Patrick Thompson

837 total citations
48 papers, 553 citations indexed

About

Patrick Thompson is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Patrick Thompson has authored 48 papers receiving a total of 553 indexed citations (citations by other indexed papers that have themselves been cited), including 34 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 8 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Patrick Thompson's work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (22 papers) and Copper Interconnects and Reliability (8 papers). Patrick Thompson is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (22 papers) and Copper Interconnects and Reliability (8 papers). Patrick Thompson collaborates with scholars based in United States, Japan and Israel. Patrick Thompson's co-authors include Jihun Jang, D. R. Frear, K. N. Tu, P. G. Kim, Peter Børgesen, Luke Wentlent, Elon Glassberg, S. W. Ricky Lee, Geir Strandenes and Philip C. Spinella and has published in prestigious journals such as Journal of Applied Physics, Journal of Alloys and Compounds and SAE technical papers on CD-ROM/SAE technical paper series.

In The Last Decade

Patrick Thompson

46 papers receiving 517 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Patrick Thompson United States 12 436 241 51 49 46 48 553
P. Beckley United Kingdom 11 127 0.3× 170 0.7× 19 0.4× 5 0.1× 54 1.2× 45 368
Richard Coyle United States 17 679 1.6× 440 1.8× 18 0.4× 1 0.0× 3 0.1× 64 800
Moonhee Lee Japan 9 89 0.2× 141 0.6× 6 0.1× 1 0.0× 8 0.2× 18 325
Chingchi Chen United States 17 866 2.0× 49 0.2× 27 0.5× 6 0.1× 62 955
Minghui Lin United States 9 322 0.7× 166 0.7× 36 0.7× 18 471
Dae-Cheol Seo South Korea 9 185 0.4× 83 0.3× 43 0.8× 26 447
Yoshiaki Fuda United States 8 178 0.4× 121 0.5× 10 0.2× 19 325
Zhi Gong China 10 186 0.4× 67 0.3× 18 0.4× 27 310
Verena Hein Germany 6 117 0.3× 98 0.4× 16 0.3× 21 498
Chris Brooks Canada 11 192 0.4× 14 0.1× 114 2.2× 2 0.0× 10 0.2× 31 339

Countries citing papers authored by Patrick Thompson

Since Specialization
Citations

This map shows the geographic impact of Patrick Thompson's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Patrick Thompson with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Patrick Thompson more than expected).

Fields of papers citing papers by Patrick Thompson

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Patrick Thompson. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Patrick Thompson. The network helps show where Patrick Thompson may publish in the future.

Co-authorship network of co-authors of Patrick Thompson

This figure shows the co-authorship network connecting the top 25 collaborators of Patrick Thompson. A scholar is included among the top collaborators of Patrick Thompson based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Patrick Thompson. Patrick Thompson is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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Thompson, Patrick, et al.. (2023). Superiority of compensatory reserve measurement compared with the Shock index for early and accurate detection of reduced central blood volume status. The Journal of Trauma: Injury, Infection, and Critical Care. 95(2S). S113–S119. 3 indexed citations
3.
Thompson, Patrick, et al.. (2022). Observation of Fatigue and Creep Ratcheting Failure in Solder Joints under Pulsed Direct Current Electromigration Testing. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1465–1471. 1 indexed citations
4.
Thompson, Patrick, et al.. (2022). Effective Constitutive Relations for Sintered Nano Copper Joints. Journal of Electronic Packaging. 145(2). 5 indexed citations
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Thompson, Patrick, et al.. (2021). Study of Metallurgical Reaction and Electromigration Mechanism in Microbump with Embedded Cu Ball. 931–936. 1 indexed citations
7.
Thompson, Patrick, et al.. (2021). Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds. Journal of Electronic Packaging. 144(3). 3 indexed citations
8.
Tsur, Avishai M., Roy Nadler, Avi Benov, et al.. (2020). The effects of military-wide introduction of advanced tourniquets in the Israel Defense Forces. Injury. 51(5). 1210–1215. 14 indexed citations
9.
Khalek, Imad, et al.. (2020). Evaluation of an On-Board, Real-Time Electronic Particulate Matter Sensor Using Heavy-Duty On-Highway Diesel Engine Platform. SAE technical papers on CD-ROM/SAE technical paper series. 1. 4 indexed citations
10.
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Wentlent, Luke, et al.. (2019). Diffusion Creep of Realistic SnAgCu Solder Joints at Times and Stresses of Relevance to Thermal Fatigue. IEEE Transactions on Components Packaging and Manufacturing Technology. 10(2). 288–295. 13 indexed citations
12.
Andrew, P., Heather F. Pidcoke, Joseph F. Rappold, et al.. (2015). Blood far forward. The Journal of Trauma: Injury, Infection, and Critical Care. 78(6). S2–S6. 32 indexed citations
13.
Thompson, Patrick, et al.. (2013). Flip chip assembly with advanced RDL technology. 57–59. 2 indexed citations
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Lall, Pradeep, et al.. (2002). Reliability characterization of the SLICC package. 1202–1210. 6 indexed citations
16.
Thompson, Patrick, et al.. (2002). Stencil printing process development for low cost flip chip interconnect. 421–426. 14 indexed citations
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Thompson, Patrick. (1995). MCM-L product development process for low-cost MCMs. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 18(1). 9–12. 1 indexed citations
19.
Dengerink, H. A., et al.. (1984). Gender and Oral Contraceptive Effects on Temporary Auditory Effects of Noise. International Journal of Audiology. 23(4). 411–425. 13 indexed citations
20.
Thompson, Patrick, et al.. (1980). The economics of commonality - A Boeing product strategy view. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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