Tik Sun
Impact in
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- Copper Interconnects and Reliability
Papers in
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- Copper Interconnects and Reliability 12
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- Semiconductor materials and devices 10
- Electronic Packaging and Soldering Technologies 2
- Co-authors
- Kevin R. Coffey (16 shared papers)Katayun Barmak (17 shared papers)Bo Yao (13 shared papers)Andrew P. Warren (10 shared papers)Michael F. Toney (4 shared papers)Robert E. Peale (2 shared papers)Amith Darbal (7 shared papers)Paulo J. Ferreira (4 shared papers)
- Journals
- Microscopy and Microanalysis (5 papers)Physical Review B (2 papers)Journal of Applied Physics (2 papers)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (2 papers)Measurement (1 paper)
- Partner nations
- United StatesSouth KoreaAustria
In The Last Decade
Tik Sun
20 papers receiving 534 citations
Peers
Comparison fields: 5 of 40
- Electronic, Optical and Magnetic Materials 304
- Structural Biology 10
- Electrical and Electronic Engineering 369
- Atomic and Molecular Physics, and Optics 169
- Mechanics of Materials 117
Countries citing papers authored by Tik Sun
This map shows the geographic impact of Tik Sun's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tik Sun with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tik Sun more than expected).
Fields of papers citing papers by Tik Sun
This network shows the impact of papers produced by Tik Sun. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tik Sun. The network helps show where Tik Sun may publish in the future.
Co-authors
The 25 scholars most cited alongside Tik Sun, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 173 | |
| 2 | 2009 | 104 | |
| 3 | 2014 | 74 | |
| 4 | 2008 | 38 | |
| 5 | 2013 | 37 | |
| 6 | 2009 | 34 | |
| 7 | 2008 | 17 | |
| 8 | 2016 | 13 | |
| 9 | 2012 | 12 | |
| 10 | 2008 | 10 | |
| 11 | 2010 | 7 | |
| 12 | 2011 | 6 | |
| 13 | 2009 | 5 | |
| 14 | 2012 | 5 | |
| 15 | Classical size effect in copper thin films: Impact of surface and grain boundary scattering on resistivity | 2009 | 3 |
| 16 | 2008 | 3 | |
| 17 | 2013 | 3 | |
| 18 | 2011 | 2 | |
| 19 | 2025 | 1 | |
| 20 | 2011 | 1 |
About Tik Sun
Tik Sun is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Mechanics of Materials, Materials Chemistry and Atomic and Molecular Physics, and Optics, having authored 20 papers that have together received 548 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (12 papers), Semiconductor materials and devices (10 papers), Metal and Thin Film Mechanics (7 papers), Microstructure and mechanical properties (5 papers), Advanced Electron Microscopy Techniques and Applications (4 papers), Surface and Thin Film Phenomena (3 papers), Electron and X-Ray Spectroscopy Techniques (2 papers) and Electronic Packaging and Soldering Technologies (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (304 citations), Structural Biology (10 citations), Electrical and Electronic Engineering (369 citations), Atomic and Molecular Physics, and Optics (169 citations) and Mechanics of Materials (117 citations). Tik Sun has collaborated with scholars based in United States, South Korea and Austria. Frequent co-authors include Kevin R. Coffey, Katayun Barmak, Bo Yao, Andrew P. Warren, Michael F. Toney, Robert E. Peale, Amith Darbal, Paulo J. Ferreira, K. J. Ganesh and J. M. Rickman. Their work appears in journals such as Microscopy and Microanalysis, Physical Review B, Journal of Applied Physics, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films and Measurement.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.