W. Engelmaier
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Mechanics of Materials top 5%
- Statistics, Probability and Uncertainty top 5%
- Aerospace Engineering
- Topics
- Electronic Packaging and Soldering Technologies (18 papers)3D IC and TSV technologies (8 papers)Integrated Circuits and Semiconductor Failure Analysis (3 papers)
- Cited by
- Electrical and Electronic EngineeringGeneral Materials ScienceStatistics, Probability and Uncertainty
- Journals
- Journal of The Electrochemical SocietyJournal of Electronic PackagingJournal of ASTM International
- Partner nations
- United StatesUnited KingdomNetherlands
In The Last Decade
W. Engelmaier
20 papers receiving 576 citations
Peers
Comparison fields: 5 of 37
- Electrical and Electronic Engineering 577
- Mechanical Engineering 289
- Mechanics of Materials 196
- Statistics, Probability and Uncertainty 61
- Aerospace Engineering 56
Countries citing papers authored by W. Engelmaier
This map shows the geographic impact of W. Engelmaier's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by W. Engelmaier with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites W. Engelmaier more than expected).
Fields of papers citing papers by W. Engelmaier
This network shows the impact of papers produced by W. Engelmaier. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by W. Engelmaier. The network helps show where W. Engelmaier may publish in the future.
Co-authorship network of co-authors of W. Engelmaier
This figure shows the co-authorship network connecting the top 25 collaborators of W. Engelmaier. A scholar is included among the top collaborators of W. Engelmaier based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with W. Engelmaier. W. Engelmaier is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 3 | |
| 3 | 11 | |
| 4 | Using AXI to Ensure Solder Joint Reliability | 2 |
| 5 | 13 | |
| 6 | 8 | |
| 7 | 42 | |
| 8 | 3 | |
| 9 | 27 | |
| 10 | 35 | |
| 11 | 75 | |
| 12 | 18 | |
| 13 | 43 | |
| 14 | 10 | |
| 15 | 74 | |
| 16 | 269 | |
| 17 | 16 | |
| 18 | 1 | |
| 19 | 1 | |
| 20 | 4 |
About W. Engelmaier
W. Engelmaier is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and General Materials Science, having authored 20 papers that have together received 656 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (8 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (577 citations), General Materials Science (31 citations) and Statistics, Probability and Uncertainty (61 citations). W. Engelmaier has collaborated with scholars based in United States, United Kingdom and Netherlands. Frequent co-authors include J. A. Augis, D. B. Barker, Michael Pecht, Abhijit Dasgupta and Konstantina Lambrinou. Their work appears in journals such as Journal of The Electrochemical Society, Journal of Electronic Packaging and Journal of ASTM International.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.