Jiahui Li
- Electrical and Electronic Engineering
- Mechanical Engineering top 10%
- Materials Chemistry
- Electronic, Optical and Magnetic Materials
- Aerospace Engineering
- Co-authors
- Hiroshi NishikawaYu-An ShenRunhua GaoSiliang HeShiqi ZhouChun-Ming LinSijie HuangShih‐kang Lin
- Topics
- Electronic Packaging and Soldering Technologies (12 papers)3D IC and TSV technologies (11 papers)High-Temperature Coating Behaviors (3 papers)
In The Last Decade
Jiahui Li
22 papers receiving 445 citations
Peers
Comparison fields: 5 of 88
- Electrical and Electronic Engineering 288
- Mechanical Engineering 217
- Materials Chemistry 77
- Electronic, Optical and Magnetic Materials 44
- Aerospace Engineering 43
Countries citing papers authored by Jiahui Li
This map shows the geographic impact of Jiahui Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jiahui Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jiahui Li more than expected).
Fields of papers citing papers by Jiahui Li
This network shows the impact of papers produced by Jiahui Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jiahui Li. The network helps show where Jiahui Li may publish in the future.
Co-authorship network of co-authors of Jiahui Li
This figure shows the co-authorship network connecting the top 25 collaborators of Jiahui Li. A scholar is included among the top collaborators of Jiahui Li based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jiahui Li. Jiahui Li is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 13 | |
| 3 | 1 | |
| 4 | 1 | |
| 5 | 22 | |
| 6 | 16 | |
| 7 | 3 | |
| 8 | 28 | |
| 9 | 29 | |
| 10 | 5 | |
| 11 | 6 | |
| 12 | 8 | |
| 13 | 13 | |
| 14 | 68 | |
| 15 | 43 | |
| 16 | 3 | |
| 17 | 11 | |
| 18 | 20 | |
| 19 | 66 | |
| 20 | 15 |
About Jiahui Li
Jiahui Li is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Ceramics and Composites, having authored 23 papers that have together received 450 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (11 papers) and High-Temperature Coating Behaviors (3 papers). The work is most often cited by research in Mechanical Engineering (217 citations), Electrical and Electronic Engineering (288 citations) and General Materials Science (14 citations). Jiahui Li has collaborated with scholars based in Japan, China and Taiwan. Frequent co-authors include Hiroshi Nishikawa, Yu-An Shen, Runhua Gao, Siliang He, Shiqi Zhou, Chun-Ming Lin, Sijie Huang, Shih‐kang Lin, K. N. Tu and Shih-Hsun Chen. Their work appears in journals such as Scientific Reports, Construction and Building Materials and International Journal of Hydrogen Energy.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.