P. G. Kim

523 total citations
7 papers, 465 citations indexed

About

P. G. Kim is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, P. G. Kim has authored 7 papers receiving a total of 465 indexed citations (citations by other indexed papers that have themselves been cited), including 7 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 1 paper in Automotive Engineering. Recurrent topics in P. G. Kim's work include Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (4 papers) and Intermetallics and Advanced Alloy Properties (3 papers). P. G. Kim is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (4 papers) and Intermetallics and Advanced Alloy Properties (3 papers). P. G. Kim collaborates with scholars based in United States and Italy. P. G. Kim's co-authors include K. N. Tu, Jihun Jang, D. R. Frear, Patrick Thompson, K. N. Tu, Ajit Mal and C. Y. Liu and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of materials research/Pratt's guide to venture capital sources.

In The Last Decade

P. G. Kim

7 papers receiving 439 citations

Peers

P. G. Kim
H. K. Kim United States
M. Li Singapore
L. Zavalij United States
C. Y. Liu United States
Guangchen Xu China
Chi-Won Hwang Japan
H. Balkan United States
Sang-Won Kim South Korea
King-Ning Tu United States
J. K. Lin United States
H. K. Kim United States
P. G. Kim
Citations per year, relative to P. G. Kim P. G. Kim (= 1×) peers H. K. Kim

Countries citing papers authored by P. G. Kim

Since Specialization
Citations

This map shows the geographic impact of P. G. Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by P. G. Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites P. G. Kim more than expected).

Fields of papers citing papers by P. G. Kim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by P. G. Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by P. G. Kim. The network helps show where P. G. Kim may publish in the future.

Co-authorship network of co-authors of P. G. Kim

This figure shows the co-authorship network connecting the top 25 collaborators of P. G. Kim. A scholar is included among the top collaborators of P. G. Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with P. G. Kim. P. G. Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

7 of 7 papers shown
1.
Jang, Jihun, C. Y. Liu, P. G. Kim, et al.. (2000). Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints. Journal of materials research/Pratt's guide to venture capital sources. 15(8). 1679–1687. 29 indexed citations
2.
Jang, Jihun, P. G. Kim, K. N. Tu, D. R. Frear, & Patrick Thompson. (1999). Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology. Journal of Applied Physics. 85(12). 8456–8463. 253 indexed citations
3.
Kim, P. G., et al.. (1998). Time- and temperature-dependent wetting behavior of eutectic SnPb on Cu leadframes plated with Pd/Ni and Au/Pd/Ni thin films. Journal of Applied Physics. 84(2). 770–775. 27 indexed citations
4.
Kim, P. G. & K. N. Tu. (1998). Fast dissolution and soldering reactions on Au foils. Materials Chemistry and Physics. 53(2). 165–171. 73 indexed citations
5.
Kim, P. G., et al.. (1997). Soldering reaction between eutectic SnPb and plated Pd/Ni thin films on Cu leadframe. Applied Physics Letters. 71(1). 61–63. 10 indexed citations
6.
Kim, P. G. & K. N. Tu. (1996). Morphology of wetting reaction of eutectic SnPb solder on Au foils. Journal of Applied Physics. 80(7). 3822–3827. 68 indexed citations
7.
Kim, P. G. & K. N. Tu. (1996). Fast Soldering Reactions on Au Foils. MRS Proceedings. 445. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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Breakdown of academic impact, for papers by H. K. Kim Breakdown of academic impact, for papers by M. Li Breakdown of academic impact, for papers by L. Zavalij Breakdown of academic impact, for papers by C. Y. Liu Breakdown of academic impact, for papers by Guangchen Xu Breakdown of academic impact, for papers by Chi-Won Hwang Breakdown of academic impact, for papers by H. Balkan Breakdown of academic impact, for papers by Sang-Won Kim Breakdown of academic impact, for papers by King-Ning Tu Breakdown of academic impact, for papers by J. K. Lin
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2026