Guangchen Xu
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- General Materials Science top 5%
- Topics
- Electronic Packaging and Soldering Technologies (24 papers)3D IC and TSV technologies (19 papers)Copper Interconnects and Reliability (16 papers)
- Journals
- Journal of Materials ScienceJournal of Alloys and CompoundsJournal of Material Science and Technology
- Partner nations
- ChinaUnited StatesGermany
In The Last Decade
Guangchen Xu
23 papers receiving 386 citations
Peers
Comparison fields: 5 of 24
- Electrical and Electronic Engineering 368
- Mechanical Engineering 232
- Electronic, Optical and Magnetic Materials 112
- Atomic and Molecular Physics, and Optics 32
- General Materials Science 31
Countries citing papers authored by Guangchen Xu
This map shows the geographic impact of Guangchen Xu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Guangchen Xu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Guangchen Xu more than expected).
Fields of papers citing papers by Guangchen Xu
This network shows the impact of papers produced by Guangchen Xu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Guangchen Xu. The network helps show where Guangchen Xu may publish in the future.
Co-authorship network of co-authors of Guangchen Xu
This figure shows the co-authorship network connecting the top 25 collaborators of Guangchen Xu. A scholar is included among the top collaborators of Guangchen Xu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Guangchen Xu. Guangchen Xu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 9 | |
| 3 | 10 | |
| 4 | 1 | |
| 5 | 8 | |
| 6 | 24 | |
| 7 | 0 | |
| 8 | 38 | |
| 9 | 34 | |
| 10 | 5 | |
| 11 | 1 | |
| 12 | 29 | |
| 13 | 15 | |
| 14 | 16 | |
| 15 | 3 | |
| 16 | 12 | |
| 17 | 13 | |
| 18 | 2 | |
| 19 | 50 | |
| 20 | 2 |
About Guangchen Xu
Guangchen Xu is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and General Materials Science, having authored 25 papers that have together received 390 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (19 papers) and Copper Interconnects and Reliability (16 papers). The work is most often cited by research in General Materials Science (31 citations), Electrical and Electronic Engineering (368 citations) and Mechanical Engineering (232 citations). Guangchen Xu has collaborated with scholars based in China, United States and Germany. Frequent co-authors include Fu Guo, Fu Guo, Xitao Wang, Yao Shi, Zhidong Xia, Yongping Lei, Limin Ma, Xiaoyan Li, Ren Ren and André Lee. Their work appears in journals such as Journal of Materials Science, Journal of Alloys and Compounds and Journal of Material Science and Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.