Ole Lühn

556 total citations
18 papers, 475 citations indexed

About

Ole Lühn is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Ole Lühn has authored 18 papers receiving a total of 475 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 6 papers in Electronic, Optical and Magnetic Materials and 4 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Ole Lühn's work include 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (8 papers) and Electrodeposition and Electroless Coatings (7 papers). Ole Lühn is often cited by papers focused on 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (8 papers) and Electrodeposition and Electroless Coatings (7 papers). Ole Lühn collaborates with scholars based in Belgium, Switzerland and Germany. Ole Lühn's co-authors include Wouter Ruythooren, Chris Van Hoof, Jean‐Pierre Célis, Aleksandar Radisic, Harold Philipsen, Bert Verlinden, Dirk Vandepitte, Chukwudi Okoro, Bart Vandevelde and Riet Labie and has published in prestigious journals such as Journal of The Electrochemical Society, Electrochimica Acta and Electrochemical and Solid-State Letters.

In The Last Decade

Ole Lühn

17 papers receiving 458 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Ole Lühn Belgium	9	447	121	111	90	71	18	475
Thierry Mourier France	9	359 0.8×	112 0.9×	41 0.4×	50 0.6×	94 1.3×	49	405
M. Angyal United States	10	379 0.8×	238 2.0×	64 0.6×	72 0.8×	81 1.1×	28	456
Tom Ritzdorf United States	12	407 0.9×	147 1.2×	54 0.5×	87 1.0×	48 0.7×	24	444
В. А. Богуш Belarus	10	241 0.5×	129 1.1×	65 0.6×	90 1.0×	44 0.6×	30	297
Ming‐Shiann Feng Taiwan	13	385 0.9×	198 1.6×	79 0.7×	232 2.6×	130 1.8×	40	485
Gayle Murdoch Belgium	11	296 0.7×	131 1.1×	64 0.6×	69 0.8×	40 0.6×	39	346
Yann Civale Belgium	15	533 1.2×	96 0.8×	95 0.9×	67 0.7×	107 1.5×	42	556
T. Spooner United States	13	412 0.9×	312 2.6×	109 1.0×	83 0.9×	64 0.9×	49	472
M. Fayolle France	13	356 0.8×	165 1.4×	68 0.6×	214 2.4×	130 1.8×	41	505
Sergey Lopatin United States	8	272 0.6×	124 1.0×	70 0.6×	67 0.7×	20 0.3×	16	300

Countries citing papers authored by Ole Lühn

Since Specialization

Citations

This map shows the geographic impact of Ole Lühn's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ole Lühn with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ole Lühn more than expected).

Fields of papers citing papers by Ole Lühn

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ole Lühn. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ole Lühn. The network helps show where Ole Lühn may publish in the future.

Co-authorship network of co-authors of Ole Lühn

This figure shows the co-authorship network connecting the top 25 collaborators of Ole Lühn. A scholar is included among the top collaborators of Ole Lühn based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ole Lühn. Ole Lühn is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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18 of 18 papers shown

Glatthaar, Markus, D. Kray, Niels Bay, et al.. (2011). Application of SunsPL for fast laser chemical process development. 86. 2866–2869. 1 indexed citations

Bay, Niels, et al.. (2011). Characterization and module integration of full electroplated contacts on silicon solar cells. Energy Procedia. 8. 473–478. 1 indexed citations

Kray, D., et al.. (2011). Reducing Ag Cost and Increasing Efficiency. Multicrystalline Silicon Solar Cells with Direct Plated Contacts Exceeding 17% Efficiency. EU PVSEC. 1199–1202. 3 indexed citations

Lühn, Ole, Aleksandar Radisic, Chris Van Hoof, Wouter Ruythooren, & J.‐P. Celis. (2010). Monitoring the Superfilling of Blind Holes with Electrodeposited Copper. Journal of The Electrochemical Society. 157(4). D242–D242. 30 indexed citations

Okoro, Chukwudi, Kris Vanstreels, Riet Labie, et al.. (2010). Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV. Journal of Micromechanics and Microengineering. 20(4). 45032–45032. 89 indexed citations

Bay, Niels, et al.. (2010). Adhesive One Step Ni/Ag and Ni/Cu/Ag Inline Direct Plating on Laser Processed Selective Emitter Structures. EU PVSEC. 2183–2185. 5 indexed citations

Radisic, Aleksandar, Ole Lühn, Harold Philipsen, et al.. (2010). Copper plating for 3D interconnects. Microelectronic Engineering. 88(5). 701–704. 70 indexed citations

Philipsen, Harold, Ole Lühn, Yann Civale, et al.. (2010). (Invited) Through-Silicon Via Technology for 3D Applications. ECS Transactions. 25(38). 97–107. 2 indexed citations

Radisic, Aleksandar, Ole Lühn, Jan Vaes, et al.. (2010). Copper Plating for 3D Interconnects. ECS Transactions. 25(38). 119–125. 4 indexed citations

10.

Tezcan, Deniz Sabuncuoglu, et al.. (2009). Scalable Through Silicon Via with polymer deep trench isolation for 3D wafer level packaging. 1159–1164. 41 indexed citations

11.

Lühn, Ole, Aleksandar Radisic, Philippe M. Vereecken, et al.. (2009). Changing Superfilling Mode for Copper Electrodeposition in Blind Holes from Differential Inhibition to Differential Acceleration. Electrochemical and Solid-State Letters. 12(5). D39–D39. 46 indexed citations

12.

Fischer, Pamela R., et al.. (2008). High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed. Microelectronic Engineering. 85(10). 1957–1961. 20 indexed citations

13.

Lühn, Ole, Chris Van Hoof, Wouter Ruythooren, & Jean‐Pierre Célis. (2008). Barrier and seed layer coverage in 3D structures with different aspect ratios using sputtering and ALD processes. Microelectronic Engineering. 85(10). 1947–1951. 31 indexed citations

14.

Tezcan, Deniz Sabuncuoglu, Fabrice Duval, Ole Lühn, Philippe Soussan, & Bart Swinnen. (2008). A New Scaled Through Si Via with Polymer Fill for 3D Wafer Level Packaging. 3 indexed citations

15.

Lühn, Ole, Aleksandar Radisic, Philippe M. Vereecken, et al.. (2008). Reducing the electrodeposition time for filling microvias with copper for 3D technology. Lirias (KU Leuven). 50. 866–870. 6 indexed citations

16.

Lühn, Ole, Chris Van Hoof, Wouter Ruythooren, & Jean‐Pierre Célis. (2008). Filling of microvia with an aspect ratio of 5 by copper electrodeposition. Electrochimica Acta. 54(9). 2504–2508. 90 indexed citations

17.

Radisic, Aleksandar, Ole Lühn, Bart Swinnen, et al.. (2008). Cu Plating of Through-Si Vias for 3D-Stacked Integrated Circuits. MRS Proceedings. 1112. 1 indexed citations

18.

Tezcan, Deniz Sabuncuoglu, Koen De Munck, Nga Pham, et al.. (2006). Development of vertical and tapered via etch for 3D through wafer interconnect technology. 22–28. 32 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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