Michael J. Bozack
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Silicon Carbide Semiconductor Technologies
- Mechanical Engineering top 1%
- Aluminum Alloys Composites Properties
- Electrical Contact Performance and Analysis
- Intermetallics and Advanced Alloy Properties
Papers in
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- Electronic Packaging and Soldering Technologies 69
- 3D IC and TSV technologies 36
- Semiconductor materials and devices 16
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- Electrical Contact Performance and Analysis 21
- Aluminum Alloys Composites Properties 16
- Co-authors
- Jeffrey C. Suhling (42 shared papers)Pradeep Lall (34 shared papers)W. J. Choyke (7 shared papers)John T. Yates (7 shared papers)George T. Flowers (36 shared papers)John R. Williams (16 shared papers)Zijie Cai (7 shared papers)John L. Evans (20 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (7 papers)Journal of Applied Physics (6 papers)Surface Science (5 papers)IEEE Transactions on Components and Packaging Technologies (4 papers)IEEE Transactions on Electronics Packaging Manufacturing (3 papers)
- Partner nations
- United StatesChinaSouth Korea
In The Last Decade
Michael J. Bozack
148 papers receiving 3.7k citations
Peers
Comparison fields: 5 of 100
- Electrical and Electronic Engineering 2.6k
- Mechanical Engineering 1.4k
- Mechanics of Materials 672
- Aerospace Engineering 587
- Electronic, Optical and Magnetic Materials 402
Countries citing papers authored by Michael J. Bozack
This map shows the geographic impact of Michael J. Bozack's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael J. Bozack with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael J. Bozack more than expected).
Fields of papers citing papers by Michael J. Bozack
This network shows the impact of papers produced by Michael J. Bozack. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael J. Bozack. The network helps show where Michael J. Bozack may publish in the future.
Co-authors
The 25 scholars most cited alongside Michael J. Bozack, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 154 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 201 | |
| 2 | 1987 | 163 | |
| 3 | 1995 | 158 | |
| 4 | 2007 | 135 | |
| 5 | 2006 | 128 | |
| 6 | 2010 | 113 | |
| 7 | 2008 | 113 | |
| 8 | 2006 | 104 | |
| 9 | 2012 | 86 | |
| 10 | 2013 | 84 | |
| 11 | 2013 | 82 | |
| 12 | 1986 | 80 | |
| 13 | 1997 | 80 | |
| 14 | 2006 | 74 | |
| 15 | 2013 | 69 | |
| 16 | 2007 | 67 | |
| 17 | 2009 | 64 | |
| 18 | 2018 | 63 | |
| 19 | 2004 | 60 | |
| 20 | 2014 | 52 |
About Michael J. Bozack
Michael J. Bozack is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Materials Chemistry and Aerospace Engineering, having authored 154 papers that have together received 3.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (69 papers), 3D IC and TSV technologies (36 papers), Aluminum Alloy Microstructure Properties (21 papers), Electrical Contact Performance and Analysis (21 papers), Mechanical stress and fatigue analysis (17 papers), Aluminum Alloys Composites Properties (16 papers), Semiconductor materials and devices (16 papers) and Metal and Thin Film Mechanics (15 papers). The work is most often cited by research in Electrical and Electronic Engineering (2.6k citations), Mechanical Engineering (1.4k citations), Mechanics of Materials (672 citations), Aerospace Engineering (587 citations) and Electronic, Optical and Magnetic Materials (402 citations). Michael J. Bozack has collaborated with scholars based in United States, China and South Korea. Frequent co-authors include Jeffrey C. Suhling, Pradeep Lall, W. J. Choyke, John T. Yates, George T. Flowers, John R. Williams, Zijie Cai, John L. Evans, Yifei Zhang and Hongtao Ma. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Applied Physics, Surface Science, IEEE Transactions on Components and Packaging Technologies and IEEE Transactions on Electronics Packaging Manufacturing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.