S. Hymes

655 total citations
20 papers, 568 citations indexed

About

S. Hymes is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, S. Hymes has authored 20 papers receiving a total of 568 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 15 papers in Electronic, Optical and Magnetic Materials and 6 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in S. Hymes's work include Copper Interconnects and Reliability (15 papers), Semiconductor materials and devices (11 papers) and Semiconductor materials and interfaces (6 papers). S. Hymes is often cited by papers focused on Copper Interconnects and Reliability (15 papers), Semiconductor materials and devices (11 papers) and Semiconductor materials and interfaces (6 papers). S. Hymes collaborates with scholars based in United States and Sweden. S. Hymes's co-authors include W. A. Lanford, S. P. Murarka, Peng Ding, Wei Wang, Matthew J. Banet, L. J. Schowalter, Michael Joffe, John Nguyen, Tom J. Brown and William A. Sands and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Thin Solid Films.

In The Last Decade

S. Hymes

20 papers receiving 541 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
S. Hymes United States	10	439	435	145	116	105	20	568
T. Marieb United States	12	323 0.7×	321 0.7×	166 1.1×	143 1.2×	84 0.8×	45	522
Paul R. Besser United States	18	719 1.6×	523 1.2×	257 1.8×	149 1.3×	195 1.9×	68	903
R. Ruiz United States	13	449 1.0×	299 0.7×	235 1.6×	140 1.2×	181 1.7×	32	566
E. M. Zielinski United States	10	289 0.7×	363 0.8×	284 2.0×	237 2.0×	59 0.6×	27	583
Tik Sun United States	10	369 0.8×	304 0.7×	117 0.8×	196 1.7×	169 1.6×	20	548
Ramnath Venkatraman United States	6	183 0.4×	243 0.6×	336 2.3×	185 1.6×	83 0.8×	12	470
K. Drescher Germany	12	387 0.9×	227 0.5×	214 1.5×	149 1.3×	101 1.0×	21	566
Evgeny E. Glickman Israel	14	279 0.6×	235 0.5×	93 0.6×	183 1.6×	82 0.8×	41	539
Ronald S. Nowicki United States	10	255 0.6×	98 0.2×	125 0.9×	97 0.8×	150 1.4×	19	366
J.J. van den Broek Netherlands	11	107 0.2×	209 0.5×	98 0.7×	167 1.4×	104 1.0×	26	431

Countries citing papers authored by S. Hymes

Since Specialization

Citations

This map shows the geographic impact of S. Hymes's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Hymes with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Hymes more than expected).

Fields of papers citing papers by S. Hymes

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. Hymes. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Hymes. The network helps show where S. Hymes may publish in the future.

Co-authorship network of co-authors of S. Hymes

This figure shows the co-authorship network connecting the top 25 collaborators of S. Hymes. A scholar is included among the top collaborators of S. Hymes based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. Hymes. S. Hymes is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Boning, Duane S., et al.. (1999). MULTI-LEVEL PATTERN EFFECTS IN COPPER CMP. 5 indexed citations

Hymes, S., Tom J. Brown, Michael Joffe, et al.. (1999). Determination of the Planarization Distance for Copper CMP Process. MRS Proceedings. 566. 9 indexed citations

Hymes, S., et al.. (1998). Thermal stability of copper silicide passivation layers in copper-based multilevel interconnects. Journal of Applied Physics. 83(8). 4507–4512. 19 indexed citations

Hymes, S., et al.. (1998). Surface cleaning of copper by thermal and plasma treatment in reducing and inert ambients. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 16(3). 1107–1109. 3 indexed citations

Hymes, S., et al.. (1996). Oxidation Resistant Dilute Copper (Boron) Alloy Films Prepared by DC-Magnetron Cosputtering. MRS Proceedings. 427. 2 indexed citations

Ding, Peng, et al.. (1996). PASSIVATION OF COPPER BY LOW TEMPERATURE ANNEALING OF Cu/Mg/SiO₂ BILAYERS. Chemical Engineering Communications. 152-153(1). 253–259. 3 indexed citations

Hymes, S., et al.. (1996). Oxidation Resistant Dilute Copper (Boron) Alloy Films Prepared by DC-Magnetron Cosputtering. MRS Proceedings. 428. 2 indexed citations

Lanford, W. A., Peng Ding, Wei Wang, S. Hymes, & S. P. Murarka. (1995). Alloying of copper for use in microelectronic metallization. Materials Chemistry and Physics. 41(3). 192–198. 55 indexed citations

Lanford, W. A., et al.. (1995). Low-temperature passivation of copper by doping with Al or Mg. Thin Solid Films. 262(1-2). 234–241. 90 indexed citations

10.

Ding, Peng, et al.. (1994). Use of a rastered microbeam to study lateral diffusion of interest to microelectronics. Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms. 85(1-4). 167–170. 2 indexed citations

11.

Ding, Peng, et al.. (1994). Thermal annealing of buried Al barrier layers to passivate the surface of copper films. Applied Physics Letters. 65(14). 1778–1780. 40 indexed citations

12.

Ding, Peng, W. A. Lanford, S. Hymes, & S. P. Murarka. (1994). Effects of the addition of small amounts of Al to copper: Corrosion, resistivity, adhesion, morphology, and diffusion. Journal of Applied Physics. 75(7). 3627–3631. 123 indexed citations

13.

Ding, Peng, et al.. (1994). Investigation of the mechanism responsible for the corrosion resistance of B implanted copper. Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms. 85(1-4). 260–263. 14 indexed citations

14.

Ding, Peng, W. A. Lanford, S. Hymes, & S. P. Murarka. (1994). Oxidation resistant high conductivity copper films. Applied Physics Letters. 64(21). 2897–2899. 84 indexed citations

15.

Lanford, W. A., Peng Ding, S. Hymes, & S. P. Murarka. (1994). Surface and Interface Modification of Copper for Electronic Application. MRS Proceedings. 337. 5 indexed citations

16.

Hymes, S., et al.. (1993). Barriers to Strain Relaxation in Epitaxial Fluorides on Si(111). MRS Proceedings. 308. 3 indexed citations

17.

Ding, Peng, W. A. Lanford, S. Hymes, & S. P. Murarka. (1993). Annealing of boron-implanted corrosion resistant copper films. Journal of Applied Physics. 74(2). 1331–1334. 37 indexed citations

18.

Ding, Peng, Zheng Bo, Eric Eisenbraun, et al.. (1993). Observation of Reduced Oxidation Rates for Plasmaassisted CVD Copper Films. MRS Proceedings. 309. 3 indexed citations

19.

Hymes, S., et al.. (1992). Passivation of copper by silicide formation in dilute silane. Journal of Applied Physics. 71(9). 4623–4625. 60 indexed citations

20.

Lanford, W. A., et al.. (1992). Ion Implantation to Inhibit Corrosion of Copper. MRS Proceedings. 260. 9 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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