Haksun Lee
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering
- Materials Chemistry
- Polymers and Plastics
- Biomedical Engineering
- Co-authors
- Vanessa SmetRao TummalaYong‐Sung EomHyun‐Cheol BaeKwang‐Seong ChoiJin Ho LeeJiaxiong LiZhijian Sun
- Topics
- Electronic Packaging and Soldering Technologies (8 papers)3D IC and TSV technologies (7 papers)Injection Molding Process and Properties (5 papers)
- Journals
- ACS Applied Materials & InterfacesIEEE Journal of Emerging and Selected Topics in Power ElectronicsIEEE Transactions on Components Packaging and Manufacturing Technology
- Partner nations
- South KoreaUnited StatesChina
In The Last Decade
Haksun Lee
20 papers receiving 446 citations
Hit Papers
Peers
Comparison fields: 5 of 54
- Electrical and Electronic Engineering 349
- Mechanical Engineering 139
- Materials Chemistry 86
- Polymers and Plastics 49
- Biomedical Engineering 48
Countries citing papers authored by Haksun Lee
This map shows the geographic impact of Haksun Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Haksun Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Haksun Lee more than expected).
Fields of papers citing papers by Haksun Lee
This network shows the impact of papers produced by Haksun Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Haksun Lee. The network helps show where Haksun Lee may publish in the future.
Co-authorship network of co-authors of Haksun Lee
This figure shows the co-authorship network connecting the top 25 collaborators of Haksun Lee. A scholar is included among the top collaborators of Haksun Lee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Haksun Lee. Haksun Lee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 40 | |
| 2 | 14 | |
| 3 | A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issuesbreakdown → | 308 |
| 4 | 2 | |
| 5 | 11 | |
| 6 | Cost-effective thermoelectric cooler packaging using hybrid Cu paste | 1 |
| 7 | 4 | |
| 8 | 7 | |
| 9 | 3 | |
| 10 | 15 | |
| 11 | 4 | |
| 12 | 32 | |
| 13 | Novel Low-volume solder-on-pad for fine pitch Cu pillar bump | 2 |
| 14 | Novel interconnection technology for flex-on-glass (FOG) applications | 2 |
| 15 | 2 | |
| 16 | 1 | |
| 17 | Meals Services and Young Children's Eating Habit Guidances by Kindergarten Types | 2 |
| 18 | 1 | |
| 19 | 2 | |
| 20 | Optimal Design and Die Manufacturing of an Axial Fan for Cooling Towers | 1 |
About Haksun Lee
Haksun Lee is a scholar working on Mechanical Engineering, Sensory Systems and Electrical and Electronic Engineering, having authored 20 papers that have together received 454 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Injection Molding Process and Properties (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (349 citations), Mechanical Engineering (139 citations) and Polymers and Plastics (49 citations). Haksun Lee has collaborated with scholars based in South Korea, United States and China. Frequent co-authors include Vanessa Smet, Rao Tummala, Yong‐Sung Eom, Hyun‐Cheol Bae, Kwang‐Seong Choi, Jin Ho Lee, Jiaxiong Li, Zhijian Sun, Yanjuan Ren and Kyoung‐sik Moon. Their work appears in journals such as ACS Applied Materials & Interfaces, IEEE Journal of Emerging and Selected Topics in Power Electronics and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.