W. T. Chen

713 total citations
15 papers, 563 citations indexed

About

W. T. Chen is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, W. T. Chen has authored 15 papers receiving a total of 563 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Mechanics of Materials, 5 papers in Electrical and Electronic Engineering and 3 papers in Materials Chemistry. Recurrent topics in W. T. Chen's work include Electronic Packaging and Soldering Technologies (5 papers), Elasticity and Wave Propagation (4 papers) and 3D IC and TSV technologies (4 papers). W. T. Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Elasticity and Wave Propagation (4 papers) and 3D IC and TSV technologies (4 papers). W. T. Chen collaborates with scholars based in United States. W. T. Chen's co-authors include C. W. Nelson, Yifan Guo, Lorraine M. Siperko, Jan Obrzut, E. Sacher, Mark D. Poliks and D. P. Seraphim and has published in prestigious journals such as Journal of Applied Mechanics, IBM Journal of Research and Development and Philosophical magazine.

In The Last Decade

W. T. Chen

15 papers receiving 521 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
W. T. Chen United States	9	372	282	118	58	48	15	563
M. R. Barone United States	16	412 1.1×	71 0.3×	485 4.1×	35 0.6×	47 1.0×	25	760
J. Fouladgar France	13	159 0.4×	203 0.7×	206 1.7×	29 0.5×	17 0.4×	33	414
V. Sarihan United States	12	167 0.4×	352 1.2×	155 1.3×	43 0.7×	55 1.1×	37	455
M.A.J. van Gils Netherlands	12	438 1.2×	294 1.0×	85 0.7×	107 1.8×	66 1.4×	28	671
Kazunari Adachi Japan	13	116 0.3×	116 0.4×	107 0.9×	52 0.9×	93 1.9×	41	359
Lyndon Scott Stephens United States	16	384 1.0×	174 0.6×	574 4.9×	36 0.6×	76 1.6×	53	799
F. A. Andrews United States	7	104 0.3×	119 0.4×	121 1.0×	82 1.4×	54 1.1×	14	366
T. H. Lin United States	12	358 1.0×	167 0.6×	224 1.9×	309 5.3×	66 1.4×	51	640
Jens H. Andreasen Denmark	12	273 0.7×	69 0.2×	166 1.4×	40 0.7×	13 0.3×	37	387
Hideo KOGUCHI Japan	13	576 1.5×	71 0.3×	159 1.3×	89 1.5×	48 1.0×	142	694

Countries citing papers authored by W. T. Chen

Since Specialization

Citations

This map shows the geographic impact of W. T. Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by W. T. Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites W. T. Chen more than expected).

Fields of papers citing papers by W. T. Chen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by W. T. Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by W. T. Chen. The network helps show where W. T. Chen may publish in the future.

Co-authorship network of co-authors of W. T. Chen

This figure shows the co-authorship network connecting the top 25 collaborators of W. T. Chen. A scholar is included among the top collaborators of W. T. Chen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with W. T. Chen. W. T. Chen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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15 of 15 papers shown

Poliks, Mark D., et al.. (1993). Moisture Absorption and its Effects on the Performance of Printed Circuit Materials. MRS Proceedings. 323. 5 indexed citations

Guo, Yifan, et al.. (1993). Thermal-mechanical strain characterization for printed wiring boards. IBM Journal of Research and Development. 37(5). 621–634. 43 indexed citations

Guo, Yifan, et al.. (1993). Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation. IBM Journal of Research and Development. 37(5). 635–648. 93 indexed citations

Chen, W. T., et al.. (1991). A Fundamental Study of the Tape Automated Bonding Process. Journal of Electronic Packaging. 113(3). 216–225. 13 indexed citations

Seraphim, D. P., et al.. (1984). Preface: Advances in materials and processes for printed circuit packaging technology. IBM Journal of Research and Development. 28(6). 652–654. 1 indexed citations

Chen, W. T., et al.. (1982). Piezo- and pyroelectric properties of polyvinylidene fluoride. Journal of Macromolecular Science Part B. 21(3). 397–415. 2 indexed citations

Chen, W. T. & C. W. Nelson. (1979). Thermal Stress in Bonded Joints. IBM Journal of Research and Development. 23(2). 179–188. 239 indexed citations

Chen, W. T., et al.. (1972). Mechanics of Film Adhesion: Elastic and Elastic-Plastic Behavior. IBM Journal of Research and Development. 16(3). 203–213. 35 indexed citations

Chen, W. T.. (1971). Stress Concentration Around a Hyperboloidal Notch Under Tension in a Transversely Isotropic Material. Journal of Applied Mechanics. 38(1). 185–189. 6 indexed citations

10.

Chen, W. T.. (1969). PLANE THERMAL STRESS AT AN ELLIPTICAL ELASTIC INCLUSION UNDER UNIFORM HEAT FLOW. The Quarterly Journal of Mechanics and Applied Mathematics. 22(1). 115–123. 12 indexed citations

11.

Chen, W. T.. (1967). Plane Thermal Stress at an Insulated Hole Under Uniform Heat Flow in an Orthotropic Medium. Journal of Applied Mechanics. 34(1). 133–136. 42 indexed citations

12.

Chen, W. T.. (1966). On Some Problems in Transversely Isotropic Elastic Materials. Journal of Applied Mechanics. 33(2). 347–355. 47 indexed citations

13.

Chen, W. T.. (1966). Some Aspects of a Flat Elliptical Crack Under Shear Stress. Journal of Mathematics and Physics. 45(1-4). 213–223. 17 indexed citations

14.

Chen, W. T.. (1965). On a cracked dislocation in an anisotropic elastic medium. Philosophical magazine. 11(114). 1207–1215. 2 indexed citations

15.

Chen, W. T., et al.. (1965). On a Circular Crack in a Transversely Isotropic Elastic Material Under Prescribed Shear Stress [Letter to the Editor]. IBM Journal of Research and Development. 9(3). 192–195. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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