Jiayun Feng
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 5%
- Biomedical Engineering top 10%
- Renewable Energy, Sustainability and the Environment top 10%
- Polymers and Plastics top 10%
- Topics
- Electronic Packaging and Soldering Technologies (22 papers)3D IC and TSV technologies (16 papers)Advanced Sensor and Energy Harvesting Materials (16 papers)
In The Last Decade
Jiayun Feng
53 papers receiving 1.2k citations
Peers
Comparison fields: 5 of 62
- Electrical and Electronic Engineering 712
- Mechanical Engineering 464
- Biomedical Engineering 440
- Renewable Energy, Sustainability and the Environment 260
- Polymers and Plastics 172
Countries citing papers authored by Jiayun Feng
This map shows the geographic impact of Jiayun Feng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jiayun Feng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jiayun Feng more than expected).
Fields of papers citing papers by Jiayun Feng
This network shows the impact of papers produced by Jiayun Feng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jiayun Feng. The network helps show where Jiayun Feng may publish in the future.
Co-authorship network of co-authors of Jiayun Feng
This figure shows the co-authorship network connecting the top 25 collaborators of Jiayun Feng. A scholar is included among the top collaborators of Jiayun Feng based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jiayun Feng. Jiayun Feng is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 2 | |
| 3 | 1 | |
| 4 | 0 | |
| 5 | 1 | |
| 6 | 1 | |
| 7 | 1 | |
| 8 | 1 | |
| 9 | 61 | |
| 10 | 5 | |
| 11 | 11 | |
| 12 | 1 | |
| 13 | 10 | |
| 14 | 22 | |
| 15 | 1 | |
| 16 | 15 | |
| 17 | 22 | |
| 18 | 43 | |
| 19 | 38 | |
| 20 | 31 |
About Jiayun Feng
Jiayun Feng is a scholar working on Ceramics and Composites, Electrical and Electronic Engineering and Mechanical Engineering, having authored 60 papers that have together received 1.2k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (16 papers) and Advanced Sensor and Energy Harvesting Materials (16 papers). The work is most often cited by research in Renewable Energy, Sustainability and the Environment (260 citations), Mechanical Engineering (464 citations) and Electrical and Electronic Engineering (712 citations). Jiayun Feng has collaborated with scholars based in China, Canada and Hong Kong. Frequent co-authors include Yanhong Tian, Y. Zhou, Ming Xiao, W. W. Duley, Daozhi Shen, Guisheng Zou, Peng Peng, Lei Liu, Shang Wang and Chenxi Wang. Their work appears in journals such as Advanced Materials, Journal of Applied Physics and Advanced Functional Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.