Abhijit Dasgupta
- Electrical and Electronic Engineering top 2%
- Mechanics of Materials top 0.5%
- Mechanical Engineering top 1%
- Civil and Structural Engineering top 2%
- Materials Chemistry top 10%
- Co-authors
- Michael PechtR. K. AgarwalD. B. BarkerJames S. SirkisPradeep SharmaLeila LadaniQian JiangMichael Osterman
- Topics
- Electronic Packaging and Soldering Technologies (160 papers)3D IC and TSV technologies (62 papers)Aluminum Alloys Composites Properties (34 papers)
- Partner nations
- United StatesFinlandNetherlands
In The Last Decade
Abhijit Dasgupta
256 papers receiving 3.6k citations
Peers
Comparison fields: 5 of 97
- Electrical and Electronic Engineering 2.3k
- Mechanics of Materials 1.4k
- Mechanical Engineering 1.3k
- Civil and Structural Engineering 548
- Materials Chemistry 486
Countries citing papers authored by Abhijit Dasgupta
This map shows the geographic impact of Abhijit Dasgupta's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Abhijit Dasgupta with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Abhijit Dasgupta more than expected).
Fields of papers citing papers by Abhijit Dasgupta
This network shows the impact of papers produced by Abhijit Dasgupta. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Abhijit Dasgupta. The network helps show where Abhijit Dasgupta may publish in the future.
Co-authorship network of co-authors of Abhijit Dasgupta
This figure shows the co-authorship network connecting the top 25 collaborators of Abhijit Dasgupta. A scholar is included among the top collaborators of Abhijit Dasgupta based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Abhijit Dasgupta. Abhijit Dasgupta is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 0 | |
| 3 | 4 | |
| 4 | 1 | |
| 5 | 0 | |
| 6 | 1 | |
| 7 | 13 | |
| 8 | 0 | |
| 9 | 1 | |
| 10 | 15 | |
| 11 | 3 | |
| 12 | 37 | |
| 13 | 61 | |
| 14 | 20 | |
| 15 | 17 | |
| 16 | 30 | |
| 17 | 12 | |
| 18 | 48 | |
| 19 | 7 | |
| 20 | 37 |
About Abhijit Dasgupta
Abhijit Dasgupta is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Mechanical Engineering, having authored 269 papers that have together received 3.9k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (160 papers), 3D IC and TSV technologies (62 papers) and Aluminum Alloys Composites Properties (34 papers). The work is most often cited by research in Mechanics of Materials (1.4k citations), Electrical and Electronic Engineering (2.3k citations) and Mechanical Engineering (1.3k citations). Abhijit Dasgupta has collaborated with scholars based in United States, Finland and Netherlands. Frequent co-authors include Michael Pecht, R. K. Agarwal, D. B. Barker, James S. Sirkis, Pradeep Sharma, Leila Ladani, Qian Jiang, Michael Osterman, Jun Hu and Siddhartha Das. Their work appears in journals such as Physical review. B, Condensed matter, Acta Materialia and ACS Applied Materials & Interfaces.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.