Paul R. Besser

1.2k total citations
68 papers, 903 citations indexed

About

Paul R. Besser is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, Paul R. Besser has authored 68 papers receiving a total of 903 indexed citations (citations by other indexed papers that have themselves been cited), including 49 papers in Electrical and Electronic Engineering, 47 papers in Electronic, Optical and Magnetic Materials and 25 papers in Mechanics of Materials. Recurrent topics in Paul R. Besser's work include Copper Interconnects and Reliability (47 papers), Semiconductor materials and devices (28 papers) and Metal and Thin Film Mechanics (25 papers). Paul R. Besser is often cited by papers focused on Copper Interconnects and Reliability (47 papers), Semiconductor materials and devices (28 papers) and Metal and Thin Film Mechanics (25 papers). Paul R. Besser collaborates with scholars based in United States, Canada and Belgium. Paul R. Besser's co-authors include J. C. Bravman, Paul A. Flinn, Young‐Chang Joo, Michael C. Madden, Linda Vanasupa, S. Brennan, T. Marieb, John E. Sanchez, David P. Field and A. Lauwers and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

Paul R. Besser

66 papers receiving 855 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Paul R. Besser United States 18 719 523 257 195 149 68 903
S. Hymes United States 10 439 0.6× 435 0.8× 145 0.6× 105 0.5× 116 0.8× 20 568
E. K. Broadbent United States 15 551 0.8× 224 0.4× 256 1.0× 341 1.7× 166 1.1× 30 761
T. Marieb United States 12 323 0.4× 321 0.6× 166 0.6× 84 0.4× 143 1.0× 45 522
Tik Sun United States 10 369 0.5× 304 0.6× 117 0.5× 169 0.9× 196 1.3× 20 548
Brad J. Burrow United States 9 490 0.7× 285 0.5× 307 1.2× 234 1.2× 134 0.9× 12 668
S. Vicknesh Singapore 19 732 1.0× 396 0.8× 101 0.4× 259 1.3× 224 1.5× 47 1.0k
M. A. Angadi Trinidad and Tobago 14 426 0.6× 442 0.8× 235 0.9× 248 1.3× 172 1.2× 83 776
K. Drescher Germany 12 387 0.5× 227 0.4× 214 0.8× 101 0.5× 149 1.0× 21 566
J. M. Molarius Finland 14 458 0.6× 232 0.4× 526 2.0× 130 0.7× 392 2.6× 46 816
E. M. Zielinski United States 10 289 0.4× 363 0.7× 284 1.1× 59 0.3× 237 1.6× 27 583

Countries citing papers authored by Paul R. Besser

Since Specialization
Citations

This map shows the geographic impact of Paul R. Besser's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Paul R. Besser with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Paul R. Besser more than expected).

Fields of papers citing papers by Paul R. Besser

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Paul R. Besser. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Paul R. Besser. The network helps show where Paul R. Besser may publish in the future.

Co-authorship network of co-authors of Paul R. Besser

This figure shows the co-authorship network connecting the top 25 collaborators of Paul R. Besser. A scholar is included among the top collaborators of Paul R. Besser based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Paul R. Besser. Paul R. Besser is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Vinci, Richard P., O. Kraft, Neville Reid Moody, & Paul R. Besser. (2013). Thin Films—Stresses and Mechanical Properties VIII. 2 indexed citations
3.
Murray, Conal E., E. Todd Ryan, Paul R. Besser, et al.. (2012). Understanding stress gradients in microelectronic metallization. Powder Diffraction. 27(2). 92–98. 2 indexed citations
4.
Murray, Conal E., Paul R. Besser, E. Todd Ryan, & Jean Jordan‐Sweet. (2011). Manipulating stress in Cu/low-k dielectric nanocomposites. Applied Physics Letters. 98(14). 3 indexed citations
5.
Murray, Conal E., E. Todd Ryan, Paul R. Besser, et al.. (2010). Evolution of stress gradients in Cu films and features induced by capping layers. Microelectronic Engineering. 92. 95–100. 4 indexed citations
6.
Field, David P., et al.. (2005). Texture Evolution in Thin Cu Films and Lines. Materials science forum. 495-497. 1323–1332. 6 indexed citations
7.
Besser, Paul R., et al.. (2003). Silicides for the 65 nm Technology Node. MRS Proceedings. 766. 4 indexed citations
8.
Besser, Paul R., et al.. (2003). A low-temperature metal-doping technique for engineering the gate electrode of replacement metal gate CMOS transistors. IEEE Electron Device Letters. 24(9). 547–549. 7 indexed citations
9.
Besser, Paul R., et al.. (2003). Mechanical strain evolution in Cu/low K interconnect lines. MRS Proceedings. 795. 1 indexed citations
10.
Zschech, Ehrenfried & Paul R. Besser. (2002). Microstructure characterization of metal interconnects and barrier layers: status and future. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 563. 233–235. 4 indexed citations
11.
Hogue, Henry H., et al.. (1999). Gallium-Doped Silicon Blocked-Impurity-Band Detectors. Defense Technical Information Center (DTIC). 1 indexed citations
12.
Maex, Karen, A. Lauwers, Paul R. Besser, et al.. (1999). Self-aligned CoSi/sub 2/ for 0.18 μm and below. IEEE Transactions on Electron Devices. 46(7). 1545–1550. 41 indexed citations
13.
Maex, Karen, Eiichi Kondoh, A. Lauwers, et al.. (1998). Control and Impact of Processing Ambient During Rapid Thermal Silicidation. MRS Proceedings. 525. 9 indexed citations
14.
Besser, Paul R., A. Lauwers, Karen Maex, et al.. (1998). The Influence of Capping Layer Type on Cobalt Salicide Formation in Films and Narrow Lines. MRS Proceedings. 514. 17 indexed citations
15.
Sanchez, John E., Paul R. Besser, & David P. Field. (1998). Microstructure of damascene processed Al-Cu interconnects for integrated circuit applications. 230–235. 2 indexed citations
16.
Besser, Paul R., et al.. (1997). The Microstructure and Electromigration Performance of Damascene-Fabricated Aluminum Interconnects. MRS Proceedings. 473. 7 indexed citations
17.
Besser, Paul R. & J. C. Bravman. (1994). X-ray determination of strains, stress, and relaxation in interconnect metallizations. AIP conference proceedings. 305. 46–61. 4 indexed citations
18.
Brown, D. D., Paul R. Besser, John E. Sanchez, M. A. Korhonen, & Che‐Yu Li. (1994). Effect of CU and SI in Aluminum on Stress Change and on TiAl3 Formation in Al Alloy/TI Bilayer Films During Annealing. MRS Proceedings. 356. 5 indexed citations
19.
Venkatraman, Ramnath, Paul R. Besser, J. C. Bravman, & S. Brennan. (1994). Elastic strain gradients and x-ray line broadening effects as a function of temperature in aluminum thin films on silicon. Journal of materials research/Pratt's guide to venture capital sources. 9(2). 328–335. 22 indexed citations
20.
Besser, Paul R., Michael C. Madden, & Paul A. Flinn. (1992). In situ scanning electron microscopy observation of the dynamic behavior of electromigration voids in passivated aluminum lines. Journal of Applied Physics. 72(8). 3792–3797. 64 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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