Yilong Huang

977 total citations
29 papers, 834 citations indexed

About

Yilong Huang is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, Yilong Huang has authored 29 papers receiving a total of 834 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Electrical and Electronic Engineering, 13 papers in Biomedical Engineering and 11 papers in Mechanical Engineering. Recurrent topics in Yilong Huang's work include Electronic Packaging and Soldering Technologies (11 papers), Nanomaterials and Printing Technologies (10 papers) and Advanced Sensor and Energy Harvesting Materials (10 papers). Yilong Huang is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Nanomaterials and Printing Technologies (10 papers) and Advanced Sensor and Energy Harvesting Materials (10 papers). Yilong Huang collaborates with scholars based in China, United States and Australia. Yilong Huang's co-authors include Yanhong Tian, Shang Wang, He Zhang, Chunjin Hang, Chenxi Wang, Cheng–En Ho, Jiayue Wen, Wei Wu, Yubin Liu and Qian Cui and has published in prestigious journals such as Advanced Materials, Chemical Engineering Journal and ACS Applied Materials & Interfaces.

In The Last Decade

Yilong Huang

29 papers receiving 821 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yilong Huang China 16 671 390 198 181 179 29 834
Yun Hwangbo South Korea 13 371 0.6× 436 1.1× 113 0.6× 207 1.1× 386 2.2× 23 812
Jae-Boong Choi South Korea 11 324 0.5× 401 1.0× 131 0.7× 91 0.5× 351 2.0× 19 741
Marco Bobinger Germany 16 443 0.7× 503 1.3× 62 0.3× 131 0.7× 257 1.4× 35 759
Jongkuk Ko South Korea 12 278 0.4× 254 0.7× 122 0.6× 170 0.9× 219 1.2× 24 613
Meiying Su China 16 570 0.8× 238 0.6× 128 0.6× 89 0.5× 165 0.9× 47 761
Shuhong Nie China 12 629 0.9× 479 1.2× 56 0.3× 276 1.5× 262 1.5× 27 869
Maxime Harnois France 16 368 0.5× 343 0.9× 101 0.5× 72 0.4× 138 0.8× 35 764
Myoung‐Sub Noh South Korea 12 299 0.4× 349 0.9× 152 0.8× 135 0.7× 187 1.0× 16 577
Jarkko Puustinen Finland 14 336 0.5× 224 0.6× 158 0.8× 117 0.6× 275 1.5× 34 688
Sejeong Won South Korea 15 345 0.5× 422 1.1× 109 0.6× 149 0.8× 327 1.8× 21 734

Countries citing papers authored by Yilong Huang

Since Specialization
Citations

This map shows the geographic impact of Yilong Huang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yilong Huang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yilong Huang more than expected).

Fields of papers citing papers by Yilong Huang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yilong Huang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yilong Huang. The network helps show where Yilong Huang may publish in the future.

