I. Lum

453 total citations
12 papers, 383 citations indexed

About

I. Lum is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, I. Lum has authored 12 papers receiving a total of 383 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 3 papers in Mechanics of Materials. Recurrent topics in I. Lum's work include Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (6 papers) and Advanced Welding Techniques Analysis (4 papers). I. Lum is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (6 papers) and Advanced Welding Techniques Analysis (4 papers). I. Lum collaborates with scholars based in Canada, China and Qatar. I. Lum's co-authors include Y. Zhou, M. Mayer, Jae Pil Jung, Baohua Chang, Dong Du, Chunqing Wang, Hao Huang, C.J. Hang, Satoshi Fukumoto and E. Biro and has published in prestigious journals such as Journal of Applied Physics, Journal of Materials Processing Technology and Metallurgical and Materials Transactions A.

In The Last Decade

I. Lum

12 papers receiving 357 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
I. Lum Canada	10	268	225	95	61	41	12	383
J.T. Moon Canada	12	165 0.6×	252 1.1×	73 0.8×	72 1.2×	27 0.7×	18	341
Tamás Hurtony Hungary	13	243 0.9×	363 1.6×	35 0.4×	39 0.6×	50 1.2×	43	411
Jiwei Fan United States	12	181 0.7×	176 0.8×	94 1.0×	156 2.6×	61 1.5×	21	407
G.Y. Li Singapore	8	261 1.0×	298 1.3×	36 0.4×	28 0.5×	71 1.7×	12	352
T. Kirkpatrick United States	6	167 0.6×	325 1.4×	67 0.7×	83 1.4×	77 1.9×	9	381
E. Auerswald Germany	7	159 0.6×	358 1.6×	81 0.9×	36 0.6×	49 1.2×	22	399
Richard C. Blish United States	14	120 0.4×	335 1.5×	68 0.7×	95 1.6×	30 0.7×	33	441
G.T. Galyon United States	9	243 0.9×	424 1.9×	54 0.6×	77 1.3×	72 1.8×	15	488
Pilin Liu United States	8	169 0.6×	332 1.5×	42 0.4×	76 1.2×	31 0.8×	20	377
Chunjin Hang China	9	207 0.8×	265 1.2×	27 0.3×	51 0.8×	31 0.8×	22	317

Countries citing papers authored by I. Lum

Since Specialization

Citations

This map shows the geographic impact of I. Lum's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by I. Lum with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites I. Lum more than expected).

Fields of papers citing papers by I. Lum

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by I. Lum. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by I. Lum. The network helps show where I. Lum may publish in the future.

Co-authorship network of co-authors of I. Lum

This figure shows the co-authorship network connecting the top 25 collaborators of I. Lum. A scholar is included among the top collaborators of I. Lum based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with I. Lum. I. Lum is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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12 of 12 papers shown

Lum, I., C.J. Hang, M. Mayer, & Y. Zhou. (2009). In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal. Journal of Electronic Materials. 38(5). 647–654. 13 indexed citations

Hang, C.J., I. Lum, M. Mayer, et al.. (2009). Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force. Microelectronic Engineering. 86(10). 2094–2103. 32 indexed citations

Lum, I., Hao Huang, Baohua Chang, et al.. (2009). Effects of superimposed ultrasound on deformation of gold. Journal of Applied Physics. 105(2). 74 indexed citations

Tian, Yanhong, Chunqing Wang, I. Lum, et al.. (2008). Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature. Journal of Materials Processing Technology. 208(1-3). 179–186. 47 indexed citations

Hang, C.J., I. Lum, M. Mayer, et al.. (2008). Bonding wire characterization using automatic deformability measurement. Microelectronic Engineering. 85(8). 1795–1803. 25 indexed citations

Hang, C.J., I. Lum, M. Mayer, et al.. (2007). On-Line Hardness Characterization of Novel 2-mil Copper Bonding Wires. 25–30. 6 indexed citations

Tian, Yanhong, et al.. (2006). Experimental study of ultrasonic wedge bonding with copper wire. 389–393. 9 indexed citations

Lum, I., M. Mayer, & Y. Zhou. (2006). Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate. Journal of Electronic Materials. 35(3). 433–442. 62 indexed citations

Lum, I., et al.. (2006). Roughness Enhanced Au Ball Bonding of Cu Substrates. IEEE Transactions on Components and Packaging Technologies. 29(3). 457–463. 3 indexed citations

10.

Lum, I., Jae Pil Jung, & Y. Zhou. (2005). Bonding mechanism in ultrasonic gold ball bonds on copper substrate. Metallurgical and Materials Transactions A. 36(5). 1279–1286. 46 indexed citations

11.

Chang, Baohua, Y. Zhou, I. Lum, & Dong Du. (2005). Finite element analysis of effect of electrode pitting in resistance spot welding of aluminium alloy. Science and Technology of Welding & Joining. 10(1). 61–66. 19 indexed citations

12.

Lum, I., et al.. (2004). Electrode pitting in resistance spot welding of aluminum alloy 5182. Metallurgical and Materials Transactions A. 35(1). 217–226. 47 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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