Runhua Gao

480 total citations
21 papers, 365 citations indexed

About

Runhua Gao is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Runhua Gao has authored 21 papers receiving a total of 365 indexed citations (citations by other indexed papers that have themselves been cited), including 15 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 3 papers in Mechanics of Materials. Recurrent topics in Runhua Gao's work include Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (11 papers) and Aluminum Alloys Composites Properties (6 papers). Runhua Gao is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (11 papers) and Aluminum Alloys Composites Properties (6 papers). Runhua Gao collaborates with scholars based in China, Japan and Taiwan. Runhua Gao's co-authors include Hiroshi Nishikawa, Yu-An Shen, Jiahui Li, Jun Shen, Siliang He, Yang Zuo, Chun-Ming Lin, Xiong Xie, Jun Shen and Xinyu Liu and has published in prestigious journals such as Scientific Reports, Journal of Materials Science and Applied Surface Science.

In The Last Decade

Runhua Gao

20 papers receiving 359 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Runhua Gao China 11 207 191 89 37 29 21 365
Longge Yan China 11 157 0.8× 191 1.0× 156 1.8× 27 0.7× 22 0.8× 20 310
Jiahui Li Japan 14 288 1.4× 217 1.1× 77 0.9× 7 0.2× 44 1.5× 23 450
Zelei Zhang China 10 197 1.0× 70 0.4× 91 1.0× 11 0.3× 80 2.8× 27 327
Miao Sun China 11 126 0.6× 92 0.5× 112 1.3× 11 0.3× 92 3.2× 25 351
Chang Ni China 13 59 0.3× 226 1.2× 205 2.3× 23 0.6× 21 0.7× 34 387
Yuhki TOKU Japan 14 247 1.2× 179 0.9× 185 2.1× 18 0.5× 12 0.4× 61 466
B. Kania Poland 11 71 0.3× 267 1.4× 224 2.5× 55 1.5× 35 1.2× 25 415

Countries citing papers authored by Runhua Gao

Since Specialization
Citations

This map shows the geographic impact of Runhua Gao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Runhua Gao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Runhua Gao more than expected).

Fields of papers citing papers by Runhua Gao

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Runhua Gao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Runhua Gao. The network helps show where Runhua Gao may publish in the future.

