Runhua Gao
- Electrical and Electronic Engineering
- Mechanical Engineering top 10%
- Materials Chemistry
- Biomaterials
- Electronic, Optical and Magnetic Materials
- Topics
- Electronic Packaging and Soldering Technologies (11 papers)3D IC and TSV technologies (11 papers)Aluminum Alloys Composites Properties (6 papers)
In The Last Decade
Runhua Gao
20 papers receiving 359 citations
Peers
Comparison fields: 5 of 69
- Electrical and Electronic Engineering 207
- Mechanical Engineering 191
- Materials Chemistry 89
- Biomaterials 37
- Electronic, Optical and Magnetic Materials 29
Countries citing papers authored by Runhua Gao
This map shows the geographic impact of Runhua Gao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Runhua Gao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Runhua Gao more than expected).
Fields of papers citing papers by Runhua Gao
This network shows the impact of papers produced by Runhua Gao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Runhua Gao. The network helps show where Runhua Gao may publish in the future.
Co-authorship network of co-authors of Runhua Gao
This figure shows the co-authorship network connecting the top 25 collaborators of Runhua Gao. A scholar is included among the top collaborators of Runhua Gao based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Runhua Gao. Runhua Gao is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 1 | |
| 3 | 1 | |
| 4 | 3 | |
| 5 | 2 | |
| 6 | 4 | |
| 7 | 27 | |
| 8 | 9 | |
| 9 | 6 | |
| 10 | 29 | |
| 11 | 8 | |
| 12 | 68 | |
| 13 | 24 | |
| 14 | 20 | |
| 15 | 24 | |
| 16 | 30 | |
| 17 | 27 | |
| 18 | 17 | |
| 19 | 24 | |
| 20 | 33 |
About Runhua Gao
Runhua Gao is a scholar working on Ceramics and Composites, Mechanical Engineering and Electrical and Electronic Engineering, having authored 21 papers that have together received 365 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (11 papers) and Aluminum Alloys Composites Properties (6 papers). The work is most often cited by research in Mechanical Engineering (191 citations), Electrical and Electronic Engineering (207 citations) and Biomaterials (37 citations). Runhua Gao has collaborated with scholars based in China, Japan and Taiwan. Frequent co-authors include Hiroshi Nishikawa, Yu-An Shen, Jiahui Li, Jun Shen, Siliang He, Yang Zuo, Chun-Ming Lin, Xiong Xie, Jun Shen and Tao Zhang. Their work appears in journals such as Scientific Reports, Journal of Materials Science and Applied Surface Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.