T. Marieb

960 total citations
45 papers, 522 citations indexed

About

T. Marieb is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Mechanics of Materials. According to data from OpenAlex, T. Marieb has authored 45 papers receiving a total of 522 indexed citations (citations by other indexed papers that have themselves been cited), including 36 papers in Electronic, Optical and Magnetic Materials, 29 papers in Electrical and Electronic Engineering and 13 papers in Mechanics of Materials. Recurrent topics in T. Marieb's work include Copper Interconnects and Reliability (36 papers), Electronic Packaging and Soldering Technologies (17 papers) and Semiconductor materials and devices (17 papers). T. Marieb is often cited by papers focused on Copper Interconnects and Reliability (36 papers), Electronic Packaging and Soldering Technologies (17 papers) and Semiconductor materials and devices (17 papers). T. Marieb collaborates with scholars based in United States, France and Germany. T. Marieb's co-authors include J. C. Bravman, Paul A. Flinn, Michael C. Madden, P. A. Flinn, Paul R. Besser, Donald S. Gardner, H. Fujimoto, B. W. Batterman, H. A. Padmore and W. L. Brown and has published in prestigious journals such as Physical Review Letters, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

T. Marieb

44 papers receiving 501 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
T. Marieb United States	12	323	321	166	143	85	45	522
H. Geisler Germany	12	226 0.7×	129 0.4×	171 1.0×	156 1.1×	118 1.4×	53	464
Scott Newman United States	12	143 0.4×	177 0.6×	108 0.7×	158 1.1×	36 0.4×	19	447
Paul R. Besser United States	18	719 2.2×	523 1.6×	257 1.5×	149 1.0×	90 1.1×	68	903
R. Ruiz United States	13	449 1.4×	299 0.9×	235 1.4×	140 1.0×	64 0.8×	32	566
Ilan A. Blech United States	10	268 0.8×	78 0.2×	130 0.8×	159 1.1×	56 0.7×	16	453
Miki Moriyama Japan	14	427 1.3×	247 0.8×	179 1.1×	222 1.6×	98 1.2×	26	611
Wei Chu United States	11	172 0.5×	76 0.2×	52 0.3×	176 1.2×	80 0.9×	38	445
T. Ohno Japan	14	309 1.0×	159 0.5×	143 0.9×	72 0.5×	82 1.0×	25	579
Yu. A. Vodakov Russia	15	445 1.4×	115 0.4×	69 0.4×	167 1.2×	90 1.1×	29	619
M.A. Kulakov Germany	15	272 0.8×	77 0.2×	123 0.7×	286 2.0×	210 2.5×	39	648

Countries citing papers authored by T. Marieb

Since Specialization

Citations

This map shows the geographic impact of T. Marieb's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Marieb with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Marieb more than expected).

Fields of papers citing papers by T. Marieb

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Marieb. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Marieb. The network helps show where T. Marieb may publish in the future.

Co-authorship network of co-authors of T. Marieb

This figure shows the co-authorship network connecting the top 25 collaborators of T. Marieb. A scholar is included among the top collaborators of T. Marieb based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Marieb. T. Marieb is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

He, Jun, Zhigang Suo, T. Marieb, & J. Maiz. (2004). Electromigration lifetime and critical void volume. Applied Physics Letters. 85(20). 4639–4641. 28 indexed citations

Spolenak, Ralph, W. L. Brown, Nobumichi Tamura, et al.. (2003). Local Plasticity of Al Thin Films as Revealed by X-Ray Microdiffraction. Physical Review Letters. 90(9). 96102–96102. 50 indexed citations

Bravman, J. C., et al.. (2003). The relationship between resistance changes and void volume changes in passivated aluminum interconnects. 473. 206–212. 1 indexed citations

Bravman, J. C., et al.. (2002). Stress-induced and electromigration voiding in aluminum interconnects passivated with silicon nitride. Journal of Applied Physics. 91(6). 3653–3657. 11 indexed citations

Bai, Gang, et al.. (2002). Copper interconnection deposition techniques and integration. 48–49. 3 indexed citations

Spolenak, Ralph, D. Barr, M. E. Gross, et al.. (2001). Microtexture and strain in electroplated copper interconnects. eScholarship (California Digital Library). 1 indexed citations

Lee, S.-H., et al.. (1999). Void nucleation on intentionally added defects in Al interconnects. Applied Physics Letters. 75(5). 633–635. 5 indexed citations

Ignat, Maria, T. Marieb, H. Fujimoto, & P. A. Flinn. (1999). Mechanical behaviour of submicron multilayers submitted to microtensile experiments. Thin Solid Films. 353(1-2). 201–207. 16 indexed citations

Bravman, J. C., et al.. (1999). A Detailed Study of Void Motion In Passivated Aluminum Interconnects. MRS Proceedings. 563. 3 indexed citations

10.

Bravman, J. C., et al.. (1999). Direct measurement of nucleation times and growth rates of electromigration induced voids. AIP conference proceedings. 15–26. 1 indexed citations

11.

Marieb, T., et al.. (1998). The Stress Change in Passivated Al Lines Due to the Reaction Between Ti and Al. MRS Proceedings. 516. 1 indexed citations

12.

Bravman, J. C., et al.. (1998). A Quantitative Study of Void Nucleation Times in Passivated Aluminum Interconnects. MRS Proceedings. 516. 3 indexed citations

13.

Lee, Samantha, J. C. Bravman, Paul A. Flinn, & T. Marieb. (1998). Comparisons of constraint effects on Al lines under various passivations. 277–282. 1 indexed citations

14.

Marieb, T., et al.. (1997). Thermal Conductivity Measurements of Interlevel Dielectrics. MRS Proceedings. 473. 3 indexed citations

15.

Besser, Paul R., T. Marieb, Jin Lee, Paul A. Flinn, & J. C. Bravman. (1996). Measurement and interpretation of strain relaxation in passivated Al–0.5% Cu lines. Journal of materials research/Pratt's guide to venture capital sources. 11(1). 184–193. 26 indexed citations

16.

Marieb, T., Maria Ignat, H. Fujimoto, & P. A. Flinn. (1995). Analysis of the Mechanical Failure in a Multilayered Thin Film System Tested by Microtensile Loading. MRS Proceedings. 391. 1 indexed citations

17.

Marieb, T., P. A. Flinn, J. C. Bravman, Donald S. Gardner, & Michael C. Madden. (1995). Observations of electromigration induced void nucleation and growth in polycrystalline and near-bamboo passivated Al lines. Journal of Applied Physics. 78(2). 1026–1032. 50 indexed citations

18.

Marieb, T., J. C. Bravman, P. A. Flinn, Donald S. Gardner, & Michael C. Madden. (1994). Observation of voids induced by mechanical stress and electromigration in passivated Al lines deposited at different purity levels. Applied Physics Letters. 64(18). 2424–2426. 12 indexed citations

19.

Marieb, T., et al.. (1994). Direct observation of the growth and movement of electromigration voids under passivation. AIP conference proceedings. 305. 1–14. 8 indexed citations

20.

Besser, Paul R., T. Marieb, & J. C. Bravman. (1993). Strain Relaxation and In-Situ Observation of Voiding in Passivated Aluminum Alloy Lines.. MRS Proceedings. 308. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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