Dhananjay Panchagade
- Electrical and Electronic Engineering top 10%
- Mechanics of Materials top 10%
- Civil and Structural Engineering top 10%
- Industrial and Manufacturing Engineering top 5%
- Mechanical Engineering
- Co-authors
- Pradeep LallJeff SuhlingWayne JohnsonSandeep ShantaramDeepti IyengarJeffrey C. SuhlingSameep GuptePrashant Gupta
- Topics
- Electronic Packaging and Soldering Technologies (22 papers)Integrated Circuits and Semiconductor Failure Analysis (12 papers)Electrostatic Discharge in Electronics (11 papers)
- Cited by
- Electrical and Electronic EngineeringIndustrial and Manufacturing EngineeringCivil and Structural Engineering
- Journals
- Progress in Photovoltaics Research and ApplicationsIEEE Transactions on Components and Packaging TechnologiesJournal of Electronic Packaging
- Partner nations
- United StatesGermany
In The Last Decade
Dhananjay Panchagade
31 papers receiving 688 citations
Peers
Comparison fields: 5 of 38
- Electrical and Electronic Engineering 605
- Mechanics of Materials 155
- Civil and Structural Engineering 146
- Industrial and Manufacturing Engineering 104
- Mechanical Engineering 93
Countries citing papers authored by Dhananjay Panchagade
This map shows the geographic impact of Dhananjay Panchagade's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dhananjay Panchagade with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dhananjay Panchagade more than expected).
Fields of papers citing papers by Dhananjay Panchagade
This network shows the impact of papers produced by Dhananjay Panchagade. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dhananjay Panchagade. The network helps show where Dhananjay Panchagade may publish in the future.
Co-authorship network of co-authors of Dhananjay Panchagade
This figure shows the co-authorship network connecting the top 25 collaborators of Dhananjay Panchagade. A scholar is included among the top collaborators of Dhananjay Panchagade based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Dhananjay Panchagade. Dhananjay Panchagade is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | A Literature Review on Automated Manual Transmission (AMT) | 4 |
| 2 | 47 | |
| 3 | Development of DC Motor Controlled Automated Manual Transmission (AMT) | 1 |
| 4 | 9 | |
| 5 | 10 | |
| 6 | 25 | |
| 7 | 3 | |
| 8 | 14 | |
| 9 | 6 | |
| 10 | 1 | |
| 11 | 30 | |
| 12 | 2 | |
| 13 | 21 | |
| 14 | 45 | |
| 15 | 14 | |
| 16 | 51 | |
| 17 | 69 | |
| 18 | 1 | |
| 19 | 5 | |
| 20 | 104 |
About Dhananjay Panchagade
Dhananjay Panchagade is a scholar working on Electrical and Electronic Engineering, Industrial and Manufacturing Engineering and Mechanics of Materials, having authored 31 papers that have together received 703 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (22 papers), Integrated Circuits and Semiconductor Failure Analysis (12 papers) and Electrostatic Discharge in Electronics (11 papers). The work is most often cited by research in Electrical and Electronic Engineering (605 citations), Industrial and Manufacturing Engineering (104 citations) and Civil and Structural Engineering (146 citations). Dhananjay Panchagade has collaborated with scholars based in United States and Germany. Frequent co-authors include Pradeep Lall, Jeff Suhling, Wayne Johnson, Sandeep Shantaram, Deepti Iyengar, Jeffrey C. Suhling, Sameep Gupte, Prashant Gupta, Ranjit Pandher and Matthew O. Reese. Their work appears in journals such as Progress in Photovoltaics Research and Applications, IEEE Transactions on Components and Packaging Technologies and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.