Chunqing Wang
- Electrical and Electronic Engineering top 1%
- Mechanical Engineering top 0.5%
- Materials Chemistry top 10%
- Electronic, Optical and Magnetic Materials top 5%
- Aerospace Engineering top 5%
- Co-authors
- Yanhong TianMingyu LiRong AnHongjun JiY. ZhouWei LiuSheng ChenM. Mayer
- Topics
- Electronic Packaging and Soldering Technologies (177 papers)3D IC and TSV technologies (101 papers)Advanced Welding Techniques Analysis (52 papers)
- Partner nations
- ChinaUnited StatesSouth Korea
In The Last Decade
Chunqing Wang
270 papers receiving 3.9k citations
Peers
Comparison fields: 5 of 137
- Electrical and Electronic Engineering 2.9k
- Mechanical Engineering 1.9k
- Materials Chemistry 718
- Electronic, Optical and Magnetic Materials 419
- Aerospace Engineering 388
Countries citing papers authored by Chunqing Wang
This map shows the geographic impact of Chunqing Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chunqing Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chunqing Wang more than expected).
Fields of papers citing papers by Chunqing Wang
This network shows the impact of papers produced by Chunqing Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chunqing Wang. The network helps show where Chunqing Wang may publish in the future.
Co-authorship network of co-authors of Chunqing Wang
This figure shows the co-authorship network connecting the top 25 collaborators of Chunqing Wang. A scholar is included among the top collaborators of Chunqing Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chunqing Wang. Chunqing Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 4 | |
| 3 | 1 | |
| 4 | 0 | |
| 5 | 18 | |
| 6 | 16 | |
| 7 | 5 | |
| 8 | 7 | |
| 9 | 26 | |
| 10 | 11 | |
| 11 | 15 | |
| 12 | 36 | |
| 13 | Irregular Characteristics of Bond Interface Formation in Ultrasonic Wire Wedge Bonding | 2 |
| 14 | Simulative Design of Pad Structure for High Density Electronic Interconnection | 2 |
| 15 | Influence of Thermal Cycling on the Microstructure and Shear Strength of Sn3.5Ag0.75Cu and Sn63Pb37 Solder Joints on Au/Ni Metallization | 3 |
| 16 | Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability | 3 |
| 17 | Thermal Analysis and Design of High-power White LED Package | 2 |
| 18 | Overview on Two Types of Ceramic Array Package and Their Solder Joint Reliability | 3 |
| 19 | Low temperature bonding of LD31 aluminum alloys by electric brush plating Ni and Cu coatings | 1 |
| 20 | An exPerimental study of effect of solder joint geometry on thermal cycle life in SMT | 0 |
About Chunqing Wang
Chunqing Wang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials, having authored 290 papers that have together received 4.0k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (177 papers), 3D IC and TSV technologies (101 papers) and Advanced Welding Techniques Analysis (52 papers). The work is most often cited by research in Mechanical Engineering (1.9k citations), Electrical and Electronic Engineering (2.9k citations) and General Materials Science (91 citations). Chunqing Wang has collaborated with scholars based in China, United States and South Korea. Frequent co-authors include Yanhong Tian, Mingyu Li, Rong An, Hongjun Ji, Y. Zhou, Wei Liu, Sheng Chen, M. Mayer, C.J. Hang and Chunjin Hang. Their work appears in journals such as Applied Physics Letters, Journal of Power Sources and Journal of The Electrochemical Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.