Kim S. Siow
- Electrical and Electronic Engineering top 2%
- Mechanical Engineering top 2%
- Materials Chemistry top 10%
- Biomedical Engineering top 5%
- Surfaces, Coatings and Films top 0.5%
- Co-authors
- Hans J. GriesserSaravana KumarLeanne BritcherXu LongYutai SuBurhanuddin Yeop MajlisM. F. Mohd Razip WeeChuantong Chen
- Topics
- Electronic Packaging and Soldering Technologies (30 papers)3D IC and TSV technologies (17 papers)Surface Modification and Superhydrophobicity (12 papers)
In The Last Decade
Kim S. Siow
82 papers receiving 3.1k citations
Hit Papers
Peers
Comparison fields: 5 of 130
- Electrical and Electronic Engineering 1.6k
- Mechanical Engineering 1.1k
- Materials Chemistry 659
- Biomedical Engineering 630
- Surfaces, Coatings and Films 601
Countries citing papers authored by Kim S. Siow
This map shows the geographic impact of Kim S. Siow's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kim S. Siow with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kim S. Siow more than expected).
Fields of papers citing papers by Kim S. Siow
This network shows the impact of papers produced by Kim S. Siow. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kim S. Siow. The network helps show where Kim S. Siow may publish in the future.
Co-authorship network of co-authors of Kim S. Siow
This figure shows the co-authorship network connecting the top 25 collaborators of Kim S. Siow. A scholar is included among the top collaborators of Kim S. Siow based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kim S. Siow. Kim S. Siow is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 28 | |
| 3 | 8 | |
| 4 | 8 | |
| 5 | 21 | |
| 6 | 5 | |
| 7 | 10 | |
| 8 | 8 | |
| 9 | 14 | |
| 10 | 10 | |
| 11 | 4 | |
| 12 | 3 | |
| 13 | 16 | |
| 14 | 25 | |
| 15 | 15 | |
| 16 | 16 | |
| 17 | 23 | |
| 18 | 46 | |
| 19 | 17 | |
| 20 | 53 |
About Kim S. Siow
Kim S. Siow is a scholar working on Surfaces, Coatings and Films, Electrical and Electronic Engineering and Bioengineering, having authored 86 papers that have together received 3.2k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (17 papers) and Surface Modification and Superhydrophobicity (12 papers). The work is most often cited by research in Surfaces, Coatings and Films (601 citations), Mechanical Engineering (1.1k citations) and Electrical and Electronic Engineering (1.6k citations). Kim S. Siow has collaborated with scholars based in Malaysia, China and Singapore. Frequent co-authors include Hans J. Griesser, Saravana Kumar, Leanne Britcher, Xu Long, Yutai Su, Burhanuddin Yeop Majlis, M. F. Mohd Razip Wee, Chuantong Chen, Naeem Ahmed and Pei Yuen Ng. Their work appears in journals such as Scientific Reports, Materials Science and Engineering A and Journal of Physics D Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.