Jiayun Feng

1.6k total citations
60 papers, 1.2k citations indexed

About

Jiayun Feng is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Jiayun Feng has authored 60 papers receiving a total of 1.2k indexed citations (citations by other indexed papers that have themselves been cited), including 42 papers in Electrical and Electronic Engineering, 25 papers in Mechanical Engineering and 20 papers in Biomedical Engineering. Recurrent topics in Jiayun Feng's work include Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (16 papers) and Advanced Sensor and Energy Harvesting Materials (16 papers). Jiayun Feng is often cited by papers focused on Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (16 papers) and Advanced Sensor and Energy Harvesting Materials (16 papers). Jiayun Feng collaborates with scholars based in China, Canada and Hong Kong. Jiayun Feng's co-authors include Yanhong Tian, Y. Zhou, Ming Xiao, W. W. Duley, Daozhi Shen, Guisheng Zou, Peng Peng, Lei Liu, Shang Wang and Chenxi Wang and has published in prestigious journals such as Advanced Materials, Journal of Applied Physics and Advanced Functional Materials.

In The Last Decade

Jiayun Feng

53 papers receiving 1.2k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jiayun Feng China 19 712 464 440 260 172 60 1.2k
Zhiling Luo China 16 362 0.5× 323 0.7× 439 1.0× 259 1.0× 165 1.0× 42 1.1k
Heng Xie China 22 214 0.3× 301 0.6× 389 0.9× 319 1.2× 136 0.8× 62 1.3k
Dongyue Jiang China 21 476 0.7× 590 1.3× 478 1.1× 246 0.9× 201 1.2× 50 1.3k
Hao Zhu China 24 611 0.9× 635 1.4× 616 1.4× 109 0.4× 225 1.3× 125 1.7k
Qingchang Liu United States 16 279 0.4× 270 0.6× 730 1.7× 415 1.6× 391 2.3× 36 1.5k
Daozhi Shen China 21 917 1.3× 268 0.6× 858 1.9× 532 2.0× 211 1.2× 58 1.6k
Denzel Bridges United States 16 470 0.7× 191 0.4× 487 1.1× 116 0.4× 154 0.9× 29 1.1k
Yulin Liu China 20 718 1.0× 312 0.7× 330 0.8× 104 0.4× 153 0.9× 83 1.4k
Tae Hyun Sung South Korea 25 992 1.4× 1.1k 2.3× 1.0k 2.3× 137 0.5× 243 1.4× 116 2.0k

Countries citing papers authored by Jiayun Feng

Since Specialization
Citations

This map shows the geographic impact of Jiayun Feng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jiayun Feng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jiayun Feng more than expected).

Fields of papers citing papers by Jiayun Feng

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jiayun Feng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jiayun Feng. The network helps show where Jiayun Feng may publish in the future.

Co-authorship network of co-authors of Jiayun Feng

This figure shows the co-authorship network connecting the top 25 collaborators of Jiayun Feng. A scholar is included among the top collaborators of Jiayun Feng based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jiayun Feng. Jiayun Feng is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wu, Peng, Jiayun Feng, Yiping Wang, et al.. (2025). Growth kinetics of sintering neck and particle rotation mechanism of silver nanoparticles by molecular dynamics simulation and in-situ TEM observation. Journal of Materials Research and Technology. 35. 2253–2262. 2 indexed citations
2.
Feng, Jiayun, Shuai Wang, Wei Wang, et al.. (2025). Thermal-electrical coupling effect on the reliability of copper pillar bump joints with different initial IMC thickness and microstructure. Journal of Manufacturing Processes. 139. 182–192. 2 indexed citations
3.
Wang, Shang, et al.. (2025). Anchoring sulfur migration to mitigate Kirkendall voids in nano-twinned copper interconnections for robust and reliable packaging. Journal of Material Science and Technology. 230. 106–119. 1 indexed citations
4.
Feng, Jiayun, Zhiyuan Wang, Shujun Wang, et al.. (2025). Femtosecond Laser Irradiation Induced Heterojunctions Between Graphene Oxide and Silver Nanowires. Materials. 18(14). 3393–3393.
5.
Yu, Cheng, et al.. (2025). Ultra‐Sensitive and High‐Resolution Flexible Iontronic Humidity Sensor for Detecting Subtle Moisture Differences. Advanced Functional Materials. 36(12). 1 indexed citations
6.
Li, Zhuolin, et al.. (2025). Direct bonding of AZ31B and ZrO2 induced by interfacial sono-oxidation reaction at a low temperature. Journal of Magnesium and Alloys. 13(9). 4316–4326. 1 indexed citations
7.
Wang, Shang, et al.. (2024). The role of oxygen in the growth of silver nanowires using the polyol method. Materials Letters. 376. 137290–137290. 1 indexed citations
8.
Wen, Jiayue, Shang Wang, Jiayun Feng, et al.. (2024). Recent progress in polyaniline-based chemiresistive flexible gas sensors: design, nanostructures, and composite materials. Journal of Materials Chemistry A. 12(11). 6190–6210. 61 indexed citations
9.
Wang, Shuai, Ruyu Tian, Jiayue Wen, et al.. (2024). SnPbInBiSb high-entropy solder joints with inhibited interfacial IMC growth and high shear strength. Intermetallics. 176. 108551–108551. 5 indexed citations
10.
Wang, Shang, et al.. (2024). Solder joint shape optimization and thermal-mechanical reliability improvement for microwave RF coaxial connectors. Microelectronics Reliability. 154. 115345–115345. 1 indexed citations
11.
Wang, Shuai, Jiayun Feng, Wang We, et al.. (2024). Growth kinetics of interfacial intermetallic compounds formed in SnPbInBiSb high entropy alloy soldered joints on Cu substrates. Transactions of Nonferrous Metals Society of China. 34(11). 3650–3661. 1 indexed citations
12.
Feng, Jiayun, Jiayue Wen, Shang Wang, et al.. (2024). Graphene Oxide-Based Planar Hygroelectric Generator and Its Applications in a Flexible Self-Powered Sensing System. ACS Applied Nano Materials. 7(2). 1646–1654. 7 indexed citations
13.
Wang, Shang, et al.. (2023). Study on Cu6Sn5 morphology and grain orientation transition at the interface of (111) nt-Cu and liquid Sn. Journal of Materials Research and Technology. 26. 9112–9126. 10 indexed citations
14.
Zhang, He, Jiayun Feng, Ge Cao, et al.. (2023). Self‐Driven Ni‐Based Electrochromic Devices for Energy‐Efficient Smart Windows. Advanced Materials Technologies. 8(8). 22 indexed citations
15.
Wu, Wenyu, Shang Wang, Yiping Wang, et al.. (2023). Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices. Coatings. 13(4). 748–748. 1 indexed citations
16.
Ma, Jingxuan, Jiayun Feng, He Zhang, et al.. (2023). Electrohydrodynamic Printing of Ultrafine and Highly Conductive Ag Electrodes for Various Flexible Electronics. Advanced Materials Technologies. 8(16). 15 indexed citations
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19.
Tian, Ruyu, Chunjin Hang, Yanhong Tian, & Jiayun Feng. (2018). Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment. Journal of Alloys and Compounds. 777. 463–471. 48 indexed citations
20.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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