Michael Osterman
- Automotive Engineering top 0.5%
- Advanced Battery Technologies Research 13
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- Electronic Packaging and Soldering Technologies 89
- 3D IC and TSV technologies 46
- Integrated Circuits and Semiconductor Failure Analysis 15
- Advancements in Battery Materials 9
- Mechanical Engineering top 5%
- Advanced Welding Techniques Analysis 17
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- Manufacturing Process and Optimization 10
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- Aluminum Alloy Microstructure Properties 10
- Co-authors
- Michael PechtNicholas WilliardWei HeHaiyu QiAbhijit DasguptaBhanu SoodYunhan HuangArvind Sai Sarathi Vasan
- Cited by
- Automotive EngineeringSafety, Risk, Reliability and QualityElectrical and Electronic Engineering
- Journals
- IEEE Transactions on Device and Materials Reliability (12 papers)Journal of Electronic Materials (9 papers)Microelectronics Reliability (8 papers)
- Partner nations
- United StatesHong KongJapan
In The Last Decade
Michael Osterman
125 papers receiving 2.5k citations
Hit Papers
Peers
Comparison fields: 5 of 77
- Automotive Engineering 1000
- Safety, Risk, Reliability and Quality 495
- Electrical and Electronic Engineering 1.9k
- Control and Systems Engineering 424
- Mechanical Engineering 598
Countries citing papers authored by Michael Osterman
This map shows the geographic impact of Michael Osterman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael Osterman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael Osterman more than expected).
Fields of papers citing papers by Michael Osterman
This network shows the impact of papers produced by Michael Osterman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael Osterman. The network helps show where Michael Osterman may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Michael Osterman, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 2 | |
| 2 | 2025 | 0 | |
| 3 | 2024 | 1 | |
| 4 | 2024 | 1 | |
| 5 | 2024 | 1 | |
| 6 | 2020 | 16 | |
| 7 | 2018 | 1 | |
| 8 | 2018 | 1 | |
| 9 | 2015 | 0 | |
| 10 | 2013 | 14 | |
| 11 | 2012 | 0 | |
| 12 | 2012 | 3 | |
| 13 | 2012 | 2 | |
| 14 | 2009 | 2 | |
| 15 | 2009 | 19 | |
| 16 | 2006 | 18 | |
| 17 | 2005 | 7 | |
| 18 | 2004 | 3 | |
| 19 | 2003 | 6 | |
| 20 | 1989 | 34 |
About Michael Osterman
Michael Osterman is a scholar working on Electrical and Electronic Engineering, General Materials Science, Automotive Engineering, Mechanical Engineering and Industrial and Manufacturing Engineering, having authored 131 papers that have together received 2.6k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (89 papers), 3D IC and TSV technologies (46 papers), Advanced Welding Techniques Analysis (17 papers), Integrated Circuits and Semiconductor Failure Analysis (15 papers), Advanced Battery Technologies Research (13 papers), Manufacturing Process and Optimization (10 papers), Aluminum Alloy Microstructure Properties (10 papers) and Advancements in Battery Materials (9 papers). The work is most often cited by research in Automotive Engineering (1000 citations), Safety, Risk, Reliability and Quality (495 citations), Electrical and Electronic Engineering (1.9k citations), Control and Systems Engineering (424 citations) and Mechanical Engineering (598 citations). Michael Osterman has collaborated with scholars based in United States, Hong Kong and Japan. Frequent co-authors include Michael Pecht, Nicholas Williard, Wei He, Haiyu Qi, Abhijit Dasgupta, Bhanu Sood, Yunhan Huang, Arvind Sai Sarathi Vasan, Sony Mathew and Diganta Das. Their work appears in journals such as IEEE Transactions on Device and Materials Reliability, Journal of Electronic Materials, Microelectronics Reliability, IEEE Transactions on Components and Packaging Technologies and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.