Co-authorship network of co-authors of Runhua Gao

This figure shows the co-authorship network connecting the top 25 collaborators of Runhua Gao. A scholar is included among the top collaborators of Runhua Gao based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Runhua Gao. Runhua Gao is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Li, Jiahui, Yu-An Shen, Hiroaki Tatsumi, et al.. (2025). Effect of copper on interfacial reaction and microstructure of soldering on aluminum substrate. Journal of Materials Research and Technology. 37. 3533–3540.
2.
Wang, Weili, Yu‐Ting Huang, Runhua Gao, et al.. (2024). Low-temperature soldering using Sn/Bi electrodeposited bilayer. Materials Science in Semiconductor Processing. 186. 109056–109056. 1 indexed citations
3.
Zheng, Hu, Yidan Tang, Yamin Zhang, et al.. (2024). Degradation in Electrothermal Characteristics and Failure Mechanism of SiC JBS With Different Die Attach Materials Under 300 ∘C Power Cycle Stress. IEEE Journal of Emerging and Selected Topics in Power Electronics. 12(4). 3619–3628. 2 indexed citations
4.
Tian, Ye, Runhua Gao, Xinhua Wang, et al.. (2024). Wafer-scale N-polar GaN heterogeneous structure fabricated by surface active bonding and laser lift-off. Journal of Alloys and Compounds. 1006. 176253–176253. 1 indexed citations
5.
Gao, Runhua, Xinhua Wang, Fengwen Mu, et al.. (2024). Heterogeneous integration of thick GaN and polycrystalline diamond at room temperature through dynamic plasma polishing and surface-activated bonding. Journal of Alloys and Compounds. 985. 174075–174075. 3 indexed citations
6.
Meng, Ying, Runhua Gao, Xinhua Wang, et al.. (2022). Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting. Materials. 15(7). 2529–2529. 4 indexed citations
7.
Mu, Fengwen, Bin Xu, Xinhua Wang, et al.. (2022). A novel strategy for GaN-on-diamond device with a high thermal boundary conductance. Journal of Alloys and Compounds. 905. 164076–164076. 27 indexed citations
8.
Meng, Ying, Yang Xu, Runhua Gao, et al.. (2021). Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere. Journal of Materials Science Materials in Electronics. 33(5). 2582–2589. 9 indexed citations
9.
Gao, Runhua, Yu-An Shen, Jiahui Li, Siliang He, & Hiroshi Nishikawa. (2020). Mechanical and microstructural enhancements of Ag microparticle-sintered joint by ultrasonic vibration. Journal of Materials Science Materials in Electronics. 31(23). 21711–21722. 6 indexed citations
10.
Gao, Runhua, Jiahui Li, Yu-An Shen, & Hiroshi Nishikawa. (2019). A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere. 159–162. 8 indexed citations
11.
Shen, Yu-An, Chun-Ming Lin, Jiahui Li, Runhua Gao, & Hiroshi Nishikawa. (2019). Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging. Scientific Reports. 9(1). 10210–10210. 68 indexed citations
12.
Gao, Runhua, Siliang He, Yu-An Shen, & Hiroshi Nishikawa. (2019). Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles. Journal of Electronic Materials. 48(4). 2263–2271. 24 indexed citations
13.
He, Siliang, Runhua Gao, Yu-An Shen, Jiahui Li, & Hiroshi Nishikawa. (2019). Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere. Journal of Materials Science. 55(7). 3107–3117. 20 indexed citations
14.
He, Siliang, Runhua Gao, Jiahui Li, Yu-An Shen, & Hiroshi Nishikawa. (2019). In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere. Materials Chemistry and Physics. 239. 122309–122309. 24 indexed citations
15.
Zuo, Yang, et al.. (2017). Effect of different sizes of Cu nanoparticles on the shear strength of Cu-Cu joints. Materials Letters. 199. 13–16. 27 indexed citations
16.
Zuo, Yang, et al.. (2017). Improvement of oxidation resistance and bonding strength of Cu nanoparticles solder joints of Cu–Cu bonding by phosphating the nanoparticle. Journal of Materials Processing Technology. 253. 27–33. 30 indexed citations
17.
Gao, Runhua, Jun Shen, Fuxiang Xie, Yang Zuo, & Dong Wu. (2017). Effects of Phenolic Resin Addition on the Electrical Conductivity and Mechanical Strength of Nano-Copper Paste Formed Cu-Cu Joints. Journal of Electronic Materials. 46(11). 6388–6394. 17 indexed citations
18.
Shen, Jun, et al.. (2017). Effects of heat treatment on the activated flux TIG-welded AZ31 magnesium alloy joints. The International Journal of Advanced Manufacturing Technology. 92(9-12). 3983–3990. 8 indexed citations
19.
Shen, Jun, et al.. (2016). Enhanced corrosion resistance of magnesium alloy by a silane-based solution treatment after an in-situ formation of the Mg(OH)2 layer. Applied Surface Science. 365. 268–274. 33 indexed citations
20.
Shen, Jun, et al.. (2016). Influence of heat treatment on microstructure and mechanical properties of FeCrNi coating produced by laser cladding. Transactions of Nonferrous Metals Society of China. 26(8). 2117–2125. 24 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Longge Yan Breakdown of academic impact, for papers by Jiahui Li Breakdown of academic impact, for papers by Zelei Zhang Breakdown of academic impact, for papers by Miao Sun Breakdown of academic impact, for papers by Chang Ni Breakdown of academic impact, for papers by Yuhki TOKU Breakdown of academic impact, for papers by B. Kania
Rankless by CCL
2026