D. F. Lim

779 total citations
30 papers, 631 citations indexed

About

D. F. Lim is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Automotive Engineering. According to data from OpenAlex, D. F. Lim has authored 30 papers receiving a total of 631 indexed citations (citations by other indexed papers that have themselves been cited), including 30 papers in Electrical and Electronic Engineering, 11 papers in Electronic, Optical and Magnetic Materials and 9 papers in Automotive Engineering. Recurrent topics in D. F. Lim's work include 3D IC and TSV technologies (28 papers), Electronic Packaging and Soldering Technologies (23 papers) and Copper Interconnects and Reliability (11 papers). D. F. Lim is often cited by papers focused on 3D IC and TSV technologies (28 papers), Electronic Packaging and Soldering Technologies (23 papers) and Copper Interconnects and Reliability (11 papers). D. F. Lim collaborates with scholars based in Singapore, United States and China. D. F. Lim's co-authors include Chuan Seng Tan, Ji Fan, Mikael Bergkvist, Lan Peng, Shiv Govind Singh, Jun Wei, Kam W. Leong, X. F. Ang, Shan Gao and Hong Yu Li and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and IEEE Transactions on Electron Devices.

In The Last Decade

D. F. Lim

30 papers receiving 613 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
D. F. Lim Singapore 16 606 204 147 63 55 30 631
Pierric Gueguen France 11 355 0.6× 96 0.5× 80 0.5× 58 0.9× 30 0.5× 20 390
X. F. Ang Singapore 10 316 0.5× 81 0.4× 53 0.4× 62 1.0× 42 0.8× 18 341
Cheng-Ta Ko Taiwan 4 339 0.6× 71 0.3× 88 0.6× 57 0.9× 67 1.2× 10 355
Jiaxiu Han China 8 288 0.5× 45 0.2× 158 1.1× 31 0.5× 40 0.7× 9 382
Jang‐Hi Im United States 9 419 0.7× 74 0.4× 49 0.3× 106 1.7× 32 0.6× 16 448
Jeong‐Tak Moon South Korea 13 542 0.9× 126 0.6× 113 0.8× 17 0.3× 186 3.4× 28 577
Krishna Nama Manjunatha United Kingdom 10 298 0.5× 52 0.3× 127 0.9× 58 0.9× 36 0.7× 20 369
Andreas Netz Germany 7 457 0.8× 116 0.6× 247 1.7× 11 0.2× 102 1.9× 7 500
Jason Staub United States 8 494 0.8× 180 0.9× 242 1.6× 19 0.3× 62 1.1× 12 526
J. C. Bea Japan 12 481 0.8× 42 0.2× 68 0.5× 161 2.6× 154 2.8× 53 534

Countries citing papers authored by D. F. Lim

Since Specialization
Citations

This map shows the geographic impact of D. F. Lim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. F. Lim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. F. Lim more than expected).

Fields of papers citing papers by D. F. Lim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by D. F. Lim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. F. Lim. The network helps show where D. F. Lim may publish in the future.

