Haksun Lee

633 total citations · 1 hit paper
20 papers, 454 citations indexed

About

Haksun Lee is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Haksun Lee has authored 20 papers receiving a total of 454 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 3 papers in Materials Chemistry. Recurrent topics in Haksun Lee's work include Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Injection Molding Process and Properties (5 papers). Haksun Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Injection Molding Process and Properties (5 papers). Haksun Lee collaborates with scholars based in South Korea, United States and China. Haksun Lee's co-authors include Vanessa Smet, Rao Tummala, Yong‐Sung Eom, Hyun‐Cheol Bae, Kwang‐Seong Choi, Jin Ho Lee, Jiaxiong Li, Zhijian Sun, Yanjuan Ren and Kyoung‐sik Moon and has published in prestigious journals such as ACS Applied Materials & Interfaces, IEEE Journal of Emerging and Selected Topics in Power Electronics and IEEE Transactions on Components Packaging and Manufacturing Technology.

In The Last Decade

Haksun Lee

20 papers receiving 446 citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues

2019 308 citations Haksun Lee, Vanessa Smet et al. IEEE Journal of Emerging and Selected Topics in Power Electronics profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Haksun Lee South Korea	7	349	139	86	49	48	20	454
Yiying Yao United States	10	539 1.5×	87 0.6×	112 1.3×	65 1.3×	60 1.3×	21	676
Kiwook Lee South Korea	13	350 1.0×	113 0.8×	51 0.6×	46 0.9×	115 2.4×	32	451
Siliang He China	14	387 1.1×	312 2.2×	59 0.7×	15 0.3×	25 0.5×	52	474
Lixi Wan China	12	494 1.4×	55 0.4×	88 1.0×	37 0.8×	119 2.5×	137	612
Didier Landru France	9	230 0.7×	68 0.5×	77 0.9×	10 0.2×	66 1.4×	42	336
Junghwan Bang South Korea	12	422 1.2×	300 2.2×	47 0.5×	13 0.3×	31 0.6×	51	478
Bongsub Lee United States	13	340 1.0×	31 0.2×	73 0.8×	23 0.5×	78 1.6×	24	373
Doo-Hee Jung South Korea	7	176 0.5×	64 0.5×	45 0.5×	52 1.1×	24 0.5×	19	324
Wei-Lan Chiu Taiwan	10	246 0.7×	52 0.4×	35 0.4×	16 0.3×	46 1.0×	43	290
Ravi Kumar India	10	176 0.5×	92 0.7×	36 0.4×	17 0.3×	64 1.3×	41	303

Countries citing papers authored by Haksun Lee

Since Specialization

Citations

This map shows the geographic impact of Haksun Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Haksun Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Haksun Lee more than expected).

Fields of papers citing papers by Haksun Lee

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Haksun Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Haksun Lee. The network helps show where Haksun Lee may publish in the future.

Co-authorship network of co-authors of Haksun Lee

This figure shows the co-authorship network connecting the top 25 collaborators of Haksun Lee. A scholar is included among the top collaborators of Haksun Lee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Haksun Lee. Haksun Lee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Li, Jiaxiong, Chao Ren, Zhijian Sun, et al.. (2021). Melt Processable Novolac Cyanate Ester/Biphenyl Epoxy Copolymer Series with Ultrahigh Glass-Transition Temperature. ACS Applied Materials & Interfaces. 13(13). 15551–15562. 40 indexed citations

Ravichandran, Siddharth, et al.. (2020). Thermal Management of Glass Panel Embedded Packages: Package Architecture vs. Power Density. 2105–2106. 14 indexed citations

Lee, Haksun, Vanessa Smet, & Rao Tummala. (2019). A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues. IEEE Journal of Emerging and Selected Topics in Power Electronics. 8(1). 239–255. 308 indexed citations breakdown →

