Shijo Nagao

6.1k total citations
191 papers, 5.0k citations indexed

About

Shijo Nagao is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Shijo Nagao has authored 191 papers receiving a total of 5.0k indexed citations (citations by other indexed papers that have themselves been cited), including 152 papers in Electrical and Electronic Engineering, 60 papers in Mechanical Engineering and 39 papers in Materials Chemistry. Recurrent topics in Shijo Nagao's work include Electronic Packaging and Soldering Technologies (92 papers), 3D IC and TSV technologies (54 papers) and Aluminum Alloys Composites Properties (32 papers). Shijo Nagao is often cited by papers focused on Electronic Packaging and Soldering Technologies (92 papers), 3D IC and TSV technologies (54 papers) and Aluminum Alloys Composites Properties (32 papers). Shijo Nagao collaborates with scholars based in Japan, China and Norway. Shijo Nagao's co-authors include Katsuaki Suganuma, Tohru Sugahara, Jinting Jiu, Chuantong Chen, Masaya Nogi, Hirotaka Koga, Hao Zhang, Hiroshi Uchida, Teppei Araki and Roman Nowak and has published in prestigious journals such as Journal of the American Chemical Society, Nano Letters and Applied Physics Letters.

In The Last Decade

Shijo Nagao

189 papers receiving 5.0k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Shijo Nagao Japan 43 3.5k 1.5k 1.5k 1.2k 617 191 5.0k
Guisheng Zou China 39 2.6k 0.8× 1.7k 1.1× 2.2k 1.4× 1.0k 0.8× 579 0.9× 188 5.4k
Kyung‐Wook Paik South Korea 32 2.6k 0.7× 1.4k 0.9× 1.3k 0.9× 1.5k 1.2× 455 0.7× 304 4.7k
Yanhong Tian China 39 3.4k 1.0× 1.1k 0.7× 1.8k 1.2× 795 0.6× 638 1.0× 277 4.6k
Seung Min Han South Korea 35 2.3k 0.7× 2.2k 1.5× 1.3k 0.9× 2.1k 1.7× 1.6k 2.5× 96 5.6k
Young‐Chang Joo South Korea 43 4.1k 1.2× 1.7k 1.1× 865 0.6× 2.1k 1.7× 1.4k 2.2× 240 6.3k
Tohru Sugahara Japan 39 3.4k 1.0× 2.0k 1.3× 979 0.6× 1.5k 1.2× 679 1.1× 131 4.8k
Jiecai Han China 42 2.4k 0.7× 1.0k 0.7× 939 0.6× 1.7k 1.3× 1.8k 2.9× 129 5.4k
Seung‐Boo Jung South Korea 47 5.8k 1.6× 781 0.5× 6.4k 4.2× 1.3k 1.1× 528 0.9× 439 9.4k
Woon‐Ha Yoon South Korea 38 1.6k 0.5× 2.0k 1.3× 1.2k 0.8× 2.4k 1.9× 1.1k 1.9× 142 4.4k
Matt Pharr United States 31 3.8k 1.1× 1.8k 1.2× 827 0.5× 919 0.7× 666 1.1× 89 5.7k

Countries citing papers authored by Shijo Nagao

Since Specialization
Citations

This map shows the geographic impact of Shijo Nagao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Shijo Nagao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Shijo Nagao more than expected).

Fields of papers citing papers by Shijo Nagao

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Shijo Nagao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Shijo Nagao. The network helps show where Shijo Nagao may publish in the future.

