John E. Sanchez

1.7k citations

70 papers · 1.4k indexed · h-index 19

Impact in

Electronic, Optical and Magnetic Materials top 5%
- Copper Interconnects and Reliability
Mechanics of Materials top 5%
- Metal and Thin Film Mechanics

Papers in ⓘ

Electronic, Optical and Magnetic Materials 48
- Copper Interconnects and Reliability 41
- Gold and Silver Nanoparticles Synthesis and Applications 6
Electrical and Electronic Engineering 39
- Electronic Packaging and Soldering Technologies 22
- Semiconductor materials and devices 16
- Integrated Circuits and Semiconductor Failure Analysis 5

Co-authors: Eduard Arzt (13 shared papers)Oliver Kraft (5 shared papers)Adriana E. Lita (3 shared papers)Adriana E. Lita (1 shared paper)William D. Nix (2 shared papers)J. W. Morris (2 shared papers)J.W. Morris (4 shared papers)D. R. Frear (2 shared papers)
Journals: Journal of Applied Physics (7 papers)Applied Physics Letters (5 papers)Microscopy and Microanalysis (3 papers)Journal of Electronic Materials (3 papers)Optics Express (1 paper)
Partner nations: United States Germany Mexico

In The Last Decade

John E. Sanchez

68 papers receiving 1.4k citations

Peers

Countries citing papers authored by John E. Sanchez

Since Specialization

Citations

This map shows the geographic impact of John E. Sanchez's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John E. Sanchez with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John E. Sanchez more than expected).

Fields of papers citing papers by John E. Sanchez

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by John E. Sanchez. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John E. Sanchez. The network helps show where John E. Sanchez may publish in the future.

Co-authors

The 25 scholars most cited alongside John E. Sanchez, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with John E. Sanchez Line = papers co-authored together John E. Sanchez links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 70 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Electromigration failure by shape change of voids in bamboo lines Journal of Applied Physics ·Eduard Arzt, Oliver Kraft, William D. Nix, John E. Sanchez	1994	160
2	Effects of grain orientation on hillock formation and grain growth in aluminum films on silicon substrates Scripta Metallurgica et Materialia ·John E. Sanchez, Eduard Arzt	1992	116
3	Effects of grain growth on dynamic surface scaling during the deposition of Al polycrystalline thin films Physical review. B, Condensed matter ·Adriana E. Lita, John E. Sanchez	2000	97
4	Characterization of surface structure in sputtered Al films: Correlation to microstructure evolution Journal of Applied Physics ·Adriana E. Lita, John E. Sanchez	1999	95
5	Oxide dual-layer memory element for scalable non-volatile cross-point memory technology R. Meyer, Lawrence F. Schloss, Julie Brewer, R. Lambertson, Wayne Kinney, John E. Sanchez, D. Rinerson	2008	79
6	Morphology of electromigration-induced damage and failure in Al alloy thin film conductors Journal of Electronic Materials ·John E. Sanchez, L. T. McKnelly, J. W. Morris	1990	72
7	Detection of SARS-CoV-2 and its S and N proteins using surface enhanced Raman spectroscopy RSC Advances ·John E. Sanchez, Sierra A. Jaramillo, Erik W. Settles, J. Jesús Velázquez Salazar, Alexander Lehr, Javier González, M. C. Rodríguez‐Aranda, H. Navarro‐Contreras, Marlee O. Raniere, Maxx Harvey, David M. Wagner, Andrew T. Koppisch, Robert S. Kellar, Paul Keim, Miguel José Yacamán	2021	66
8	The evolution of microstructure in Al-2 Pct Cu thin films: Precipitation, dissolution, and reprecipitation Metallurgical Transactions A ·D. R. Frear, John E. Sanchez, A. D. Romig, J. W. Morris	1990	61
9	Mechanical, tribological, and electrochemical behavior of Cr1−xAlxN coatings deposited by r.f. reactive magnetron co-sputtering method Applied Surface Science ·John E. Sanchez, Olga Marta Coto Sánchez, L. Ipaz, W. Aperador, J.C. Caicedo, C. Amaya, Martín Adelaido Hernández Landaverde, Francisco Espinoza Beltrán, J. Muñoz‐Saldaña, G. Zambrano	2009	56
10	Electromigration induced transgranular slit failures in near bamboo Al and Al-2% Cu thin-film interconnects Applied Physics Letters ·John E. Sanchez, Oliver Kraft, Eduard Arzt	1992	56
11	Slit morphology of electromigration induced open circuit failures in fine line conductors Journal of Applied Physics ·John E. Sanchez, L. T. McKnelly, J.W. Morris	1992	48
12	Observation and Modelling of Electromigration-Induced Void growth in Al-Based Interconnects MRS Proceedings ·O. Kraft, S. Bäder, John E. Sanchez, Eduard Arzt	1993	45
13	Local crystallographic texture and voiding in passivated copper interconnects Applied Physics Letters ·J. A. Nucci, Robert R. Keller, John E. Sanchez, Yosi Shacham‐Diamand	1996	33
14	Mapping the magnetic and crystal structure in cobalt nanowires Journal of Applied Physics ·Jesús Cantu‐Valle, I. Betancourt, John E. Sanchez, Francisco Ruiz‐Zepeda, Mazin M. Maqableh, Fernando Mendoza Santoyo, Bethanie J. H. Stadler, Arturo Ponce	2015	33
15	Analysis of grain-boundary structure in Al–Cu interconnects Journal of Applied Physics ·David P. Field, John E. Sanchez, Paul R. Besser, D. J. Dingley	1997	31
16	Effects of linewidth, microstructure, and grain growth on voiding in passivated copper lines Applied Physics Letters ·J. A. Nucci, Yosi Shacham‐Diamand, John E. Sanchez	1995	26
17	Interpretation of Resistance Changes during Interconnect Reliability Testing MRS Proceedings ·John E. Sanchez, Van Pham	1994	19
18	A stable multiply twinned decahedral gold nanoparticle with a barrel-like shape Surface Science ·Ulises Santiago, J. Jesús Velázquez‐Salazar, John E. Sanchez, Francisco Ruiz‐Zepeda, J. Eduardo Ortega, J. Réyes-Gasga, Lourdes Bazán-Díaz, I. Betancourt, E.F. Rauch, M. Véron, Arturo Ponce, Miguel José–Yacamán	2015	19
19	Quantitative Analysis of Electromigration Damage in Al-based Conductor Lines Journal of materials research/Pratt's guide to venture capital sources ·Oliver Kraft, John E. Sanchez, M. Bauer, Eduard Arzt	1997	18
20	Cluster interactions and stress evolution during electromigration in confined metal interconnects Applied Physics Letters ·D. D. Brown, John E. Sanchez, M. A. Korhonen, Che‐Yu Li	1995	18

About John E. Sanchez

John E. Sanchez is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Materials Chemistry, Mechanics of Materials and Biomedical Engineering, having authored 70 papers that have together received 1.4k indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (41 papers), Electronic Packaging and Soldering Technologies (22 papers), Metal and Thin Film Mechanics (17 papers), Semiconductor materials and devices (16 papers), Anodic Oxide Films and Nanostructures (7 papers), Gold and Silver Nanoparticles Synthesis and Applications (6 papers), Integrated Circuits and Semiconductor Failure Analysis (5 papers) and Plasmonic and Surface Plasmon Research (4 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (846 citations), Mechanics of Materials (373 citations), Electrical and Electronic Engineering (826 citations), Materials Chemistry (396 citations) and Computational Mechanics (173 citations). John E. Sanchez has collaborated with scholars based in United States, Germany and Mexico. Frequent co-authors include Eduard Arzt, Oliver Kraft, Adriana E. Lita, Adriana E. Lita, William D. Nix, J. W. Morris, J.W. Morris, D. R. Frear, Yosi Shacham‐Diamand and Paul R. Besser. Their work appears in journals such as Journal of Applied Physics, Applied Physics Letters, Microscopy and Microanalysis, Journal of Electronic Materials and Optics Express.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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