Abhijit Dasgupta

5.1k total citations
269 papers, 3.9k citations indexed

About

Abhijit Dasgupta is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Abhijit Dasgupta has authored 269 papers receiving a total of 3.9k indexed citations (citations by other indexed papers that have themselves been cited), including 197 papers in Electrical and Electronic Engineering, 107 papers in Mechanical Engineering and 98 papers in Mechanics of Materials. Recurrent topics in Abhijit Dasgupta's work include Electronic Packaging and Soldering Technologies (160 papers), 3D IC and TSV technologies (62 papers) and Aluminum Alloys Composites Properties (34 papers). Abhijit Dasgupta is often cited by papers focused on Electronic Packaging and Soldering Technologies (160 papers), 3D IC and TSV technologies (62 papers) and Aluminum Alloys Composites Properties (34 papers). Abhijit Dasgupta collaborates with scholars based in United States, Finland and Netherlands. Abhijit Dasgupta's co-authors include Michael Pecht, R. K. Agarwal, D. B. Barker, James S. Sirkis, Pradeep Sharma, Leila Ladani, Qian Jiang, Michael Osterman, Jun Hu and Siddhartha Das and has published in prestigious journals such as Physical review. B, Condensed matter, Acta Materialia and ACS Applied Materials & Interfaces.

In The Last Decade

Abhijit Dasgupta

256 papers receiving 3.6k citations

Peers

Countries citing papers authored by Abhijit Dasgupta

Since Specialization

Citations

This map shows the geographic impact of Abhijit Dasgupta's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Abhijit Dasgupta with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Abhijit Dasgupta more than expected).

Fields of papers citing papers by Abhijit Dasgupta

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Abhijit Dasgupta. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Abhijit Dasgupta. The network helps show where Abhijit Dasgupta may publish in the future.

Co-authorship network of co-authors of Abhijit Dasgupta

This figure shows the co-authorship network connecting the top 25 collaborators of Abhijit Dasgupta. A scholar is included among the top collaborators of Abhijit Dasgupta based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Abhijit Dasgupta. Abhijit Dasgupta is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Title	Journal	Authors	Indexed citations
1	Integrating state-space modeling, parameter estimation, deep learning, and docking techniques in drug repurposing: a case study on COVID-19 cytokine storm	Journal of the American Medical Informatics Association	Rajat K. De, Abhijit Dasgupta et al.	3
2	Development of Highly Conductive and Stable Direct Writeable Metal-Free Inks Based on Carbon Nanotube and Functionalized Graphene Oxide	ACS Applied Materials & Interfaces	Abhijit Dasgupta, Siddhartha Das et al.	0
3	Performance Evaluation of Vector Embeddings with Retrieval-Augmented Generation		Sanjay Kukreja, Abhijit Dasgupta et al.	4
4	Flexible and twistable free-standing PDMS-magnetic-nanoparticle-based soft magnetic films with robust magnetic properties	Flexible and Printed Electronics	Xinjun Wang, Ichiro Takeuchi et al.	1
5	Effect of microstructural variability on fatigue simulations of solder joints	Microelectronics Reliability	M. van Soestbergen, Abhijit Dasgupta et al.	0
6	Direct visualization of nanoparticle morphology in thermally sintered nanoparticle ink traces and the relationship among nanoparticle morphology, incomplete polymer removal, and trace conductivity	Nanotechnology	Vishal Sankar Sivasankar, Mei Wang et al.	1
7	Printed Carbon Nanotube-Based Humidity Sensors Deployable on Surfaces of Widely Varying Curvatures	ACS Applied Nano Materials	Vishal Sankar Sivasankar, Abhijit Dasgupta et al.	13
8	In Situ Monitoring of Creep Deformation in Single Crystal SAC305 Solder Joint at Different Temperatures		Abhijit Dasgupta et al.	0
9	Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels		Abhijit Dasgupta, Jian Yu et al.	1
10	Applications, fluid mechanics, and colloidal science of carbon-nanotube-based 3D printable inks	Nanoscale	Vishal Sankar Sivasankar, Shayandev Sinha et al.	15
11	A fiber optic conjugate stress sensor for instantaneous tangent modulus detection targeting prognostic health monitoring applications	Smart Materials and Structures	Miao Yu, Abhijit Dasgupta et al.	3
12	Ultrathin and Ultrasensitive Printed Carbon Nanotube-Based Temperature Sensors Capable of Repeated Uses on Surfaces of Widely Varying Curvatures and Wettabilities	ACS Applied Materials & Interfaces	Vishal Sankar Sivasankar, Abhijit Dasgupta et al.	37
13	Considerations of aerosol-jet printing for the fabrication of printed hybrid electronic circuits	Additive manufacturing	D. R. Hines, Andrew Martin et al.	61
14	Shape-driven arrest of coffee stain effect drives the fabrication of carbon-nanotube-graphene-oxide inks for printing embedded structures and temperature sensors	Nanoscale	Yanbin Wang, Shayandev Sinha et al.	20
15	Cracks in the 3D-printed conductive traces of silver nanoparticle ink	Journal of Micromechanics and Microengineering	Yuan Gu, Daniel R. Hines et al.	17
16	MEMS Packaging Reliability in Board-Level Drop Tests Under Severe Shock and Impact Loading Conditions–Part I: Experiment	IEEE Transactions on Components Packaging and Manufacturing Technology	Abhijit Dasgupta et al.	30
17	MEMS Packaging Reliability in Board-Level Drop Tests Under Severe Shock and Impact Loading Conditions—Part II: Fatigue Damage Modeling	IEEE Transactions on Components Packaging and Manufacturing Technology	Abhijit Dasgupta et al.	12
18	Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder	International Journal of Plasticity	Abhijit Dasgupta, Thomas R. Bieler et al.	48
19	Effect of Stress Relaxation on Board Level Reliability of Sn Based Pb-Free Solders		Michael Osterman, Bongtae Han et al.	7
20	A nonlinear Galerkin finite-element theory for modeling magnetostrictive smart structures	Smart Materials and Structures	Abhijit Dasgupta et al.	37

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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