Soonwan Chung
- Electrical and Electronic Engineering
- Mechanics of Materials top 10%
- Mechanical Engineering
- Biomedical Engineering
- Civil and Structural Engineering
- Co-authors
- Seungbae ParkJae B. KwakDa YuSeunghee OhHyuntae KimJames M. PitarresiJiyoung YoonChirag Shah
- Topics
- Electronic Packaging and Soldering Technologies (20 papers)3D IC and TSV technologies (16 papers)Mechanical Behavior of Composites (4 papers)
- Partner nations
- South KoreaUnited StatesFrance
In The Last Decade
Soonwan Chung
30 papers receiving 358 citations
Peers
Comparison fields: 5 of 49
- Electrical and Electronic Engineering 262
- Mechanics of Materials 143
- Mechanical Engineering 112
- Biomedical Engineering 51
- Civil and Structural Engineering 38
Countries citing papers authored by Soonwan Chung
This map shows the geographic impact of Soonwan Chung's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Soonwan Chung with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Soonwan Chung more than expected).
Fields of papers citing papers by Soonwan Chung
This network shows the impact of papers produced by Soonwan Chung. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Soonwan Chung. The network helps show where Soonwan Chung may publish in the future.
Co-authorship network of co-authors of Soonwan Chung
This figure shows the co-authorship network connecting the top 25 collaborators of Soonwan Chung. A scholar is included among the top collaborators of Soonwan Chung based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Soonwan Chung. Soonwan Chung is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 5 | |
| 3 | 13 | |
| 4 | 8 | |
| 5 | 6 | |
| 6 | 63 | |
| 7 | 5 | |
| 8 | 7 | |
| 9 | 6 | |
| 10 | 6 | |
| 11 | 25 | |
| 12 | 4 | |
| 13 | 1 | |
| 14 | 8 | |
| 15 | 5 | |
| 16 | 4 | |
| 17 | 7 | |
| 18 | 2 | |
| 19 | 2 | |
| 20 | 5 |
About Soonwan Chung
Soonwan Chung is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Mechanical Engineering, having authored 30 papers that have together received 366 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (16 papers) and Mechanical Behavior of Composites (4 papers). The work is most often cited by research in Mechanics of Materials (143 citations), Electrical and Electronic Engineering (262 citations) and Mechanical Engineering (112 citations). Soonwan Chung has collaborated with scholars based in South Korea, United States and France. Frequent co-authors include Seungbae Park, Jae B. Kwak, Da Yu, Seunghee Oh, Hyuntae Kim, James M. Pitarresi, Jiyoung Yoon, Chirag Shah, Changsoo Jang and Harold D. Ackler. Their work appears in journals such as Journal of Nanoscience and Nanotechnology, Electronics and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.