Tik Sun

669 total citations
20 papers, 548 citations indexed

About

Tik Sun is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Mechanics of Materials. According to data from OpenAlex, Tik Sun has authored 20 papers receiving a total of 548 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electronic, Optical and Magnetic Materials, 11 papers in Electrical and Electronic Engineering and 7 papers in Mechanics of Materials. Recurrent topics in Tik Sun's work include Copper Interconnects and Reliability (12 papers), Semiconductor materials and devices (10 papers) and Metal and Thin Film Mechanics (7 papers). Tik Sun is often cited by papers focused on Copper Interconnects and Reliability (12 papers), Semiconductor materials and devices (10 papers) and Metal and Thin Film Mechanics (7 papers). Tik Sun collaborates with scholars based in United States, Austria and South Korea. Tik Sun's co-authors include Kevin R. Coffey, Katayun Barmak, Bo Yao, Andrew P. Warren, Michael F. Toney, Robert E. Peale, Amith Darbal, Paulo J. Ferreira, K. J. Ganesh and Vineet Kumar and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Physical Review B.

In The Last Decade

Tik Sun

20 papers receiving 534 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Tik Sun United States 10 369 304 196 169 117 20 548
T. Marieb United States 12 323 0.9× 321 1.1× 143 0.7× 84 0.5× 166 1.4× 45 522
Evgeny E. Glickman Israel 14 279 0.8× 235 0.8× 183 0.9× 82 0.5× 93 0.8× 41 539
Miki Moriyama Japan 14 427 1.2× 247 0.8× 222 1.1× 162 1.0× 179 1.5× 26 611
H. Geisler Germany 12 226 0.6× 129 0.4× 156 0.8× 89 0.5× 171 1.5× 53 464
R. Ruiz United States 13 449 1.2× 299 1.0× 140 0.7× 181 1.1× 235 2.0× 32 566
S. Hymes United States 10 439 1.2× 435 1.4× 116 0.6× 105 0.6× 145 1.2× 20 568
Paul R. Besser United States 18 719 1.9× 523 1.7× 149 0.8× 195 1.2× 257 2.2× 68 903
E. M. Zielinski United States 10 289 0.8× 363 1.2× 237 1.2× 59 0.3× 284 2.4× 27 583
Amith Darbal United States 13 194 0.5× 158 0.5× 367 1.9× 127 0.8× 153 1.3× 24 599
Shih‐Nan Hsiao Taiwan 13 234 0.6× 338 1.1× 156 0.8× 344 2.0× 91 0.8× 73 623

Countries citing papers authored by Tik Sun

Since Specialization
Citations

This map shows the geographic impact of Tik Sun's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tik Sun with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tik Sun more than expected).

Fields of papers citing papers by Tik Sun

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tik Sun. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tik Sun. The network helps show where Tik Sun may publish in the future.

