Wei-Lan Chiu

457 total citations
43 papers, 290 citations indexed

About

Wei-Lan Chiu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, Wei-Lan Chiu has authored 43 papers receiving a total of 290 indexed citations (citations by other indexed papers that have themselves been cited), including 40 papers in Electrical and Electronic Engineering, 17 papers in Electronic, Optical and Magnetic Materials and 7 papers in Biomedical Engineering. Recurrent topics in Wei-Lan Chiu's work include Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (33 papers) and Copper Interconnects and Reliability (17 papers). Wei-Lan Chiu is often cited by papers focused on Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (33 papers) and Copper Interconnects and Reliability (17 papers). Wei-Lan Chiu collaborates with scholars based in Taiwan, United States and Norway. Wei-Lan Chiu's co-authors include Hsiang‐Hung Chang, Chih Chen, Chia-Wen Chiang, Dinh-Phuc Tran, Shih‐Chi Yang, K. N. Tu, Kai-Cheng Shie, Ching‐I Huang, Kuan‐Neng Chen and Chia‐Hsin Lee and has published in prestigious journals such as ACS Nano, Scientific Reports and Applied Surface Science.

In The Last Decade

Wei-Lan Chiu

38 papers receiving 280 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Wei-Lan Chiu Taiwan 10 246 74 57 52 46 43 290
Didier Landru France 9 230 0.9× 34 0.5× 46 0.8× 68 1.3× 66 1.4× 42 336
Samuel Suhard Belgium 12 268 1.1× 46 0.6× 55 1.0× 27 0.5× 95 2.1× 48 355
Kai-Cheng Shie Taiwan 10 257 1.0× 109 1.5× 29 0.5× 79 1.5× 39 0.8× 25 301
Bongsub Lee United States 13 340 1.4× 62 0.8× 78 1.4× 31 0.6× 78 1.7× 24 373
Hsiang‐Hung Chang Taiwan 11 260 1.1× 60 0.8× 48 0.8× 26 0.5× 63 1.4× 44 287
Masaya Kawano Singapore 13 435 1.8× 57 0.8× 70 1.2× 38 0.7× 80 1.7× 45 465
L.L. Chapelon France 11 257 1.0× 128 1.7× 31 0.5× 23 0.4× 41 0.9× 25 291
Serena Iacovo Belgium 15 517 2.1× 99 1.3× 88 1.5× 54 1.0× 116 2.5× 43 590
Kuo‐Shu Kao Taiwan 13 311 1.3× 27 0.4× 58 1.0× 81 1.6× 44 1.0× 42 333
Bernhard Rebhan Austria 9 209 0.8× 64 0.9× 51 0.9× 35 0.7× 34 0.7× 26 237

Countries citing papers authored by Wei-Lan Chiu

Since Specialization
Citations

This map shows the geographic impact of Wei-Lan Chiu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wei-Lan Chiu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wei-Lan Chiu more than expected).

Fields of papers citing papers by Wei-Lan Chiu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Wei-Lan Chiu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wei-Lan Chiu. The network helps show where Wei-Lan Chiu may publish in the future.

Co-authorship network of co-authors of Wei-Lan Chiu

This figure shows the co-authorship network connecting the top 25 collaborators of Wei-Lan Chiu. A scholar is included among the top collaborators of Wei-Lan Chiu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Wei-Lan Chiu. Wei-Lan Chiu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Chiu, Wei-Lan, et al.. (2025). Revealing challenges of downscaling effects on Cu thermal expansion in advanced hybrid bonding using in-situ AFM. Applied Surface Science. 689. 162539–162539. 2 indexed citations
2.
Chiu, Wei-Lan, et al.. (2025). In-situ AFM observation of enhanced thermal expansion in downscaled nanotwinned-Cu/SiO2 vias for 3D IC integration. Journal of Materials Research and Technology. 36. 9091–9099. 1 indexed citations
3.
Chen, Yuan, et al.. (2025). Efficient Cu/SiO2 hybrid bonding through alkaline surface modification for 3D IC integration. Applied Surface Science. 689. 162534–162534. 1 indexed citations
4.
Tran, Dinh-Phuc, et al.. (2024). In-situ measurement of thermal expansion in Cu/SiO2 hybrid structures using atomic force microscopy at elevated temperatures. Applied Surface Science. 662. 160103–160103. 14 indexed citations
5.
Tran, Dinh-Phuc, et al.. (2024). Surface modification of nanotwinned copper and SiCN using N2 and Ar plasma activation. Applied Surface Science. 684. 161832–161832. 4 indexed citations
6.
Yuan, Chen, et al.. (2024). Surface Modification by Wet Treatment for Low-Temperature Cu/SiO2 Hybrid Bonding. 115–116. 2 indexed citations
7.
Tran, Dinh-Phuc, et al.. (2024). Evolutions of interfacial microstructures in Cu/SiO2 hybrid joints during temperature cycling tests. Journal of Materials Research and Technology. 33. 9811–9819. 2 indexed citations
8.
Tran, Dinh-Phuc, et al.. (2024). Enhanced thermal expansion with nanocrystalline Cu in SiO2 vias for hybrid bonding. Applied Surface Science. 672. 160784–160784. 9 indexed citations
9.
Chiu, Wei-Lan, et al.. (2024). Low-Temperature Cu-Cu Bonding Using <111>-oriented and Nanocrystalline Hybrid Surface Grains. 1312–1316. 10 indexed citations
10.
11.
Tran, Dinh-Phuc, et al.. (2023). Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented nanotwinned Cu with Ar plasma surface modification. Applied Surface Science. 636. 157854–157854. 20 indexed citations
12.
Yang, Shih‐Chi, Dinh-Phuc Tran, Wei-Lan Chiu, et al.. (2023). Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine-pitch Vias for Cu/SiO2 Hybrid Bonding. 13–14. 1 indexed citations
13.
Yang, Shih‐Chi, et al.. (2023). Periodic reverse electrodeposition of (1 1 1)-oriented nanotwinned Cu in small damascene SiO2 vias. Journal of Electroanalytical Chemistry. 935. 117328–117328. 14 indexed citations
14.
15.
Tran, Dinh-Phuc, Wei-Lan Chiu, Shih‐Chi Yang, et al.. (2023). Potassium hydroxide surface modification for low temperature Cu/SiO2 hybrid bonding. Surfaces and Interfaces. 40. 103076–103076. 4 indexed citations
16.
Lin, Yu-Min, Wei-Lan Chiu, Tao‐Chih Chang, et al.. (2022). A hybrid bonding interconnection with a novel low-temperature bonding polymer system. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 2128–2134. 11 indexed citations
17.
Chiu, Wei-Lan, et al.. (2021). Low Temperature Wafer-To-Wafer Hybrid Bonding by Nanotwinned Copper. 365–370. 29 indexed citations
18.
Chiu, Wei-Lan, Chia-Wen Chiang, & Hsiang‐Hung Chang. (2021). Low Temperature Bonding with Wafer Level Nanocrystalline Cu Film. 97–98. 5 indexed citations
19.
20.
Chiu, Wei-Lan, et al.. (2020). Fabrication and characteristics of highly $$\langle {110} \rangle $$-oriented nanotwinned Au films. Scientific Reports. 10(1). 16566–16566. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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