Thomas G. Lei

613 total citations
10 papers, 530 citations indexed

About

Thomas G. Lei is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Ceramics and Composites. According to data from OpenAlex, Thomas G. Lei has authored 10 papers receiving a total of 530 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 3 papers in Ceramics and Composites. Recurrent topics in Thomas G. Lei's work include Electronic Packaging and Soldering Technologies (5 papers), Silicon Carbide Semiconductor Technologies (5 papers) and 3D IC and TSV technologies (3 papers). Thomas G. Lei is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Silicon Carbide Semiconductor Technologies (5 papers) and 3D IC and TSV technologies (3 papers). Thomas G. Lei collaborates with scholars based in United States and China. Thomas G. Lei's co-authors include Guo‐Quan Lu, Jesus N. Calata, Shufang Luo, Xu Chen, Khai D. T. Ngo, John G. Bai, Puqi Ning, Fred Wang, Kaushik Rajashekara and Li Jiang and has published in prestigious journals such as IEEE Transactions on Power Electronics, Journal of materials research/Pratt's guide to venture capital sources and SAE technical papers on CD-ROM/SAE technical paper series.

In The Last Decade

Thomas G. Lei

10 papers receiving 508 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Thomas G. Lei United States	8	493	232	52	52	42	10	530
Chanyang Choe Japan	15	428 0.9×	294 1.3×	49 0.9×	38 0.7×	41 1.0×	22	488
Guangyin Lei China	8	422 0.9×	192 0.8×	117 2.3×	156 3.0×	42 1.0×	24	562
L. Mendizabal France	5	399 0.8×	206 0.9×	44 0.8×	92 1.8×	44 1.0×	11	496
Andreas Schletz Germany	12	515 1.0×	188 0.8×	40 0.8×	141 2.7×	36 0.9×	46	573
Noriko Kagami Japan	4	298 0.6×	192 0.8×	38 0.7×	58 1.1×	15 0.4×	5	352
Hiroaki Tatsumi Japan	12	387 0.8×	294 1.3×	42 0.8×	56 1.1×	10 0.2×	52	452
K. Sakamoto Japan	10	428 0.9×	475 2.0×	31 0.6×	68 1.3×	19 0.5×	12	606
Omid Mokhtari Japan	14	739 1.5×	610 2.6×	30 0.6×	52 1.0×	9 0.2×	38	796
Jong-Tae Moon South Korea	9	256 0.5×	185 0.8×	11 0.2×	77 1.5×	24 0.6×	31	387
Tomohito Iwashige Japan	9	341 0.7×	266 1.1×	56 1.1×	47 0.9×	47 1.1×	17	427

Countries citing papers authored by Thomas G. Lei

Since Specialization

Citations

This map shows the geographic impact of Thomas G. Lei's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Thomas G. Lei with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Thomas G. Lei more than expected).

Fields of papers citing papers by Thomas G. Lei

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Thomas G. Lei. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Thomas G. Lei. The network helps show where Thomas G. Lei may publish in the future.

Co-authorship network of co-authors of Thomas G. Lei

This figure shows the co-authorship network connecting the top 25 collaborators of Thomas G. Lei. A scholar is included among the top collaborators of Thomas G. Lei based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Thomas G. Lei. Thomas G. Lei is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

10 of 10 papers shown

Su, Ming, et al.. (2017). Opportunity and Challenges for SiC-Based HEV Traction Inverter Systems. SAE technical papers on CD-ROM/SAE technical paper series. 2 indexed citations

Jiang, Li, Thomas G. Lei, Khai D. T. Ngo, Guo‐Quan Lu, & Shufang Luo. (2014). Evaluation of Thermal Cycling Reliability of Sintered Nanosilver Versus Soldered Joints by Curvature Measurement. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(5). 751–761. 27 indexed citations

Ning, Puqi, Thomas G. Lei, Fred Wang, et al.. (2010). A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module. IEEE Transactions on Power Electronics. 25(8). 2059–2067. 96 indexed citations

Ning, Puqi, Thomas G. Lei, Fred Wang, Guo‐Quan Lu, & Khai D. T. Ngo. (2009). A Novel High-Temperature Planar Package for SiC Multi-Chip Phase-Leg Power Module. 2061–2067. 10 indexed citations

Lei, Thomas G., Jesus N. Calata, Khai D. T. Ngo, & Guo‐Quan Lu. (2009). Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate. IEEE Transactions on Device and Materials Reliability. 9(4). 563–568. 67 indexed citations

Lei, Thomas G., Jesus N. Calata, Guo‐Quan Lu, Xu Chen, & Shufang Luo. (2009). Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips. IEEE Transactions on Components and Packaging Technologies. 33(1). 98–104. 198 indexed citations

Calata, Jesus N., et al.. (2009). Sintered nanosilver paste for high-temperature power semiconductor device attachment. International Journal of Materials and Product Technology. 34(1/2). 95–95. 42 indexed citations

Lu, Guo‐Quan, Jesus N. Calata, & Thomas G. Lei. (2008). Low-Temperature Sintering of Nanoscale Silver Paste for Power Chip Attachment. 1–5. 12 indexed citations

Lei, Thomas G., et al.. (2007). Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules. Key engineering materials. 353-358. 2948–2953. 6 indexed citations

10.

Bai, John G., Thomas G. Lei, Jesus N. Calata, & Guo‐Quan Lu. (2007). Control of nanosilver sintering attained through organic binder burnout. Journal of materials research/Pratt's guide to venture capital sources. 22(12). 3494–3500. 70 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact