Guangchen Xu

441 total citations
25 papers, 390 citations indexed

About

Guangchen Xu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering. According to data from OpenAlex, Guangchen Xu has authored 25 papers receiving a total of 390 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Electrical and Electronic Engineering, 16 papers in Electronic, Optical and Magnetic Materials and 8 papers in Mechanical Engineering. Recurrent topics in Guangchen Xu's work include Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (19 papers) and Copper Interconnects and Reliability (16 papers). Guangchen Xu is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (19 papers) and Copper Interconnects and Reliability (16 papers). Guangchen Xu collaborates with scholars based in China, United States and Germany. Guangchen Xu's co-authors include Fu Guo, Fu Guo, Xitao Wang, Yao Shi, Zhidong Xia, Yongping Lei, Limin Ma, Xiaoyan Li, Ren Ren and André Lee and has published in prestigious journals such as Journal of Materials Science, Journal of Alloys and Compounds and Journal of Material Science and Technology.

In The Last Decade

Guangchen Xu

23 papers receiving 386 citations

Peers

Guangchen Xu

EEE

EOMM

AMPO

GMS

King-Ning Tu United States

Brook Chao United States

M. Li Singapore

H. Balkan United States

C. Y. Liu United States

J. W. Jang United States

Moon Gi Cho South Korea

P. G. Kim United States

T. L. Shao Taiwan

Flora Somidin Malaysia

King-Ning Tu United States

Guangchen Xu

307 ×0.8

EEE

136 ×0.6

107 ×1.0

EOMM

26 ×0.8

AMPO

17 ×0.5

GMS

Citations per year, relative to Guangchen Xu Guangchen Xu (= 1×) peers King-Ning Tu

Countries citing papers authored by Guangchen Xu

Since Specialization

Citations

This map shows the geographic impact of Guangchen Xu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Guangchen Xu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Guangchen Xu more than expected).

Fields of papers citing papers by Guangchen Xu

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Guangchen Xu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Guangchen Xu. The network helps show where Guangchen Xu may publish in the future.

Co-authorship network of co-authors of Guangchen Xu

This figure shows the co-authorship network connecting the top 25 collaborators of Guangchen Xu. A scholar is included among the top collaborators of Guangchen Xu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Guangchen Xu. Guangchen Xu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Zhang, Wenwu & Guangchen Xu. (2025). Design of Plastic Injection Mold with Support Strip Based on CAD/CAE. 6(2).

Ma, Limin, et al.. (2011). Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique. Journal of Electronic Materials. 41(2). 425–430. 9 indexed citations

Ma, Limin, Feng Tai, Guangchen Xu, Fu Guo, & Xitao Wang. (2011). Effects of Processing and Amount of Co Addition on Shear Strength and Microstructual Development in the Sn-3.0Ag-0.5Cu Solder Joint. Journal of Electronic Materials. 40(6). 1416–1421. 10 indexed citations

Xu, Guangchen, et al.. (2011). Interfacial reaction between the thermopile materials and eutectic Sn-based solders. 2. 1–4. 1 indexed citations

Hu, Hao, et al.. (2011). A Model for Rapid Tin Whisker Growth on the Surface of ErSn3 Phase. Journal of Electronic Materials. 41(2). 184–189. 8 indexed citations

Xu, Guangchen, Fu Guo, Zhidong Xia, et al.. (2011). Effects of electromigration on resistance changes in eutectic SnBi solder joints. Journal of Materials Science. 46(10). 3544–3549. 24 indexed citations

Zhao, Haiyan, et al.. (2011). In situ measurement of stress evolution in Sn-based solder joint under electromigration based on X-ray diffraction technique. 38. 1–4.

Xu, Guangchen, Fu Guo, Xitao Wang, et al.. (2010). Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach. Journal of Alloys and Compounds. 509(3). 878–884. 38 indexed citations

Zhang, Ruihong, Guangchen Xu, Xitao Wang, et al.. (2010). Electromigration in Sn-Bi Modified with Polyhedral Oligomeric Silsesquioxane. Journal of Electronic Materials. 39(12). 2513–2521. 34 indexed citations

10.

Xu, Guangchen, et al.. (2009). Electromigration in eutectic SnAg solder reaction couples with various ambient temperatures and current densities. International Journal of Minerals Metallurgy and Materials. 16(6). 685–690. 5 indexed citations

11.

Zhao, Mengke, et al.. (2009). Fundamental studies on whisker growth in Sn-based Solders. 23. 585–588. 1 indexed citations

12.

Guo, Fu, et al.. (2009). Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints. Journal of Materials Science. 44(20). 5595–5601. 29 indexed citations

13.

Guo, Fu, Guangchen Xu, Zhidong Xia, et al.. (2009). Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration. Journal of Electronic Materials. 38(12). 2756–2761. 15 indexed citations

14.

Xu, Guangchen, et al.. (2009). Electromigration-induced Bi-rich whisker growth in Cu/Sn–58Bi/Cu solder joints. Journal of Materials Science. 45(2). 334–340. 16 indexed citations

15.

Xu, Guangchen, et al.. (2009). Electromigration-induced cracks in Cu/Sn_3.5Ag/Cu solder reaction couple at room temperature. Journal of Semiconductors. 30(3). 33006–33006. 3 indexed citations

16.

Guo, Fu, et al.. (2009). Effect of Electromigration and Isothermal Aging on the Formation of Metal Whiskers and Hillocks in Eutectic Sn-Bi Solder Joints and Reaction Films. Journal of Electronic Materials. 38(12). 2647–2658. 12 indexed citations

17.

Xu, Guangchen, et al.. (2009). Electromigration-enhanced intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints. Journal of Materials Science. 45(4). 929–935. 13 indexed citations

18.

Xu, Guangchen, Fu Guo, Zhidong Xia, et al.. (2009). Effect of Solder Thickness on Electromigration Behavior in Eutectic SnPb Solder Reaction Couples. Journal of Materials Engineering and Performance. 19(5). 616–622. 2 indexed citations

19.

Shi, Yao, Guangchen Xu, Ren Ren, et al.. (2008). Effect of rare earth on mechanical creep–fatigue property of SnAgCu solder joint. Journal of Alloys and Compounds. 472(1-2). 198–202. 50 indexed citations

20.

Xu, Guangchen, et al.. (2007). Electromigration in Lead-Free Sn3.8Ag0.7Cu Solder Reaction Couple. 1–5. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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