shang Wang, Jiayun Feng, Chunjin Hang, Y. Zhou, He Zhang, Ruyu Tian, Rong An and Yilong Huang. Their work appears in journals such as Advanced Materials, SHILAP Revista de lepidopterología and ACS Nano.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.