Lee, Haksun, Vanessa Smet, P. Markondeya Raj, & Rao Tummala. (2017). Design of Low-Profile Integrated Transformer and Inductor for Substrate-Embedding in 1-5kW Isolated GaN DC-DC Converters. 2256–2262. 2 indexed citations

Lee, Haksun, Kwang‐Seong Choi, Yong‐Sung Eom, Hyun‐Cheol Bae, & Jin Ho Lee. (2016). Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding. ETRI Journal. 38(6). 1163–1171. 11 indexed citations

Bae, Hyun‐Cheol, et al.. (2015). Cost-effective thermoelectric cooler packaging using hybrid Cu paste. European Microelectronics and Packaging Conference. 1 indexed citations

Lee, Haksun, Hyun‐Cheol Bae, Yong‐Sung Eom, et al.. (2015). Characterization of 3D stacked high resistivity Si interposers with polymer TSV liners for 3D RF module. 3. 928–933. 4 indexed citations

Eom, Yong‐Sung, et al.. (2015). HV-SoP Technology for Maskless Fine-Pitch Bumping Process. ETRI Journal. 37(3). 523–532. 7 indexed citations

Eom, Yong‐Sung, Haksun Lee, Kwang‐Seong Choi, et al.. (2015). Development of Copper Electro-Plating Technology on a Screen-Printed Conductive Pattern with Copper Paste. Journal of the Microelectronics and Packaging Society. 22(1). 51–54. 3 indexed citations

10.

Lee, Haksun, Yong‐Sung Eom, Hyun‐Cheol Bae, Kwang‐Seong Choi, & Jin Ho Lee. (2014). Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(10). 1729–1738. 15 indexed citations

11.

Lee, Haksun, Yong‐Sung Eom, Hyun‐Cheol Bae, Kwang‐Seong Choi, & Jin Ho Lee. (2014). Development of low contact resistance interconnection for display applications. 22. 1–5. 4 indexed citations

12.

Eom, Yong‐Sung, Keon‐Soo Jang, Haksun Lee, et al.. (2014). Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life. ETRI Journal. 36(3). 343–351. 32 indexed citations

13.

Bae, Hyun‐Cheol, Haksun Lee, Yong‐Sung Eom, & Kwang‐Seong Choi. (2013). Novel Low-volume solder-on-pad for fine pitch Cu pillar bump. European Microelectronics and Packaging Conference. 1–4. 2 indexed citations

14.

Lee, Haksun, et al.. (2013). Novel interconnection technology for flex-on-glass (FOG) applications. European Microelectronics and Packaging Conference. 1–5. 2 indexed citations

15.

Kim, Jong‐Bum, et al.. (2008). Cloning and Characterization of an Esterase from Xanthomonas oryzae pv. oryzae. Journal of Applied Biological Chemistry. 51(3). 95–101. 2 indexed citations

16.

Lee, Haksun, et al.. (2007). Developing a Young Children’s Autonomous BehaviorRating Scale for Kindergarten Daily Activities. Korean Journal of Early Childhood Education. 27(4). 303–325. 1 indexed citations

17.

Lee, Haksun, et al.. (2005). Meals Services and Young Children's Eating Habit Guidances by Kindergarten Types. The Journal of Korea Open Association for Early Childhood Education. 10(4). 337–360. 2 indexed citations

18.

Lee, Haksun, et al.. (2004). Electrically evoked potentials recorded in a patient with auditory neuropathy. Cochlear Implants International. 5(S1). 231–231. 1 indexed citations

19.

Lee, Haksun, et al.. (2004). Relation between CSF gusher and large endolymphatic sac in the enlarged vestibular aqueduct syndrome during cochlear implantation. Cochlear Implants International. 5(S1). 78–79. 2 indexed citations

20.

Lee, Haksun, et al.. (2000). Optimal Design and Die Manufacturing of an Axial Fan for Cooling Towers. IE interfaces. 13(4). 717–724. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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