Co-authorship network of co-authors of Shijo Nagao

This figure shows the co-authorship network connecting the top 25 collaborators of Shijo Nagao. A scholar is included among the top collaborators of Shijo Nagao based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Shijo Nagao. Shijo Nagao is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Choe, Chanyang, Chuantong Chen, Shijo Nagao, & Katsuaki Suganuma. (2020). Real-Time Acoustic Emission Monitoring of Wear-Out Failure in SiC Power Electronic Devices During Power Cycling Tests. IEEE Transactions on Power Electronics. 36(4). 4420–4428. 27 indexed citations
2.
Chen, Chuantong, et al.. (2019). Thermal conductivity and interface thermal resistance evaluation of DBC/DBA in power die attach modules. 1–5. 2 indexed citations
3.
Chen, Chuantong, et al.. (2019). Highly Reliable Package using Cu Particles Sinter Paste for Next Generation Power Devices. VBN Forskningsportal (Aalborg Universitet). 1–4. 3 indexed citations
4.
Wang, Jun, Jinting Jiu, Shuye Zhang, et al.. (2018). The comprehensive effects of visible light irradiation on silver nanowire transparent electrode. Nanotechnology. 29(43). 435701–435701. 33 indexed citations
5.
Gao, Li‐Yin, Zhi‐Quan Liu, Hao Zhang, et al.. (2018). Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate. Journal of Material Science and Technology. 34(10). 1885–1890. 50 indexed citations
6.
Zhou, Tianle, Wei Hao, Huaping Tan, et al.. (2018). Strongly anisotropic thermal conductivity and adequate breathability of bilayered films for heat management of on-skin electronics. 2D Materials. 5(3). 35013–35013. 15 indexed citations
7.
He, Jianying, Jianyang Wu, Shijo Nagao, Lijie Qiao, & Zhiliang Zhang. (2017). Size-dependent Phase Transformation and Fracture of ZnO Nanowires. Procedia IUTAM. 21. 86–93. 2 indexed citations
8.
Sugiura, Kazuhiko, Tomohito Iwashige, Jun Kawai, et al.. (2017). Prominent interface structure and bonding material of power module for high temperature operation. 491–494. 6 indexed citations
9.
Lin, Shih‐kang, Shijo Nagao, Chulmin Oh, et al.. (2016). Nano-volcanic Eruption of Silver. Scientific Reports. 6(1). 34769–34769. 71 indexed citations
10.
Suganuma, Katsuaki, et al.. (2016). Silver sinter joining and stress migration bonding for WBG die-attach. 1–17. 3 indexed citations
11.
Zhang, Hao, et al.. (2015). Reliability Improvement of high Temperature sintered Ag Die-Attachment by adding Sub-micron SiC Particles. 1–8. 5 indexed citations
12.
Jiu, Jinting, Hao Zhang, Shijo Nagao, et al.. (2015). Die-attaching silver paste based on a novel solvent for high-power semiconductor devices. Journal of Materials Science. 51(7). 3422–3430. 68 indexed citations
13.
Yamanaka, Kimihiro, et al.. (2015). Solder electromigration behavior in Cu/electroless Ni–P plating/Sn–Cu based joint system at low current densities. IMAPSource Proceedings. 2015(1). 141–146. 2 indexed citations
14.
Ogawa, Satoru, et al.. (2015). Ultra thermal stability of LED die-attach achieved by pressureless Ag stress-migration bonding at low temperature. Acta Materialia. 89. 133–140. 45 indexed citations
15.
Oh, Chulmin, Shijo Nagao, & Katsuaki Suganuma. (2014). Pressureless Bonding Using Sputtered Ag Thin Films. Journal of Electronic Materials. 43(12). 4406–4412. 15 indexed citations
16.
17.
Zhao, Junhua, Shijo Nagao, & Z.L. Zhang. (2012). Loading and unloading of a spherical contact: From elastic to elastic–perfectly plastic materials. International Journal of Mechanical Sciences. 56(1). 70–76. 35 indexed citations
18.
Nowak, Roman, D. Chrobak, Shijo Nagao, et al.. (2009). An electric current spike linked to nanoscale plasticity. Nature Nanotechnology. 4(5). 287–291. 59 indexed citations
19.
Ohbayashi, S., Satoshi Takano, Keiko Anami, et al.. (1991). A 7 ns 1 Mb BiCMOS ECL SRAM with shift redundancy. IEEE Journal of Solid-State Circuits. 26(4). 507–512. 13 indexed citations
20.
Nagao, Shijo, et al.. (1986). Application of selective silicon epitaxial growth for CMOS technology. IEEE Transactions on Electron Devices. 33(11). 1738–1744. 13 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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