Andreas Schletz

828 total citations
46 papers, 573 citations indexed

About

Andreas Schletz is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Andreas Schletz has authored 46 papers receiving a total of 573 indexed citations (citations by other indexed papers that have themselves been cited), including 43 papers in Electrical and Electronic Engineering, 15 papers in Mechanical Engineering and 9 papers in Materials Chemistry. Recurrent topics in Andreas Schletz's work include Electronic Packaging and Soldering Technologies (27 papers), Silicon Carbide Semiconductor Technologies (18 papers) and 3D IC and TSV technologies (16 papers). Andreas Schletz is often cited by papers focused on Electronic Packaging and Soldering Technologies (27 papers), Silicon Carbide Semiconductor Technologies (18 papers) and 3D IC and TSV technologies (16 papers). Andreas Schletz collaborates with scholars based in Germany, Japan and Switzerland. Andreas Schletz's co-authors include W. Wondrak, L. Frey, Martin März, R. T. Schneider, Markus Rauch, Nguyễn Thị Thắm, Xingfu Tang, Bernd Eckardt, Thomas Goetz and Francesco Iannuzzo and has published in prestigious journals such as IEEE Transactions on Dielectrics and Electrical Insulation, Microelectronics Reliability and Materials science forum.

In The Last Decade

Andreas Schletz

45 papers receiving 555 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Andreas Schletz Germany 12 515 188 141 40 36 46 573
Vemal Raja Manikam Malaysia 7 433 0.8× 225 1.2× 82 0.6× 54 1.4× 27 0.8× 12 508
Thomas G. Lei United States 8 493 1.0× 232 1.2× 52 0.4× 52 1.3× 42 1.2× 10 530
Siliang He China 14 387 0.8× 312 1.7× 59 0.4× 38 0.9× 24 0.7× 52 474
Yiying Yao United States 10 539 1.0× 87 0.5× 112 0.8× 19 0.5× 27 0.8× 21 676
Nicolas Heuck Germany 12 325 0.6× 166 0.9× 38 0.3× 22 0.6× 20 0.6× 17 350
Chanyang Choe Japan 15 428 0.8× 294 1.6× 38 0.3× 49 1.2× 41 1.1× 22 488
Noriko Kagami Japan 4 298 0.6× 192 1.0× 58 0.4× 38 0.9× 15 0.4× 5 352
Jianping Lin China 11 172 0.3× 103 0.5× 295 2.1× 36 0.9× 55 1.5× 28 382
Ryszard Kisiel Poland 11 404 0.8× 221 1.2× 42 0.3× 32 0.8× 19 0.5× 67 456
Jean-Marc Dedulle France 11 279 0.5× 104 0.6× 69 0.5× 50 1.3× 80 2.2× 23 341

Countries citing papers authored by Andreas Schletz

Since Specialization
Citations

This map shows the geographic impact of Andreas Schletz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Andreas Schletz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Andreas Schletz more than expected).

Fields of papers citing papers by Andreas Schletz

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Andreas Schletz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Andreas Schletz. The network helps show where Andreas Schletz may publish in the future.

Co-authorship network of co-authors of Andreas Schletz

This figure shows the co-authorship network connecting the top 25 collaborators of Andreas Schletz. A scholar is included among the top collaborators of Andreas Schletz based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Andreas Schletz. Andreas Schletz is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Varghese, Jobin, et al.. (2023). Ceramic Embedding of SiC-Semiconductor Using Cofiring Technology. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–5. 1 indexed citations
2.
Schletz, Andreas, et al.. (2021). Automated quantitative analysis of void morphology evolution in Ag Ag direct bonding interface after accelerated aging. Microelectronics Reliability. 126. 114285–114285. 1 indexed citations
3.
Bayer, Benjamin, et al.. (2020). LTCC Embedding of SiC Power Devices for High Temperature Applications over 400 °C. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 6 indexed citations
4.
Zhao, Dawei, et al.. (2020). Reliability of Silver Direct Bonding in Thermal Cycling Tests. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 13. 1–6. 2 indexed citations
5.
Pavliček, Niko, et al.. (2019). Power module platform for automotive reliability requirements. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). P.1–P.10. 5 indexed citations
6.
Erlbacher, Tobias, Andreas Schletz, Lutz Kirste, et al.. (2018). Electrical Properties of Schottky-Diodes Based on B Doped Diamond. Materials science forum. 924. 931–934. 3 indexed citations
7.
Schletz, Andreas, et al.. (2018). Selective Silver Sintering of Semiconductor Dies on PCB. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–8. 2 indexed citations
8.
Schletz, Andreas, et al.. (2017). The correlation between sintered silver joint reliability and pressure assisted sintering parameters. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–6. 3 indexed citations
9.
Schneider, R. T., et al.. (2016). Enhancing partial discharge inception voltage of DBCs by geometrical variations based on simulations of the electric field strength. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–5. 11 indexed citations
10.
Schneider, R. T., et al.. (2016). Enhancement of the partial discharge inception voltage of DBCs by adjusting the permittivity of the encapsulation. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–5. 13 indexed citations
11.
Schletz, Andreas, et al.. (2016). Partial discharges in ceramic substrates - correlation of electric field strength simulations with phase resolved partial discharge measurements. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 530–535. 16 indexed citations
12.
Wondrak, W., et al.. (2015). Characteristics and aging of PCB embedded power electronics. Microelectronics Reliability. 55(9-10). 1634–1639. 13 indexed citations
13.
Schletz, Andreas, et al.. (2015). High temperature die-attach materials for aerospace power electronics: Lifetime tests and modeling. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 29. 1–8. 7 indexed citations
14.
Schletz, Andreas, et al.. (2014). Novel Design Concept for Modular Multilevel Converter Power Modules. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–6. 1 indexed citations
15.
Schletz, Andreas, et al.. (2014). Thermo-mechanical simulation of plastic deformation during temperature cycling of bond wires for power electronic modules. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–5. 9 indexed citations
16.
17.
Hofmann, M, et al.. (2012). Modular inverter power electronic for intelligent e-drives. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–6. 4 indexed citations
18.
Schletz, Andreas, et al.. (2011). Reliability of insulating substrates — High temperature power electronics for more electric aircraft. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–7. 11 indexed citations
19.
Schletz, Andreas, et al.. (2010). Power semiconductor joining through sintering of silver nanoparticles: Evaluation of influence of parameters time, temperature and pressure on density, strength and reliability. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–6. 53 indexed citations
20.
Frey, L., et al.. (2010). Polymer bonded soft magnetics for EMI filter applications in power electronics. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 231–238. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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