Co-authorship network of co-authors of Yilong Huang

This figure shows the co-authorship network connecting the top 25 collaborators of Yilong Huang. A scholar is included among the top collaborators of Yilong Huang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yilong Huang. Yilong Huang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wang, Junwu, et al.. (2024). Application trends and strategies of hydrogel delivery systems in intervertebral disc degeneration: A bibliometric review. Materials Today Bio. 28. 101251–101251. 5 indexed citations
2.
Tang, Kai, Guiping Lin, Yuandong Guo, et al.. (2024). Startup categories of manifold microchannel heat sink heated by thermal test chip. International Journal of Heat and Mass Transfer. 232. 125949–125949. 8 indexed citations
3.
He, Yuan, Yilong Huang, Yue Xi, et al.. (2024). A 3.75Mb Embedded RRAM IP on 40nm High-Voltage CMOS Technology. 1–4. 4 indexed citations
4.
Yang, Dongsheng & Yilong Huang. (2023). Interfacial intermetallic compound modification to extend the electromigration lifetime of copper pillar joints. Frontiers in Materials. 9. 1 indexed citations
5.
Wang, Yiping, Dong-Sheng Yang, Peng Wu, et al.. (2023). Study on low temperature sintering mechanism and performance of multiscale silver paste. 1–4. 1 indexed citations
6.
Yang, Dong-Sheng, et al.. (2021). Microstructure of Ag Nano Paste Joint and Its Influence on Reliability. Crystals. 11(12). 1537–1537. 11 indexed citations
7.
Tian, Ruyu, et al.. (2021). Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock. Journal of Materials Science Materials in Electronics. 32(6). 6890–6899. 26 indexed citations
8.
Zhang, He, Shang Wang, Yanhong Tian, et al.. (2020). Electrodeposition fabrication of Cu@Ni core shell nanowire network for highly stable transparent conductive films. Chemical Engineering Journal. 390. 124495–124495. 50 indexed citations
9.
Zhang, He, Yanhong Tian, Shang Wang, et al.. (2020). Highly stable flexible transparent electrode via rapid electrodeposition coating of Ag-Au alloy on copper nanowires for bifunctional electrochromic and supercapacitor device. Chemical Engineering Journal. 399. 125075–125075. 73 indexed citations
10.
Wang, Shang, et al.. (2019). Chemical and thermal robust tri-layer rGO/Ag NWs/GO composite film for wearable heaters. Composites Science and Technology. 174. 76–83. 32 indexed citations
11.
Zhang, He, Shang Wang, Yanhong Tian, et al.. (2019). High-efficiency extraction synthesis for high-purity copper nanowires and their applications in flexible transparent electrodes. Nano Materials Science. 2(2). 164–171. 33 indexed citations
12.
Huang, Yilong, Yanhong Tian, Chunjin Hang, et al.. (2019). Self-Limited Nanosoldering of Silver Nanowires for High-Performance Flexible Transparent Heaters. ACS Applied Materials & Interfaces. 11(24). 21850–21858. 49 indexed citations
13.
Huang, Yilong, Yanhong Tian, & Shang Wang. (2017). Green synthesis of well-dispersed single-layer graphene colloids via an electrolytic method. Materials Research Express. 4(3). 35602–35602. 4 indexed citations
14.
Huang, Yilong, Ziyang Xiu, Gaohui Wu, et al.. (2016). Improving shear strength of Sn-3.0Ag-0.5Cu/Cu joints and suppressing intermetallic compounds layer growth by adding graphene nanosheets. Materials Letters. 169. 262–264. 42 indexed citations
15.
Wang, Shang, Yanhong Tian, Su Ding, & Yilong Huang. (2016). Rapid synthesis of long silver nanowires by controlling concentration of Cu2+ ions. Materials Letters. 172. 175–178. 38 indexed citations
16.
Huang, Yilong, Ziyang Xiu, Gaohui Wu, Yanhong Tian, & Peng He. (2016). Sn–3.0Ag–0.5Cu nanocomposite solders reinforced by graphene nanosheets. Journal of Materials Science Materials in Electronics. 27(7). 6809–6815. 35 indexed citations
17.
Li, Yujie, Xiaofu Tang, Jin Li, et al.. (2013). Cu nanoparticles of low polydispersity synthesized by a double-template method and their stability. Colloid & Polymer Science. 292(3). 715–722. 20 indexed citations
18.
Wu, Wei, et al.. (2009). Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni(P) tri-layer structure. Journal of Alloys and Compounds. 493(1-2). 431–437. 75 indexed citations
19.
Chen, Hongtao, Chunqing Wang, Cheng Yan, Yilong Huang, & Yanhong Tian. (2006). Effects of Solder Volume on Formation and Redeposition of Au-Containing Intermetallics in Ni/Au-SnAgCu-Ni(P) Solder Joints. Journal of Electronic Materials. 36(1). 33–39. 8 indexed citations
20.
Chen, Hongtao, Chunqing Wang, Cheng Yan, Mingyu Li, & Yilong Huang. (2006). Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging. Journal of Electronic Materials. 36(1). 26–32. 15 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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