Ruyu Tian

729 total citations
30 papers, 563 citations indexed

About

Ruyu Tian is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Aerospace Engineering. According to data from OpenAlex, Ruyu Tian has authored 30 papers receiving a total of 563 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Mechanical Engineering, 21 papers in Electrical and Electronic Engineering and 4 papers in Aerospace Engineering. Recurrent topics in Ruyu Tian's work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (13 papers) and Intermetallics and Advanced Alloy Properties (10 papers). Ruyu Tian is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (13 papers) and Intermetallics and Advanced Alloy Properties (10 papers). Ruyu Tian collaborates with scholars based in China, Japan and Hong Kong. Ruyu Tian's co-authors include Yanhong Tian, Chunjin Hang, Liyou Zhao, Jiayun Feng, Chenxi Wang, Hongbo Xia, Jikai Xu, Wentai Ouyang, Junke Jiao and Liyuan Sheng and has published in prestigious journals such as Materials Science and Engineering A, Journal of Alloys and Compounds and Journal of Materials Processing Technology.

In The Last Decade

Ruyu Tian

30 papers receiving 551 citations

Peers

Ruyu Tian

EEE

Yong Han Singapore

Barbara Horváth Hungary

Choong-Jae Lee South Korea

Katia Vutova Bulgaria

Hideaki Tsukamoto Japan

Jun Cao China

Wenxian Wang China

K.-J. Wolter Germany

Jianbin Wang China

Xiaoyang Bi China

Yong Han Singapore

Ruyu Tian

473 ×1.3

377 ×1.0

EEE

259 ×3.5

39 ×0.6

61 ×1.0

Citations per year, relative to Ruyu Tian Ruyu Tian (= 1×) peers Yong Han

Countries citing papers authored by Ruyu Tian

Since Specialization

Citations

This map shows the geographic impact of Ruyu Tian's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ruyu Tian with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ruyu Tian more than expected).

Fields of papers citing papers by Ruyu Tian

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ruyu Tian. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ruyu Tian. The network helps show where Ruyu Tian may publish in the future.

Co-authorship network of co-authors of Ruyu Tian

This figure shows the co-authorship network connecting the top 25 collaborators of Ruyu Tian. A scholar is included among the top collaborators of Ruyu Tian based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ruyu Tian. Ruyu Tian is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Feng, Jiayun, Shuai Wang, Wei Wang, et al.. (2025). Thermal-electrical coupling effect on the reliability of copper pillar bump joints with different initial IMC thickness and microstructure. Journal of Manufacturing Processes. 139. 182–192. 2 indexed citations

Wang, Shuai, Ruyu Tian, Jiayue Wen, et al.. (2024). SnPbInBiSb high-entropy solder joints with inhibited interfacial IMC growth and high shear strength. Intermetallics. 176. 108551–108551. 5 indexed citations

Yan, Feng, Yuqing Yao, Yuhang Han, et al.. (2024). Role of Hetero‐Doped Reduced Graphene Oxide in Suppressing Elemental Dissolution in Manganese Selenide Cathode for Aqueous Zinc‐Ion Batteries. ChemSusChem. 18(8). e202402101–e202402101. 11 indexed citations

Tian, Ruyu, et al.. (2024). Improved shear property of Sn-3.0Ag-0.5Cu/Ni micro solder joints under thermal shock between 77 K and 423 K by adding TiO2 nanoparticles. Journal of Materials Research and Technology. 29. 5034–5047. 10 indexed citations

Wang, Wei, Shuai Wang, Jiayun Feng, et al.. (2024). Size Effect of IMC Growth in Liquid-Solid Reflow Reaction at SAC305/Cu Interface. 1–5. 1 indexed citations

Tian, Ruyu, Shuai Chen, Jiawei Wu, et al.. (2023). Elemental diffusion, atomic substitution mechanisms and interfacial fracture behavior in laser welded–brazed Al/Ti. Materials Characterization. 202. 112998–112998. 15 indexed citations

Guo, Xiaotong, Hao He, Hui Xiao, et al.. (2023). Microstructural Evolution and Deterioration of Shear Properties of Sn3.0Ag0.5Cu/Cu Solder Joints after Long-Term Storage at Cryogenic Temperatures. Crystals. 13(4). 586–586. 6 indexed citations

Chen, Shuai, Ruyu Tian, Jiayue Wen, & Yanhong Tian. (2023). Reliability improvement of SnAgCu interconnections under extreme temperature condition by TiO2 nanoparticles doping: Experiments and first principles calculations. Materials Characterization. 207. 113492–113492. 8 indexed citations

Pan, Yue, Kun Tong, Ruyu Tian, Limei Sun, & Yang Chen. (2023). Advanced Anode Materials Based on Iron Oxides for Lithium-Ion Batteries. NANO. 18(6). 6 indexed citations

10.

Tian, Ruyu, Shuai Chen, Jiayun Feng, et al.. (2023). Mechanical properties degradation of Sn 37Pb solder joints caused by interfacial microstructure evolution under cryogenic temperature storage. Materials Characterization. 201. 112979–112979. 4 indexed citations

11.

Guo, Xiaotong, et al.. (2022). Ductile-brittle transition during tensile tests of the general solder alloys at cryogenic temperatures. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). 1–5. 3 indexed citations

12.

Cai, Yangchuan, Yan Cui, Lisong Zhu, et al.. (2021). Enhancing the (FeMnCrNiCo + TiC) cladding layer by in-situ laser remelting. Surface Engineering. 37(12). 1496–1502. 12 indexed citations

13.

Ouyang, Wentai, Junke Jiao, Hongbo Xia, et al.. (2021). Experimental study on CFRP drilling with the picosecond laser “double rotation” cutting technique. Optics & Laser Technology. 142. 107238–107238. 57 indexed citations

14.

Tian, Ruyu, et al.. (2021). Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock. Journal of Materials Science Materials in Electronics. 32(6). 6890–6899. 26 indexed citations

15.

Tian, Ruyu, Chunjin Hang, Yanhong Tian, & Jikai Xu. (2019). Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes. Journal of Materials Processing Technology. 268. 1–9. 38 indexed citations

16.

Tian, Ruyu, et al.. (2019). Interfacial intermetallic compound growth in Sn-3Ag-0.5Cu/Cu solder joints induced by stress gradient at cryogenic temperatures. Journal of Alloys and Compounds. 800. 180–190. 27 indexed citations

17.

Tian, Ruyu, Chunjin Hang, Yanhong Tian, & Jiayun Feng. (2018). Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment. Journal of Alloys and Compounds. 777. 463–471. 48 indexed citations

18.

Hang, Chunjin, Ruyu Tian, Liyou Zhao, & Yanhong Tian. (2018). Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock. Applied Sciences. 8(11). 2056–2056. 13 indexed citations

19.

Tian, Ruyu, Yanhong Tian, & Chenxi Wang. (2016). Influence of low temperature on tensile properties and fracture behavior of Sn3Ag0.5Cu solder alloy. 116–118. 1 indexed citations

20.

Ding, Ying, Ruyu Tian, Xiu‐Li Wang, et al.. (2015). Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints. Microelectronics Reliability. 55(11). 2396–2402. 22 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact