Paul A. Flinn

1.8k total citations
47 papers, 1.5k citations indexed

About

Paul A. Flinn is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, Paul A. Flinn has authored 47 papers receiving a total of 1.5k indexed citations (citations by other indexed papers that have themselves been cited), including 34 papers in Electrical and Electronic Engineering, 26 papers in Electronic, Optical and Magnetic Materials and 12 papers in Mechanics of Materials. Recurrent topics in Paul A. Flinn's work include Copper Interconnects and Reliability (24 papers), Semiconductor materials and devices (24 papers) and Electronic Packaging and Soldering Technologies (14 papers). Paul A. Flinn is often cited by papers focused on Copper Interconnects and Reliability (24 papers), Semiconductor materials and devices (24 papers) and Electronic Packaging and Soldering Technologies (14 papers). Paul A. Flinn collaborates with scholars based in United States, Australia and Canada. Paul A. Flinn's co-authors include William D. Nix, Chien Chiang, Donald S. Gardner, G. Neubauer, J. C. Bravman, T. Marieb, Paul R. Besser, Michael C. Madden, David B. Fraser and Ramnath Venkatraman and has published in prestigious journals such as The Journal of Chemical Physics, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

Paul A. Flinn

46 papers receiving 1.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Paul A. Flinn United States 20 737 710 602 431 280 47 1.5k
R.W. Vook United States 23 740 1.0× 657 0.9× 471 0.8× 680 1.6× 652 2.3× 133 1.9k
P.B. Barna Hungary 20 468 0.6× 313 0.4× 590 1.0× 864 2.0× 266 0.9× 94 1.4k
J. O. Olowolafe United States 21 1.1k 1.5× 419 0.6× 357 0.6× 547 1.3× 820 2.9× 44 1.7k
B. M. Clemens United States 21 268 0.4× 522 0.7× 443 0.7× 708 1.6× 611 2.2× 40 1.4k
P. Yashar United States 14 263 0.4× 407 0.6× 824 1.4× 848 2.0× 441 1.6× 17 1.4k
A. Naudon France 22 300 0.4× 223 0.3× 218 0.4× 941 2.2× 259 0.9× 78 1.4k
M. O. Aboelfotoh United States 25 1.4k 1.9× 384 0.5× 146 0.2× 513 1.2× 1.1k 3.8× 87 1.9k
J.J. Grob France 23 642 0.9× 168 0.2× 243 0.4× 774 1.8× 202 0.7× 76 1.4k
K. Y. Ahn United States 18 456 0.6× 398 0.6× 173 0.3× 317 0.7× 443 1.6× 67 1000
J. Angilello United States 16 539 0.7× 186 0.3× 174 0.3× 419 1.0× 344 1.2× 33 956

Countries citing papers authored by Paul A. Flinn

Since Specialization
Citations

This map shows the geographic impact of Paul A. Flinn's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Paul A. Flinn with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Paul A. Flinn more than expected).

Fields of papers citing papers by Paul A. Flinn

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Paul A. Flinn. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Paul A. Flinn. The network helps show where Paul A. Flinn may publish in the future.

Co-authorship network of co-authors of Paul A. Flinn

This figure shows the co-authorship network connecting the top 25 collaborators of Paul A. Flinn. A scholar is included among the top collaborators of Paul A. Flinn based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Paul A. Flinn. Paul A. Flinn is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Bravman, J. C., et al.. (2002). Stress-induced and electromigration voiding in aluminum interconnects passivated with silicon nitride. Journal of Applied Physics. 91(6). 3653–3657. 11 indexed citations
2.
Bravman, J. C., et al.. (1999). A Detailed Study of Void Motion In Passivated Aluminum Interconnects. MRS Proceedings. 563. 3 indexed citations
3.
Bravman, J. C., et al.. (1999). Direct measurement of nucleation times and growth rates of electromigration induced voids. AIP conference proceedings. 15–26. 1 indexed citations
4.
Bravman, J. C., et al.. (1998). A Quantitative Study of Void Nucleation Times in Passivated Aluminum Interconnects. MRS Proceedings. 516. 3 indexed citations
5.
Lee, Samantha, J. C. Bravman, Paul A. Flinn, & T. Marieb. (1998). Comparisons of constraint effects on Al lines under various passivations. 277–282. 1 indexed citations
6.
Besser, Paul R., T. Marieb, Jin Lee, Paul A. Flinn, & J. C. Bravman. (1996). Measurement and interpretation of strain relaxation in passivated Al–0.5% Cu lines. Journal of materials research/Pratt's guide to venture capital sources. 11(1). 184–193. 26 indexed citations
7.
Flinn, Paul A., et al.. (1996). Stress and Microstructural Evolution of Lpcvd Polysilicon Thin Films During High Temperature Annealing. MRS Proceedings. 441. 10 indexed citations
8.
Flinn, Paul A., et al.. (1996). In-situ Measurement of Viscous Flow of Thermal Silicon Dioxide Thin Films at High Temperature. MRS Proceedings. 446. 2 indexed citations
9.
Flinn, Paul A.. (1995). Mechanical Stress in VLSI Interconnections: Origins, Effects, Measurement, and Modeling. MRS Bulletin. 20(11). 70–73. 36 indexed citations
10.
Ma, Qing, et al.. (1995). Quantitative Measurement of Interface Fracture Energy in Multi-Layer Thin Film Structures. MRS Proceedings. 391. 42 indexed citations
11.
Marieb, T., et al.. (1994). Direct observation of the growth and movement of electromigration voids under passivation. AIP conference proceedings. 305. 1–14. 8 indexed citations
12.
Paniccia, Mario, R. Reifenberger, & Paul A. Flinn. (1994). In-situ observation of electromigration in Au using atomic force microscopy. AIP conference proceedings. 305. 211–219.
13.
Besser, Paul R., Michael C. Madden, & Paul A. Flinn. (1992). In situ scanning electron microscopy observation of the dynamic behavior of electromigration voids in passivated aluminum lines. Journal of Applied Physics. 72(8). 3792–3797. 64 indexed citations
14.
Flinn, Paul A.. (1992). Stress, strain and failure in interconnection materials: Study by wafer curvature and X-ray diffraction techniques. AIP conference proceedings. 263. 73–88. 2 indexed citations
15.
Madden, Michael C., et al.. (1992). High Resolution Observation of Void Motion in Passivated Metal Lines Under Electromigration Stress. MRS Proceedings. 265(1). 33–38. 35 indexed citations
16.
Flinn, Paul A.. (1991). Measurement and interpretation of stress in copper films as a function of thermal history. Journal of materials research/Pratt's guide to venture capital sources. 6(7). 1498–1501. 121 indexed citations
17.
Gardner, Donald S. & Paul A. Flinn. (1990). Mechanical stress as a function of temperature for aluminum alloy films. Journal of Applied Physics. 67(4). 1831–1844. 84 indexed citations
18.
Gardner, Donald S. & Paul A. Flinn. (1988). Mechanical Stress as a Function of Temperature in Thin Aluminum Films and its Alloys. MRS Proceedings. 130. 11 indexed citations
19.
Flinn, Paul A., et al.. (1973). Effect of crystal structure on diffusion broadening of Mössbauer line shape in polycrystalline samples. Applied Physics Letters. 23(11). 587–589. 21 indexed citations
20.
Flinn, Paul A., et al.. (1969). MEASUREMENT OF IRON DIFFUSION IN AN Fe-3% Si ALLOY BY MEANS OF THE MÖSSBAUER TECHNIQUE. Applied Physics Letters. 15(10). 331–333. 20 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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