Michael Osterman

3.5k total citations · 1 hit paper
131 papers, 2.6k citations indexed

About

Michael Osterman is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Michael Osterman has authored 131 papers receiving a total of 2.6k indexed citations (citations by other indexed papers that have themselves been cited), including 113 papers in Electrical and Electronic Engineering, 45 papers in Mechanical Engineering and 21 papers in Mechanics of Materials. Recurrent topics in Michael Osterman's work include Electronic Packaging and Soldering Technologies (89 papers), 3D IC and TSV technologies (46 papers) and Advanced Welding Techniques Analysis (17 papers). Michael Osterman is often cited by papers focused on Electronic Packaging and Soldering Technologies (89 papers), 3D IC and TSV technologies (46 papers) and Advanced Welding Techniques Analysis (17 papers). Michael Osterman collaborates with scholars based in United States, Hong Kong and Japan. Michael Osterman's co-authors include Michael Pecht, Nicholas Williard, Wei He, Haiyu Qi, Abhijit Dasgupta, Bhanu Sood, Yunhan Huang, Arvind Sai Sarathi Vasan, Sony Mathew and Tong Fang and has published in prestigious journals such as Journal of Power Sources, IEEE Access and Applied Surface Science.

In The Last Decade

Michael Osterman

125 papers receiving 2.5k citations

Hit Papers

Prognostics of lithium-ion batteries based on Dempster–Sh... 2011 2026 2016 2021 2011 250 500 750
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Prognostics of lithium-ion batteries based on Dempster–Shafer theory and the Bayesian Monte Carlo method
    2011 823 citations Michael Osterman, Michael Pecht et al. profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Michael Osterman United States 23 1.9k 1000 598 495 424 131 2.6k
Lifeng Wu China 26 925 0.5× 921 0.9× 507 0.8× 361 0.7× 820 1.9× 77 2.3k
Juner Zhu United States 27 1.9k 1.0× 1.9k 1.9× 635 1.1× 90 0.2× 253 0.6× 68 2.9k
Taejung Yeo South Korea 19 1.1k 0.6× 1.1k 1.1× 575 1.0× 204 0.4× 227 0.5× 29 1.8k
Elias G. Strangas United States 32 2.6k 1.4× 345 0.3× 1.2k 2.0× 251 0.5× 2.4k 5.8× 133 4.2k
Ke Ma China 38 6.4k 3.3× 487 0.5× 656 1.1× 204 0.4× 2.6k 6.2× 195 6.9k
Abhijit Dasgupta United States 33 2.3k 1.2× 171 0.2× 1.3k 2.2× 237 0.5× 228 0.5× 269 3.9k
Yatish Patel United Kingdom 27 2.6k 1.3× 2.4k 2.4× 406 0.7× 70 0.1× 96 0.2× 75 3.4k
Seungdeog Choi United States 25 1.9k 1.0× 247 0.2× 548 0.9× 71 0.1× 1.2k 2.8× 167 2.5k
Hamid Gualous France 33 2.4k 1.3× 2.1k 2.1× 120 0.2× 147 0.3× 709 1.7× 136 3.2k
M.M. Morcos United States 25 2.1k 1.1× 441 0.4× 250 0.4× 123 0.2× 1.2k 2.7× 120 2.6k

Countries citing papers authored by Michael Osterman

Since Specialization
Citations

This map shows the geographic impact of Michael Osterman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael Osterman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael Osterman more than expected).

Fields of papers citing papers by Michael Osterman

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Michael Osterman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael Osterman. The network helps show where Michael Osterman may publish in the future.

Co-authorship network of co-authors of Michael Osterman

This figure shows the co-authorship network connecting the top 25 collaborators of Michael Osterman. A scholar is included among the top collaborators of Michael Osterman based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Michael Osterman. Michael Osterman is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Rauf, Huzaifa, et al.. (2025). Swelling Mechanisms, Diagnostic Applications, and Mitigation Strategies in Lithium-Ion Batteries. Batteries. 11(10). 356–356. 2 indexed citations
2.
Kong, Lingxi, et al.. (2025). The Impact of C-Rate, Float Charging and Temperature on Pouch Lithium-Ion Battery Swelling. Batteries. 11(11). 419–419.
3.
Chen, Deng, Michael Osterman, Carol A. Handwerker, & Sa’d Hamasha. (2024). Criteria for Solder Alloy Adoption. 37(1). 2–7. 1 indexed citations
4.
Osterman, Michael, et al.. (2024). Swelling in Lithium-Ion Pouch Batteries. 1–4. 1 indexed citations
5.
Wang, Menghong, et al.. (2024). The Effect of Board Design on the Drop Shock Performance of Lead-Free Solder Alloys. 26(1). 612–620. 1 indexed citations
6.
Osterman, Michael, et al.. (2020). Energy based modeling for temperature cycling induced tin silver copper solder interconnect fatigue life. Microelectronics Reliability. 109. 113651–113651. 16 indexed citations
7.
Coyle, Richard, Richard D. Parker, Michael Osterman, et al.. (2018). Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys. 20(1). 1 indexed citations
8.
Coyle, Richard, Richard D. Parker, Michael Osterman, et al.. (2018). The Effect of Bismuth, Antimony, or Indium on the Thermal Fatigue of High Reliability Pb-Free Solder Alloys. 20(1). 1 indexed citations
9.
10.
Osterman, Michael, et al.. (2013). Effect of ENEPIG Surface Finish on the Vibration Reliability of Solder Interconnects. IMAPSource Proceedings. 2013(1). 115–119. 5 indexed citations
11.
Sood, Bhanu, Michael Osterman, & Michael Pecht. (2013). Health monitoring of lithium-ion batteries. 47 indexed citations
12.
13.
Osterman, Michael, et al.. (2012). Reliability of gull-wing and leadless packages subjected to temperature cycling after rework. IEEE Transactions on Device and Materials Reliability. 12(2). 510–519. 3 indexed citations
14.
Nie, Lei, Michael Osterman, & Michael Pecht. (2010). Microstructural Analysis of Reworked Ball Grid Array Assemblies Under Thermomechanical Loading Conditions. IEEE Transactions on Device and Materials Reliability. 10(2). 276–286. 3 indexed citations
15.
Dasgupta, Abhijit, et al.. (2009). Vibration Durability of Sn3.0Ag0.5Cu (SAC305) Solder Interconnects: Harmonic and Random Excitation. 52(1). 63–86. 2 indexed citations
16.
Chauhan, Preeti, Michael Pecht, Michael Osterman, & S. W. Ricky Lee. (2009). Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability. IEEE Transactions on Components and Packaging Technologies. 32(3). 693–700. 42 indexed citations
17.
Osterman, Michael, et al.. (2007). Length Distribution Analysis for Tin Whisker Growth. IEEE Transactions on Electronics Packaging Manufacturing. 30(1). 36–40. 10 indexed citations
18.
Mathew, Sony, et al.. (2006). Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board. Journal of Electronic Packaging. 128(4). 339–345. 18 indexed citations
19.
Osterman, Michael, et al.. (2005). Effect of Stress Relaxation on Board Level Reliability of Sn Based Pb-Free Solders. 2. 1210–1214. 7 indexed citations
20.
Qi, Haiyu, Mikyoung Lee, Michael Osterman, et al.. (2004). Simulation model development for solder joint reliability for high performance FBGA assemblies. 300–307. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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