Chunqing Wang

5.9k total citations
290 papers, 4.0k citations indexed

About

Chunqing Wang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Chunqing Wang has authored 290 papers receiving a total of 4.0k indexed citations (citations by other indexed papers that have themselves been cited), including 217 papers in Electrical and Electronic Engineering, 133 papers in Mechanical Engineering and 46 papers in Materials Chemistry. Recurrent topics in Chunqing Wang's work include Electronic Packaging and Soldering Technologies (177 papers), 3D IC and TSV technologies (101 papers) and Advanced Welding Techniques Analysis (52 papers). Chunqing Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (177 papers), 3D IC and TSV technologies (101 papers) and Advanced Welding Techniques Analysis (52 papers). Chunqing Wang collaborates with scholars based in China, United States and South Korea. Chunqing Wang's co-authors include Yanhong Tian, Mingyu Li, Rong An, Hongjun Ji, Y. Zhou, Wei Liu, Sheng Chen, M. Mayer, C.J. Hang and Chunjin Hang and has published in prestigious journals such as Applied Physics Letters, Journal of Power Sources and Journal of The Electrochemical Society.

In The Last Decade

Chunqing Wang

270 papers receiving 3.9k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chunqing Wang China 34 2.9k 1.9k 718 419 388 290 4.0k
Ashutosh Sharma South Korea 35 2.0k 0.7× 2.0k 1.0× 1.1k 1.6× 228 0.5× 826 2.1× 168 4.0k
Yi Tan China 32 1.2k 0.4× 2.1k 1.1× 1.2k 1.7× 251 0.6× 657 1.7× 239 3.6k
Beibei Jiang China 37 1.9k 0.7× 1.5k 0.8× 1.8k 2.5× 802 1.9× 675 1.7× 158 5.3k
Xue Liu China 32 2.0k 0.7× 1.9k 1.0× 1.3k 1.8× 453 1.1× 865 2.2× 149 4.6k
Junming Li China 34 2.0k 0.7× 811 0.4× 1.3k 1.8× 436 1.0× 153 0.4× 162 3.5k
Yang Peng China 37 1.7k 0.6× 854 0.4× 1.7k 2.4× 261 0.6× 288 0.7× 188 3.8k
Yang Liu China 24 1.4k 0.5× 1.0k 0.5× 458 0.6× 233 0.6× 121 0.3× 225 2.4k
Weiwei Zhang China 35 1.4k 0.5× 831 0.4× 1.7k 2.4× 406 1.0× 249 0.6× 163 3.5k
Jinling Liu China 36 1.3k 0.5× 1.6k 0.8× 1.8k 2.5× 217 0.5× 403 1.0× 167 4.0k
Jing Hu China 30 813 0.3× 1.2k 0.6× 1.4k 1.9× 377 0.9× 322 0.8× 197 2.9k

Countries citing papers authored by Chunqing Wang

Since Specialization
Citations

This map shows the geographic impact of Chunqing Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chunqing Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chunqing Wang more than expected).

Fields of papers citing papers by Chunqing Wang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chunqing Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chunqing Wang. The network helps show where Chunqing Wang may publish in the future.

Co-authorship network of co-authors of Chunqing Wang

This figure shows the co-authorship network connecting the top 25 collaborators of Chunqing Wang. A scholar is included among the top collaborators of Chunqing Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chunqing Wang. Chunqing Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Li, Heng, Liang-Liang Zhang, Chunqing Wang, et al.. (2025). Interpretation and Comprehensive Evaluation of Regional Water–Land–Energy Coupling System Carrying Capacity. Sustainability. 17(4). 1669–1669. 4 indexed citations
3.
Wang, Chunqing, Liangliang Zhang, Nan Sun, et al.. (2025). Optimizing spatial food crops planting structure under water-energy-food-carbon emissions nexus constraints. Agricultural Water Management. 317. 109666–109666. 1 indexed citations
4.
Xu, Dan, Chunqing Wang, Haipeng Wang, et al.. (2025). Quantitative characterization of resilience and analysis of driving mechanisms in the water-energy-food nexus system of major grain-producing regions. Journal of Hydrology. 663. 134201–134201.
5.
Wang, Chunqing, Kexin Wang, Dong Liu, et al.. (2024). Development and application of a comprehensive assessment method of regional flood disaster risk based on a refined random forest model using beluga whale optimization. Journal of Hydrology. 633. 130963–130963. 18 indexed citations
6.
Liu, Wei, et al.. (2023). Twistable and tailorable Cu-doped SnO2@PANI textile for wearable ammonia sensing. Applied Surface Science. 630. 157529–157529. 16 indexed citations
7.
Chew, Bee Teng, et al.. (2023). Emergency heater based on gas-fired catalytic combustion infrared technology: Structure, evaluation and thermal response. Energy. 274. 127426–127426. 5 indexed citations
8.
9.
Wang, Chunqing, et al.. (2022). Thermal environment and thermal comfort in metro systems: A case study in severe cold region of China. Building and Environment. 227. 109758–109758. 26 indexed citations
10.
Sun, Siyu, Qiang Guo, Hongtao Chen, Mingyu Li, & Chunqing Wang. (2017). Solderless bonding with nanoporous copper as interlayer for high-temperature applications. Microelectronics Reliability. 80. 198–204. 11 indexed citations
11.
Chen, Hongtao, et al.. (2017). Study of electroless Sn-coated Cu microparticles and their application as a high temperature thermal interface material. Surface and Coatings Technology. 319. 230–240. 15 indexed citations
12.
13.
Li, Mingyu, et al.. (2009). Irregular Characteristics of Bond Interface Formation in Ultrasonic Wire Wedge Bonding. Journal of Material Science and Technology. 22(4). 483–486. 2 indexed citations
14.
Li, Mingyu & Chunqing Wang. (2009). Simulative Design of Pad Structure for High Density Electronic Interconnection. Journal of Material Science and Technology. 21(1). 63–67. 2 indexed citations
15.
Chen, Hongtao, et al.. (2009). Influence of Thermal Cycling on the Microstructure and Shear Strength of Sn3.5Ag0.75Cu and Sn63Pb37 Solder Joints on Au/Ni Metallization. Journal of Material Science and Technology. 23(1). 68–72. 3 indexed citations
16.
Chen, Hongtao, et al.. (2009). Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability. Journal of Material Science and Technology. 21(3). 419–422. 3 indexed citations
17.
Wang, Chunqing. (2007). Thermal Analysis and Design of High-power White LED Package. 2 indexed citations
18.
Wang, Chunqing. (2006). Overview on Two Types of Ceramic Array Package and Their Solder Joint Reliability. 3 indexed citations
19.
Wang, Chunqing, et al.. (2005). Low temperature bonding of LD31 aluminum alloys by electric brush plating Ni and Cu coatings. 中国焊接：英文版. 14(1). 24–28. 1 indexed citations
20.
Wang, Chunqing, et al.. (1997). An exPerimental study of effect of solder joint geometry on thermal cycle life in SMT. 中国焊接：英文版. 70–76.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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