J.T. Moon

426 total citations
18 papers, 341 citations indexed

About

J.T. Moon is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, J.T. Moon has authored 18 papers receiving a total of 341 indexed citations (citations by other indexed papers that have themselves been cited), including 14 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 4 papers in Materials Chemistry. Recurrent topics in J.T. Moon's work include Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (11 papers) and Advanced Welding Techniques Analysis (7 papers). J.T. Moon is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (11 papers) and Advanced Welding Techniques Analysis (7 papers). J.T. Moon collaborates with scholars based in Canada, South Korea and United States. J.T. Moon's co-authors include M. Mayer, Y. Zhou, A. Shah, John Persic, Anthony D. Rollett, K. H. Oh, Ali Reza Rezvani, C.J. Hang, Jae‐Hyung Cho and Yeon Wook Kim and has published in prestigious journals such as Journal of Applied Polymer Science, Metallurgical and Materials Transactions A and Journal of Industrial and Engineering Chemistry.

In The Last Decade

J.T. Moon

18 papers receiving 325 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
J.T. Moon Canada	12	252	165	73	72	41	18	341
Ivy Qin United States	11	302 1.2×	145 0.9×	44 0.6×	47 0.7×	67 1.6×	34	361
Pilin Liu United States	8	332 1.3×	169 1.0×	42 0.6×	76 1.1×	34 0.8×	20	377
Chunjin Hang China	9	265 1.1×	207 1.3×	27 0.4×	51 0.7×	25 0.6×	22	317
T. Kirkpatrick United States	6	325 1.3×	167 1.0×	67 0.9×	83 1.2×	29 0.7×	9	381
I. Lum Canada	10	225 0.9×	268 1.6×	95 1.3×	61 0.8×	21 0.5×	12	383
Tamás Hurtony Hungary	13	363 1.4×	243 1.5×	35 0.5×	39 0.5×	28 0.7×	43	411
Min-Bo Zhou China	10	317 1.3×	140 0.8×	33 0.5×	46 0.6×	29 0.7×	67	354
Don Son Jiang Taiwan	9	298 1.2×	210 1.3×	39 0.5×	36 0.5×	30 0.7×	36	359
C.J. Hang China	8	280 1.1×	223 1.4×	49 0.7×	55 0.8×	56 1.4×	9	381

Countries citing papers authored by J.T. Moon

Since Specialization

Citations

This map shows the geographic impact of J.T. Moon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J.T. Moon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J.T. Moon more than expected).

Fields of papers citing papers by J.T. Moon

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J.T. Moon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J.T. Moon. The network helps show where J.T. Moon may publish in the future.

Co-authorship network of co-authors of J.T. Moon

This figure shows the co-authorship network connecting the top 25 collaborators of J.T. Moon. A scholar is included among the top collaborators of J.T. Moon based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J.T. Moon. J.T. Moon is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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18 of 18 papers shown

Kim, Jin Hee, et al.. (2024). Enhanced antibacterial activity of poly(vinyl alcohol)‐graphene composites via graphene oxide surfactancy. Journal of Applied Polymer Science. 141(36). 2 indexed citations

Kim, Jin Hee, et al.. (2024). Impact of solvent temperature on graphite shear exfoliation efficiency. Journal of Industrial and Engineering Chemistry. 141. 185–192. 1 indexed citations

Mayer, M., et al.. (2014). Simplifying Reliability Testing of Wire Bonds Using On-Chip Heater and Pad Resistance Method. Journal of Electronic Packaging. 137(1). 5 indexed citations

Rezvani, Ali Reza, A. Shah, M. Mayer, Y. Zhou, & J.T. Moon. (2013). Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding. Microelectronics Reliability. 53(7). 1002–1008. 12 indexed citations

Mayer, M., et al.. (2012). Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding. Microelectronics Reliability. 52(11). 2744–2748. 5 indexed citations

Rezvani, Ali Reza, et al.. (2011). Free-air ball formation and deformability with Pd coated Cu wire. 1516–1522. 15 indexed citations

Shah, A., Ali Reza Rezvani, M. Mayer, et al.. (2010). Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. Microelectronics Reliability. 51(1). 67–74. 25 indexed citations

Shah, A., et al.. (2009). Low-Stress Thermosonic Copper Ball Bonding. IEEE Transactions on Electronics Packaging Manufacturing. 32(3). 176–184. 35 indexed citations

Mayer, M., J.T. Moon, & John Persic. (2009). Measuring stress next to Au ball bond during high temperature aging. Microelectronics Reliability. 49(7). 771–781. 14 indexed citations

10.

Hang, C.J., I. Lum, M. Mayer, et al.. (2009). Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force. Microelectronic Engineering. 86(10). 2094–2103. 32 indexed citations

11.

Shah, A., M. Mayer, Y. Zhou, John Persic, & J.T. Moon. (2009). Optimization of ultrasound and bond force to reduce pad stress in thermosonic Cu ball bonding. 22. 10–15. 8 indexed citations

12.

Hang, C.J., et al.. (2009). Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding. Journal of Materials Science Materials in Electronics. 20(11). 1144–1149. 21 indexed citations

13.

Kang, Suk-Hoon, et al.. (2009). Mechanism of electromigration in Au/Al wirebond and its effects. 943–947. 11 indexed citations

14.

Shah, A., et al.. (2008). Reduction of underpad stress in thermosonic copper ball bonding. 2123–2130. 14 indexed citations

15.

Shah, A., et al.. (2008). In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding. Microelectronic Engineering. 85(9). 1851–1857. 49 indexed citations

16.

Cho, Jae‐Hyung, et al.. (2006). Investigation of recrystallization and grain growth of copper and gold bonding wires. Metallurgical and Materials Transactions A. 37(10). 3085–3097. 38 indexed citations

17.

Kim, Yeon Wook, et al.. (2003). Recrystallization and grain growth of cold-drawn gold bonding wire. Metallurgical and Materials Transactions A. 34(5). 1113–1125. 40 indexed citations

18.

Paik, Kyung‐Wook, et al.. (2002). Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability. 44–51. 14 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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