Soonwan Chung

443 total citations
30 papers, 366 citations indexed

About

Soonwan Chung is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Soonwan Chung has authored 30 papers receiving a total of 366 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Electrical and Electronic Engineering, 11 papers in Mechanics of Materials and 9 papers in Mechanical Engineering. Recurrent topics in Soonwan Chung's work include Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (16 papers) and Mechanical Behavior of Composites (4 papers). Soonwan Chung is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (16 papers) and Mechanical Behavior of Composites (4 papers). Soonwan Chung collaborates with scholars based in South Korea, United States and France. Soonwan Chung's co-authors include Seungbae Park, Jae B. Kwak, Da Yu, Seunghee Oh, Hyuntae Kim, James M. Pitarresi, Jiyoung Yoon, Chirag Shah, Changsoo Jang and Harold D. Ackler and has published in prestigious journals such as Journal of Nanoscience and Nanotechnology, Electronics and Microelectronics Reliability.

In The Last Decade

Soonwan Chung

30 papers receiving 358 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Soonwan Chung South Korea 9 262 143 112 51 38 30 366
Changsoo Jang United States 12 273 1.0× 133 0.9× 107 1.0× 64 1.3× 16 0.4× 37 384
Yves Ousten France 11 179 0.7× 67 0.5× 48 0.4× 54 1.1× 21 0.6× 45 286
Xudong Li China 12 107 0.4× 92 0.6× 237 2.1× 69 1.4× 29 0.8× 42 421
Scott Irving United States 11 423 1.6× 122 0.9× 132 1.2× 47 0.9× 18 0.5× 51 476
V. Sarihan United States 12 352 1.3× 167 1.2× 155 1.4× 55 1.1× 19 0.5× 37 455
Ali Imam Iran 12 92 0.4× 147 1.0× 70 0.6× 52 1.0× 60 1.6× 27 414
Jianke Du China 11 91 0.3× 177 1.2× 84 0.8× 137 2.7× 30 0.8× 28 382
Sueo KAWAI Japan 10 318 1.2× 281 2.0× 174 1.6× 46 0.9× 44 1.2× 40 474
Charles J. Vath United States 13 624 2.4× 119 0.8× 300 2.7× 48 0.9× 18 0.5× 28 711

Countries citing papers authored by Soonwan Chung

Since Specialization
Citations

This map shows the geographic impact of Soonwan Chung's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Soonwan Chung with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Soonwan Chung more than expected).

Fields of papers citing papers by Soonwan Chung

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Soonwan Chung. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Soonwan Chung. The network helps show where Soonwan Chung may publish in the future.

Co-authorship network of co-authors of Soonwan Chung

This figure shows the co-authorship network connecting the top 25 collaborators of Soonwan Chung. A scholar is included among the top collaborators of Soonwan Chung based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Soonwan Chung. Soonwan Chung is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kwak, Jae B. & Soonwan Chung. (2021). Advanced utilization of 3D digital image correlation for thermal and impact reliabilities of electronics components. Microelectronics International. 38(1). 14–22. 3 indexed citations
2.
Chung, Soonwan & Jae B. Kwak. (2020). A novel evaluation of shock absorption and adhesive strength under shear impact loading. The Journal of Adhesion. 97(16). 1578–1594. 5 indexed citations
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Chung, Soonwan & Seungbae Park. (2013). Effects of temperature on mechanical properties of SU-8 photoresist material. Journal of Mechanical Science and Technology. 27(9). 2701–2707. 63 indexed citations
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Chung, Soonwan & Hyuntae Kim. (2012). Interfacial reliability between hot-melt polyamides resin and textile for wearable electronics application. Microelectronics Reliability. 52(7). 1501–1510. 7 indexed citations
9.
Yu, Da, Jae B. Kwak, Seungbae Park, Soonwan Chung, & Jiyoung Yoon. (2012). Effect of Shield-Can on Dynamic Response of Board-Level Assembly. Journal of Electronic Packaging. 134(3). 6 indexed citations
10.
Chung, Soonwan, et al.. (2011). Drop reliability of glass panel for LCD. 1250–1254. 6 indexed citations
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Kwak, Jae B., et al.. (2010). Effect of shield-can for drop/shock behavior of board level assembly. 1–7. 4 indexed citations
13.
Chung, Soonwan, et al.. (2010). Investigation of Pb-free solder interconnect under drop impact by ball pull and shear tests. 916–921. 1 indexed citations
14.
Yu, Da, Jae B. Kwak, Seungbae Park, Soonwan Chung, & Ji Young Yoon. (2009). Effect of Shield-Can Design on Dynamic Responses of PCB Under Board Level Drop Impact. 305–310. 8 indexed citations
15.
Yu, Da, et al.. (2009). Reliability assessment of electronic components under random vibration loading. 431–436. 5 indexed citations
16.
Chung, Soonwan & Seungbae Park. (2008). Numerical Investigation of Underfill Failure Due to Phase Change of Pb-Free Flip Chip Solders During Board-Level Reflow. IEEE Transactions on Components and Packaging Technologies. 31(3). 661–669. 4 indexed citations
17.
Chung, Soonwan, et al.. (2007). Effects of Phase Change of Pb-Free Flip-Chip Solders During Board-Level Interconnect Reflow. IEEE Transactions on Advanced Packaging. 30(1). 38–43. 7 indexed citations
18.
Park, Seungbae, et al.. (2006). Viscoelastic Material Properties of SU-8 and Carbon-Nanotube-Reinforced SU-8 Materials. 43–52. 2 indexed citations
19.
Chung, Soonwan, et al.. (2005). Investigation of phase change of flip chip solders during the second level interconnect reflow. 2. 894–900. 2 indexed citations
20.
Chung, Soonwan, et al.. (2005). Structural Reliability of SU-8 Material for MEMS Application. 251–258. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026