Meiyu Wang

2.0k total citations · 1 hit paper
48 papers, 1.7k citations indexed

About

Meiyu Wang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering. According to data from OpenAlex, Meiyu Wang has authored 48 papers receiving a total of 1.7k indexed citations (citations by other indexed papers that have themselves been cited), including 38 papers in Electrical and Electronic Engineering, 10 papers in Electronic, Optical and Magnetic Materials and 8 papers in Mechanical Engineering. Recurrent topics in Meiyu Wang's work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (11 papers) and Silicon Carbide Semiconductor Technologies (11 papers). Meiyu Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (11 papers) and Silicon Carbide Semiconductor Technologies (11 papers). Meiyu Wang collaborates with scholars based in China, United States and United Kingdom. Meiyu Wang's co-authors include Alexei Gruverman, Jinsong Huang, Yuchuan Shao, Yehao Deng, Yanjun Fang, Qi Wang, Tao Li, Qingfeng Dong, Yongbo Yuan and Haotong Wei and has published in prestigious journals such as Angewandte Chemie International Edition, SHILAP Revista de lepidopterología and Energy & Environmental Science.

In The Last Decade

Meiyu Wang

44 papers receiving 1.7k citations

Hit Papers

Grain boundary dominated ion migration in polycrystalline... 2016 2026 2019 2022 2016 250 500 750 1000
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Grain boundary dominated ion migration in polycrystalline organic–inorganic halide perovskite films
    2016 1.0k citations Meiyu Wang et al. profile →

Peers

Meiyu Wang
Tatsuya Iwasaki Japan
Martin Becker Germany
Guangbao Wu China
Kan Ding United States
Andreas Gerber Germany
Pengfei Zhai China
Toru Nakamura Japan
Xiaoqiang Li China
Hezhang Li China
Zhou Yang China
Tatsuya Iwasaki Japan
Meiyu Wang
Citations per year, relative to Meiyu Wang Meiyu Wang (= 1×) peers Tatsuya Iwasaki

Countries citing papers authored by Meiyu Wang

Since Specialization
Citations

This map shows the geographic impact of Meiyu Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Meiyu Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Meiyu Wang more than expected).

Fields of papers citing papers by Meiyu Wang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Meiyu Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Meiyu Wang. The network helps show where Meiyu Wang may publish in the future.

Co-authorship network of co-authors of Meiyu Wang

This figure shows the co-authorship network connecting the top 25 collaborators of Meiyu Wang. A scholar is included among the top collaborators of Meiyu Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Meiyu Wang. Meiyu Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wang, Meiyu, et al.. (2025). Single longitudinal mode Nd:YVO4 laser with mode selection based on pre-laser Q-switching and dual Fabry-Perot etalons. Infrared Physics & Technology. 148. 105883–105883.
2.
Hu, Weibo, et al.. (2024). A hybrid SAR ADC with input range extension. Microelectronics Journal. 150. 106259–106259.
3.
Wang, Meiyu, Peng Gao, F.G. Shi, et al.. (2024). Advanced Packaging Technology of GaN HEMT Module for High-Power and High-Frequency Applications: A Review. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(9). 1537–1550. 3 indexed citations
4.
Yang, Dayi, Jingxiao Liu, Fei Shi, et al.. (2023). One-step solvothermal synthesis of CsxWO3: Crystal growth regulation by halogen acids with generating oxygen vacancies and W5+ for improving transparent thermal insulation performance. Journal of Alloys and Compounds. 942. 169119–169119. 12 indexed citations
5.
Kan, Ankang, et al.. (2023). Research Status and Development Trend of Thermal Insulation Envelope Materials for Marine Reefer Containers. ES Energy & Environments. 6 indexed citations
6.
Tan, Yansong, et al.. (2022). Feasibility Investigation and Characterization of Liquid Dispersant–Assisted Sintering of Silver to Bond Large‐Area Plates. Advanced Engineering Materials. 25(10). 3 indexed citations
7.
Wang, Meiyu, Yunhui Mei, Weibo Hu, Xin Li, & Guo‐Quan Lu. (2022). Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science. IEEE Journal of Emerging and Selected Topics in Power Electronics. 10(2). 2645–2655. 29 indexed citations
8.
Mei, Yunhui, et al.. (2022). Large-Area Bonding by Sintering of a Resin-Free Nanosilver Paste at Ultralow Temperature of 180 °C. IEEE Transactions on Components Packaging and Manufacturing Technology. 12(4). 707–710. 16 indexed citations
9.
Mei, Yunhui, Meiyu Wang, Xin Li, et al.. (2021). Ratcheting Behavior of Sintered Copper Joints for Electronic Packaging. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(6). 983–989. 3 indexed citations
10.
Wang, Meiyu, et al.. (2021). Pressureless Sintered-Silver Die-Attach at 180 °C for Power Electronics Packaging. IEEE Transactions on Power Electronics. 36(11). 12141–12145. 41 indexed citations
11.
Mei, Yunhui, et al.. (2020). A Way to Reduce Leakage Current and Improve Reliability of Wire-Bonds for 300-A Multichip SiC Hybrid Modules. IEEE Journal of Emerging and Selected Topics in Power Electronics. 9(4). 4887–4896. 3 indexed citations
12.
Liu, Qi, Weiwei Liu, Meiyu Wang, et al.. (2019). Understanding the role of aluminium in determining the surface structure and electrochemical performance of layered cathodes. Nanoscale. 11(27). 13007–13016. 5 indexed citations
13.
Wang, Meiyu, Yunhui Mei, Wen Liu, et al.. (2019). Reliability Improvement of a Double-Sided IGBT Module by Lowering Stress Gradient Using Molybdenum Buffers. IEEE Journal of Emerging and Selected Topics in Power Electronics. 7(3). 1637–1648. 54 indexed citations
14.
DiMarino, Christina, Bassem Mouawad, C. Mark Johnson, et al.. (2019). Design and Experimental Validation of a Wire-Bond-Less 10-kV SiC MOSFET Power Module. IEEE Journal of Emerging and Selected Topics in Power Electronics. 8(1). 381–394. 65 indexed citations
15.
Wang, Meiyu, Yunhui Mei, Xin Li, et al.. (2019). Pressureless Silver Sintering on Nickel for Power Module Packaging. IEEE Transactions on Power Electronics. 34(8). 7121–7125. 31 indexed citations
16.
Wang, Meiyu, Yunhui Mei, Xin Li, & Guo‐Quan Lu. (2019). Die-attach on nickel substrate by pressureless sintering a trimodal silver paste. Materials Letters. 253. 131–135. 18 indexed citations
17.
Wang, Meiyu, et al.. (2019). A Method for Improving the Thermal Shock Fatigue Failure Resistance of IGBT Modules. IEEE Transactions on Power Electronics. 35(8). 8532–8539. 20 indexed citations
18.
Liu, Wen, Yunhui Mei, Yijing Xie, et al.. (2019). Design and Characterizations of a Planar Multichip Half-Bridge Power Module by Pressureless Sintering of Nanosilver Paste. IEEE Journal of Emerging and Selected Topics in Power Electronics. 7(3). 1627–1636. 18 indexed citations
19.
Wang, Meiyu, Yunhui Mei, Xin Li, et al.. (2018). How to determine surface roughness of copper substrate for robust pressureless sintered silver in air. Materials Letters. 228. 327–330. 29 indexed citations
20.
Wang, Xiaomin, Yunhui Mei, Xin Li, et al.. (2018). Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications. Journal of Alloys and Compounds. 777. 578–585. 45 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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