Co-authorship network of co-authors of D. F. Lim

This figure shows the co-authorship network connecting the top 25 collaborators of D. F. Lim. A scholar is included among the top collaborators of D. F. Lim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with D. F. Lim. D. F. Lim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Fan, Ji, D. F. Lim, & Chuan Seng Tan. (2013). Effects of surface treatment on the bonding quality of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration. Journal of Micromechanics and Microengineering. 23(4). 45025–45025. 42 indexed citations
2.
Lim, D. F., Jun Wei, Kam W. Leong, & Chuan Seng Tan. (2013). Cu passivation for enhanced low temperature (⩽300°C) bonding in 3D integration. Microelectronic Engineering. 106. 144–148. 23 indexed citations
3.
Li, Lianhe, Houkun Liang, Ying Zhang, et al.. (2013). Single-mode surface-emitting concentric-circular-grating terahertz quantum cascade lasers. Applied Physics Letters. 102(3). 23 indexed citations
4.
Tan, Chuan Seng & D. F. Lim. (2013). (Invited) Cu Surface Passivation with Self-Assembled Monolayer (SAM) and Its Application for Wafer Bonding at Moderately Low Temperature. ECS Transactions. 50(7). 115–123. 18 indexed citations
5.
Zhang, Lin, et al.. (2012). Through Silicon Via Fabrication with Low-κ Dielectric Liner and Its Implications on Parasitic Capacitance and Leakage Current. Japanese Journal of Applied Physics. 51(4S). 04DB03–04DB03. 13 indexed citations
6.
Fan, Ji, D. F. Lim, Lan Peng, King Ho Holden Li, & Chuan Seng Tan. (2012). Effect of bonding temperature on hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration. Microsystem Technologies. 19(5). 661–667. 6 indexed citations
7.
Lim, D. F., Jun Wei, Kam W. Leong, & Chuan Seng Tan. (2012). Surface Passivation of Cu for Low Temperature 3D Wafer Bonding. ECS Solid State Letters. 1(1). P11–P14. 7 indexed citations
8.
Peng, Lan, Lin Zhang, Ji Fan, et al.. (2012). Ultrafine Pitch (6 $\mu\hbox{m}$) of Recessed and Bonded Cu–Cu Interconnects by Three-Dimensional Wafer Stacking. IEEE Electron Device Letters. 33(12). 1747–1749. 27 indexed citations
9.
Peng, Lan, et al.. (2012). Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking. DR-NTU (Nanyang Technological University). 45. 1–3. 6 indexed citations
10.
Lim, D. F., Ji Fan, Lan Peng, Kam W. Leong, & Chuan Seng Tan. (2012). Cu–Cu Hermetic Seal Enhancement Using Self-Assembled Monolayer Passivation. Journal of Electronic Materials. 42(3). 502–506. 8 indexed citations
11.
Zhang, Lin, D. F. Lim, Hong Yu Li, Shan Gao, & Chuan Seng Tan. (2012). Through Silicon Via Fabrication with Low-κ Dielectric Liner and Its Implications on Parasitic Capacitance and Leakage Current. Japanese Journal of Applied Physics. 51(4S). 04DB03–04DB03. 9 indexed citations
12.
Lim, D. F., Jun Wei, Kam W. Leong, & Chuan Seng Tan. (2011). Temporary passivation of Cu for low temperature (< 300°C) 3D wafer stacking. 1–3. 8 indexed citations
13.
Fan, Ji, D. F. Lim, Lan Peng, King Ho Holden Li, & Chuan Seng Tan. (2011). Low Temperature Cu-to-Cu Bonding for Wafer-Level Hermetic Encapsulation of 3D Microsystems. Electrochemical and Solid-State Letters. 14(11). H470–H470. 26 indexed citations
14.
15.
Tan, Chuan Seng, Lan Peng, Hong Yu Li, D. F. Lim, & Shan Gao. (2011). Wafer-on-Wafer Stacking by Bumpless Cu–Cu Bonding and Its Electrical Characteristics. IEEE Electron Device Letters. 32(7). 943–945. 16 indexed citations
16.
Peng, Lan, Hongyu Li, D. F. Lim, Shan Gao, & Chuan Seng Tan. (2011). High-Density 3-D Interconnect of Cu–Cu Contacts With Enhanced Contact Resistance by Self-Assembled Monolayer (SAM) Passivation. IEEE Transactions on Electron Devices. 58(8). 2500–2506. 31 indexed citations
17.
Lim, D. F., X. F. Ang, Jun Wei, C. M. Ng, & Chuan Seng Tan. (2010). Void Density Reduction at the Cu–Cu Bonding Interface by Means of Prebonding Surface Passivation with Self-Assembled Monolayer. Electrochemical and Solid-State Letters. 13(12). H412–H412. 10 indexed citations
18.
Peng, Lan, D. F. Lim, Riko I Made, et al.. (2010). Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement. 1–5. 7 indexed citations
19.
20.
Tan, Chuan Seng, et al.. (2009). Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol. Applied Physics Letters. 95(19). 152 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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