Joseph B. Vella
- Mechanics of Materials top 5%
- Biomedical Engineering
- Electrical and Electronic Engineering
- Materials Chemistry
- Electronic, Optical and Magnetic Materials
- Co-authors
- Alex A. VolinskyW. W. GerberichJohnny HuardKimimasa TobitaBradley B. KellerMasaho OkadaDanielle S. W. BenoitMichael D. Hoffman
- Topics
- Copper Interconnects and Reliability (11 papers)Metal and Thin Film Mechanics (10 papers)Electronic Packaging and Soldering Technologies (5 papers)
- Journals
- SHILAP Revista de lepidopterologíaPLoS ONEMaterials Science and Engineering A
- Partner nations
- United StatesCanadaSpain
In The Last Decade
Joseph B. Vella
30 papers receiving 716 citations
Peers
Comparison fields: 5 of 100
- Mechanics of Materials 265
- Biomedical Engineering 197
- Electrical and Electronic Engineering 176
- Materials Chemistry 161
- Electronic, Optical and Magnetic Materials 154
Countries citing papers authored by Joseph B. Vella
This map shows the geographic impact of Joseph B. Vella's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Joseph B. Vella with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Joseph B. Vella more than expected).
Fields of papers citing papers by Joseph B. Vella
This network shows the impact of papers produced by Joseph B. Vella. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Joseph B. Vella. The network helps show where Joseph B. Vella may publish in the future.
Co-authorship network of co-authors of Joseph B. Vella
This figure shows the co-authorship network connecting the top 25 collaborators of Joseph B. Vella. A scholar is included among the top collaborators of Joseph B. Vella based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Joseph B. Vella. Joseph B. Vella is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 2 | |
| 3 | 1 | |
| 4 | 0 | |
| 5 | 3 | |
| 6 | 3 | |
| 7 | 21 | |
| 8 | 18 | |
| 9 | 15 | |
| 10 | Mechanical properties, adhesion and fracture toughness of low-k dielectric thin films for microelectronic applications | 2 |
| 11 | 37 | |
| 12 | 28 | |
| 13 | 64 | |
| 14 | 72 | |
| 15 | 4 | |
| 16 | 1 | |
| 17 | 9 | |
| 18 | 9 | |
| 19 | 224 | |
| 20 | 45 |
About Joseph B. Vella
Joseph B. Vella is a scholar working on Electronic, Optical and Magnetic Materials, Genetics and Mechanics of Materials, having authored 31 papers that have together received 738 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (11 papers), Metal and Thin Film Mechanics (10 papers) and Electronic Packaging and Soldering Technologies (5 papers). The work is most often cited by research in Ceramics and Composites (77 citations), Mechanics of Materials (265 citations) and Electronic, Optical and Magnetic Materials (154 citations). Joseph B. Vella has collaborated with scholars based in United States, Canada and Spain. Frequent co-authors include Alex A. Volinsky, W. W. Gerberich, Johnny Huard, Kimimasa Tobita, Bradley B. Keller, Masaho Okada, Danielle S. W. Benoit, Michael D. Hoffman, Lauren Drowley and Sarah Beckman. Their work appears in journals such as SHILAP Revista de lepidopterología, PLoS ONE and Materials Science and Engineering A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.