W. Engelmaier

1.0k total citations
20 papers, 656 citations indexed

About

W. Engelmaier is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, W. Engelmaier has authored 20 papers receiving a total of 656 indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 8 papers in Mechanics of Materials. Recurrent topics in W. Engelmaier's work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (8 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers). W. Engelmaier is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (8 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers). W. Engelmaier collaborates with scholars based in United States, United Kingdom and Netherlands. W. Engelmaier's co-authors include J. A. Augis, D. B. Barker, Michael Pecht, Abhijit Dasgupta and Konstantina Lambrinou and has published in prestigious journals such as Journal of The Electrochemical Society, Journal of Electronic Packaging and Journal of ASTM International.

In The Last Decade

W. Engelmaier

20 papers receiving 576 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
W. Engelmaier United States	11	577	289	196	61	56	20	656
Yi-Hsin Pao United States	10	594 1.0×	315 1.1×	244 1.2×	17 0.3×	70 1.3×	18	679
T.H. Low Singapore	12	754 1.3×	436 1.5×	123 0.6×	8 0.1×	145 2.6×	18	796
M. R. Barone United States	16	71 0.1×	485 1.7×	412 2.1×	54 0.9×	58 1.0×	25	760
Dhananjay Panchagade United States	15	605 1.0×	93 0.3×	155 0.8×	22 0.4×	30 0.5×	31	703
Vahid Samavatian Iran	17	465 0.8×	252 0.9×	111 0.6×	10 0.2×	39 0.7×	33	670
Jae B. Kwak South Korea	11	302 0.5×	102 0.4×	114 0.6×	5 0.1×	27 0.5×	36	387
Sueo KAWAI Japan	10	318 0.6×	174 0.6×	281 1.4×	8 0.1×	14 0.3×	40	474
Yeong K. Kim South Korea	10	126 0.2×	472 1.6×	494 2.5×	7 0.1×	6 0.1×	22	647
Dongho Oh South Korea	9	140 0.2×	127 0.4×	100 0.5×	49 0.8×	19 0.3×	54	386
Jing-en Luan Singapore	14	721 1.2×	179 0.6×	272 1.4×	2 0.0×	18 0.3×	46	799

Countries citing papers authored by W. Engelmaier

Since Specialization

Citations

This map shows the geographic impact of W. Engelmaier's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by W. Engelmaier with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites W. Engelmaier more than expected).

Fields of papers citing papers by W. Engelmaier

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by W. Engelmaier. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by W. Engelmaier. The network helps show where W. Engelmaier may publish in the future.

Co-authorship network of co-authors of W. Engelmaier

This figure shows the co-authorship network connecting the top 25 collaborators of W. Engelmaier. A scholar is included among the top collaborators of W. Engelmaier based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with W. Engelmaier. W. Engelmaier is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Lambrinou, Konstantina & W. Engelmaier. (2010). The Microstructural Aspect of the Ductile-to-Brittle Transition of Tin-Based Lead-Free Solders. Journal of ASTM International. 7(7). 1–23. 1 indexed citations

Engelmaier, W.. (2003). Surface mount solder joint reliability controlling the thermal expansion. 62–65. 3 indexed citations

Engelmaier, W.. (2002). BGA and CGA solder attachments: results of low-acceleration reliability tests and analysis. 1. 218–227. 11 indexed citations

Engelmaier, W., et al.. (2000). Using AXI to Ensure Solder Joint Reliability. 2 indexed citations

Engelmaier, W.. (1996). BGA and CGA Solder Attachments: Results of Low‐acceleration Reliability Test and Analysis *. Soldering and Surface Mount Technology. 8(3). 25–31. 13 indexed citations

Engelmaier, W., et al.. (1995). Alloy 42 — A Material to be Avoided for Surface Mount Component Leads and Lead Frames. Soldering and Surface Mount Technology. 7(3). 20–25. 8 indexed citations

Engelmaier, W.. (1993). Generic reliability figures of merit design tools for surface mount solder attachments. IEEE Transactions on Components Hybrids and Manufacturing Technology. 16(1). 103–112. 42 indexed citations

Engelmaier, W.. (1992). Figures of Merit Design Tools for Surface Mount Solder Joint Reliability. Soldering and Surface Mount Technology. 4(1). 17–22. 3 indexed citations

Dasgupta, Abhijit, et al.. (1992). Influence of Selected Design Variables on Thermo-Mechanical Stress Distributions in Plated-Through-Hole Structures. Journal of Electronic Packaging. 114(1). 8–13. 27 indexed citations

10.

Engelmaier, W.. (1990). The use environments of electronic assemblies and their impact on surface mount solder attachment reliability. IEEE Transactions on Components Hybrids and Manufacturing Technology. 13(4). 903–908. 35 indexed citations

11.

Engelmaier, W., et al.. (1989). Surface-mount attachment reliability of clip-leaded ceramic chip carriers on FR-4 circuit boards. IEEE Transactions on Components Hybrids and Manufacturing Technology. 12(2). 284–296. 75 indexed citations

12.

Engelmaier, W., et al.. (1989). Reliability figures of merit for surface-soldered leadless chip carriers compared to lead packages. IEEE Transactions on Components Hybrids and Manufacturing Technology. 12(4). 449–458. 18 indexed citations

13.

Engelmaier, W.. (1989). Surface Mount Solder Joint Long‐term Reliability: Design, Testing, Prediction. Soldering and Surface Mount Technology. 1(1). 14–22. 43 indexed citations

14.

Engelmaier, W., et al.. (1988). Fatigue Behaviour and Ductility Determination for Rolled Annealed Copper Foil and Flex Circuits on Kapton. Circuit World. 14(2). 30–38. 10 indexed citations

15.

Engelmaier, W.. (1985). Functional Cycles and Surface Mounting Attachment Reliability. Circuit World. 11(3). 61–72. 74 indexed citations

16.

Engelmaier, W.. (1983). Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling. IEEE Transactions on Components Hybrids and Manufacturing Technology. 6(3). 232–237. 269 indexed citations

17.

Engelmaier, W., et al.. (1978). Investigation of Agitation Effects on Electroplated Copper in Multilayer Board Plated‐Through Holes in a Forced‐Flow Plating Cell. Journal of The Electrochemical Society. 125(1). 36–43. 16 indexed citations

18.

Engelmaier, W.. (1975). Designing flex circuits for improved flex life. 1–7. 1 indexed citations

19.

Engelmaier, W.. (1975). Thermal Characteristics of Multilayer Printed Wiring Boards During Lamination. IEEE Transactions on Electrical Insulation. EI-10(3). 98–101. 1 indexed citations

20.

Engelmaier, W.. (1973). Thermal characterization of multilayer printed wiring boards during lamination. 208–210. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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