Co-authorship network of co-authors of Tik Sun

This figure shows the co-authorship network connecting the top 25 collaborators of Tik Sun. A scholar is included among the top collaborators of Tik Sun based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tik Sun. Tik Sun is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lu, Wenjia, et al.. (2025). Field simulation and measurement of effective radiating area of planar non-focused therapeutic ultrasound transducers. Measurement. 254. 117907–117907. 1 indexed citations
2.
Barmak, Katayun, Xuan Liu, Amith Darbal, et al.. (2016). On twin density and resistivity of nanometric Cu thin films. Journal of Applied Physics. 120(6). 13 indexed citations
3.
Barmak, Katayun, Amith Darbal, K. J. Ganesh, et al.. (2014). Surface and grain boundary scattering in nanometric Cu thin films: A quantitative analysis including twin boundaries. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 32(6). 74 indexed citations
4.
Darbal, Amith, K. J. Ganesh, Xiang-Yang Liu, et al.. (2013). Grain Boundary Character Distribution of Nanocrystalline Cu Thin Films Using Stereological Analysis of Transmission Electron Microscope Orientation Maps. Microscopy and Microanalysis. 19(1). 111–119. 37 indexed citations
5.
Coffey, Kevin R., Katayun Barmak, Tik Sun, Andrew P. Warren, & Bo Yao. (2013). Grain boundary and surface scattering in interconnect metals. Journal of International Crisis and Risk Communication Research. 19. 1–3. 3 indexed citations
6.
Barmak, Katayun, Scott Roberts, Terry Shyu, et al.. (2012). Grain Growth and the Puzzle of its Stagnation in Thin Films a Detailed Comparison of Experiments and Simulations. Materials science forum. 715-716. 473–479. 12 indexed citations
7.
Warren, Andrew P., Tik Sun, Bo Yao, et al.. (2012). Evolution of nanoscale roughness in Cu/SiO2 and Cu/Ta interfaces. Applied Physics Letters. 100(2). 5 indexed citations
8.
Darbal, Amith, K. J. Ganesh, Katayun Barmak, et al.. (2011). Grain Boundary Characterization of Nanocrystalline Cu from the Stereological Analysis of Transmission Electron Microscope Orientation Maps. Microscopy and Microanalysis. 17(S2). 1416–1417. 2 indexed citations
9.
Rauch, E.F., Katayun Barmak, Paulo J. Ferreira, et al.. (2011). Automated Crystal Orientation and Phase Mapping for Thin Film Applications by Transmission Electron Microscopy. Microscopy and Microanalysis. 17(S2). 1086–1087. 6 indexed citations
10.
Darbal, Amith, K. J. Ganesh, Katayun Barmak, et al.. (2011). Grain Boundary Characterization of Nanocrystalline Cu from the Stereological Analysis of Transmission Electron Microscope Orientation Maps. Microscopy and Microanalysis. 17(S2). 1426–1427. 1 indexed citations
11.
Barmak, Katayun, et al.. (2010). Impact Of Surface And Grain Boundary Scattering On The Resistivity Of Nanometric Cu Interconnects. AIP conference proceedings. 12–22. 7 indexed citations
12.
Sun, Tik, Bo Yao, Andrew P. Warren, et al.. (2010). Surface and grain-boundary scattering in nanometric Cu films. Physical Review B. 81(15). 173 indexed citations
13.
Yao, Bo, Tik Sun, Andrew P. Warren, et al.. (2009). High contrast hollow-cone dark field transmission electron microscopy for nanocrystalline grain size quantification. Micron. 41(3). 177–182. 34 indexed citations
14.
Darbal, Amith, et al.. (2009). Orientation Imaging of Nanocrystalline Platinum Films in the TEM. Microscopy and Microanalysis. 15(S2). 1232–1233. 5 indexed citations
15.
Sun, Tik. (2009). Classical size effect in copper thin films: Impact of surface and grain boundary scattering on resistivity. Journal of International Crisis and Risk Communication Research. 3 indexed citations
16.
Sun, Tik, Bo Yao, Andrew P. Warren, et al.. (2009). Dominant role of grain boundary scattering in the resistivity of nanometric Cu films. Physical Review B. 79(4). 104 indexed citations
17.
Shelton, David, Tik Sun, James C. Ginn, Kevin R. Coffey, & Glenn D. Boreman. (2008). Relaxation time effects on dynamic conductivity of alloyed metallic thin films in the infrared band. Journal of Applied Physics. 104(10). 17 indexed citations
18.
Sun, Tik, Bo Yao, Andrew P. Warren, et al.. (2008). Resistivity Size Effect in Encapsulated Cu Thin Films. Journal of International Crisis and Risk Communication Research. 19. 141–143. 3 indexed citations
19.
Yao, Bo, Tik Sun, Vineet Kumar, Katayun Barmak, & Kevin R. Coffey. (2008). Grain growth and void formation in dielectric-encapsulated Cu thin films. Journal of materials research/Pratt's guide to venture capital sources. 23(7). 2033–2039. 10 indexed citations
20.
Sun, Tik, Bo Yao, Andrew P. Warren, et al.. (2008). Classical size effect in oxide-encapsulated Cu thin films: Impact of grain boundaries versus surfaces on resistivity. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 26(4). 605–609. 38 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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