Hongbo Qin

798 total citations
49 papers, 613 citations indexed

About

Hongbo Qin is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Hongbo Qin has authored 49 papers receiving a total of 613 indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Mechanical Engineering, 32 papers in Electrical and Electronic Engineering and 20 papers in Materials Chemistry. Recurrent topics in Hongbo Qin's work include Electronic Packaging and Soldering Technologies (28 papers), Aluminum Alloys Composites Properties (15 papers) and Intermetallics and Advanced Alloy Properties (11 papers). Hongbo Qin is often cited by papers focused on Electronic Packaging and Soldering Technologies (28 papers), Aluminum Alloys Composites Properties (15 papers) and Intermetallics and Advanced Alloy Properties (11 papers). Hongbo Qin collaborates with scholars based in China, Netherlands and Japan. Hongbo Qin's co-authors include Daoguo Yang, Guoqi Zhang, Fengmei Liu, Yaoyong Yi, Qi Li, Ping Zhang, Yaoqi Xian, Jianhua Zeng, Xiong Jiang and Peng Yuan and has published in prestigious journals such as SHILAP Revista de lepidopterología, Small and Chemical Physics Letters.

In The Last Decade

Hongbo Qin

41 papers receiving 597 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Hongbo Qin China 12 391 272 207 77 70 49 613
Eric R. Hoglund United States 15 351 0.9× 143 0.5× 76 0.4× 66 0.9× 55 0.8× 35 466
Qiming Wang China 17 645 1.6× 186 0.7× 188 0.9× 64 0.8× 130 1.9× 56 863
Xueli Du China 13 372 1.0× 133 0.5× 116 0.6× 35 0.5× 44 0.6× 24 460
Sezgin Aydın Türkiye 14 679 1.7× 115 0.4× 287 1.4× 45 0.6× 119 1.7× 34 801
Junhee Hahn South Korea 14 378 1.0× 159 0.6× 155 0.7× 40 0.5× 268 3.8× 43 563
Soon‐Chul Ur South Korea 18 563 1.4× 379 1.4× 144 0.7× 185 2.4× 25 0.4× 67 747
B. A. Bender United States 13 544 1.4× 277 1.0× 164 0.8× 118 1.5× 61 0.9× 26 748
Rongjin Huang China 16 586 1.5× 268 1.0× 160 0.8× 303 3.9× 26 0.4× 51 740
Zhiqing Gu China 12 228 0.6× 227 0.8× 62 0.3× 49 0.6× 148 2.1× 29 412

Countries citing papers authored by Hongbo Qin

Since Specialization
Citations

This map shows the geographic impact of Hongbo Qin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hongbo Qin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hongbo Qin more than expected).

Fields of papers citing papers by Hongbo Qin

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hongbo Qin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hongbo Qin. The network helps show where Hongbo Qin may publish in the future.

Co-authorship network of co-authors of Hongbo Qin

This figure shows the co-authorship network connecting the top 25 collaborators of Hongbo Qin. A scholar is included among the top collaborators of Hongbo Qin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hongbo Qin. Hongbo Qin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Huang, Jinhui, Wang Bi, Xinke Wu, et al.. (2025). Strengthening mechanism of electroplated Cu layer on sintered Cu joint. Journal of Materials Research and Technology. 41. 184–192.
2.
Li, Wangyun, et al.. (2023). Enhanced size effects on shear performance and fracture behavior of BGA structure micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu joints at low temperatures. Microelectronics Reliability. 150. 115093–115093. 2 indexed citations
3.
Zhang, Shujie, Hongjie Jiang, Hongbo Qin, et al.. (2023). Achieving high-damping NiTip/7075Al composites with controllable phase transformation behavior fabricated by friction stir processing. Materials Letters. 355. 135436–135436. 2 indexed citations
4.
Wang, Jian, et al.. (2023). Effects of Near-amorphous multiphase intermetallic compound particles on the microstructure and mechanical properties of SnBi solders. Journal of Materials Science Materials in Electronics. 34(15). 2 indexed citations
5.
Jiang, Hongjie, Hongbo Qin, Chongyu Liu, et al.. (2023). Investigation of phase transition, mechanical properties, and damping behavior of NiTip/6061Al laminar composites. Journal of Alloys and Compounds. 967. 171785–171785. 4 indexed citations
6.
Gong, Yubing, Longgen Liu, Siliang He, et al.. (2022). Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density. Journal of Materials Science Materials in Electronics. 33(32). 24906–24919. 1 indexed citations
7.
Qin, Hongbo, et al.. (2022). First-Principles Study on the Elastic Mechanical Properties and Anisotropies of Gold–Copper Intermetallic Compounds. Metals. 12(6). 959–959. 17 indexed citations
8.
9.
Qin, Hongbo, Wei Qin, Wangyun Li, & Xu Long. (2021). Influence of phase inhomogeneity on the mechanical behavior of microscale Cu/Sn–58Bi/Cu solder joints. Journal of Materials Science Materials in Electronics. 33(1). 244–259. 2 indexed citations
10.
Liu, Tianhan, et al.. (2021). The Mechanical Properties and Elastic Anisotropy of η′-Cu6Sn5 and Cu3Sn Intermetallic Compounds. Crystals. 11(12). 1562–1562. 11 indexed citations
11.
Qin, Hongbo, et al.. (2019). First-Principles Investigation of the Adsorption Behaviors of CH2O on BN, AlN, GaN, InN, BP, and P Monolayers. Materials. 12(4). 676–676. 35 indexed citations
12.
13.
Qin, Hongbo, et al.. (2019). Influence of Phase Inhomogeneity on Electromigration Behavior in Cu/Sn-58Bi/Cu Solder Joint. Journal of Electronic Materials. 48(6). 3410–3414. 4 indexed citations
14.
15.
Liu, Tianhan, Hongbo Qin, Daoguo Yang, & Guoqi Zhang. (2019). First Principles Study of Gas Molecules Adsorption on Monolayered β-SnSe. Coatings. 9(6). 390–390. 13 indexed citations
16.
Qin, Hongbo, et al.. (2018). The Mechanical Properties and Elastic Anisotropies of Cubic Ni3Al from First Principles Calculations. Crystals. 8(8). 307–307. 110 indexed citations
17.
Qin, Hongbo, et al.. (2018). First-principles investigation of adsorption behaviors of small molecules on penta-graphene. Nanoscale Research Letters. 13(1). 264–264. 62 indexed citations
18.
Qin, Hongbo, Wangyun Li, Jing Xiao, et al.. (2018). Influence of Pressure on the Mechanical and Electronic Properties of Wurtzite and Zinc-Blende GaN Crystals. Crystals. 8(11). 428–428. 6 indexed citations
19.
20.
Qin, Hongbo, et al.. (2017). Mechanical, Thermodynamic and Electronic Properties of Wurtzite and Zinc-Blende GaN Crystals. Materials. 10(12). 1419–1419. 63 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026