Hideki Kitada

782 total citations
61 papers, 534 citations indexed

About

Hideki Kitada is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, Hideki Kitada has authored 61 papers receiving a total of 534 indexed citations (citations by other indexed papers that have themselves been cited), including 56 papers in Electrical and Electronic Engineering, 19 papers in Electronic, Optical and Magnetic Materials and 16 papers in Biomedical Engineering. Recurrent topics in Hideki Kitada's work include 3D IC and TSV technologies (38 papers), Electronic Packaging and Soldering Technologies (27 papers) and Copper Interconnects and Reliability (19 papers). Hideki Kitada is often cited by papers focused on 3D IC and TSV technologies (38 papers), Electronic Packaging and Soldering Technologies (27 papers) and Copper Interconnects and Reliability (19 papers). Hideki Kitada collaborates with scholars based in Japan, Taiwan and United States. Hideki Kitada's co-authors include T. Nakamura, Takayuki Ohba, Koji Fujimoto, Noritoshi Maeda, Noriyoshi Shimizu, Hiroshi Arimoto, Osamu Ueda, Young Seok Kim, Takashi Suzuki and Akira Endoh and has published in prestigious journals such as Physical review. B, Condensed matter, Applied Physics Letters and Surface Science.

In The Last Decade

Hideki Kitada

58 papers receiving 520 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Hideki Kitada Japan 12 469 141 96 67 48 61 534
Vincent Larrey France 10 250 0.5× 85 0.6× 54 0.6× 72 1.1× 32 0.7× 51 330
Matthew Lueck United States 15 566 1.2× 131 0.9× 56 0.6× 179 2.7× 65 1.4× 52 604
J. Dechamp France 13 373 0.8× 155 1.1× 39 0.4× 81 1.2× 42 0.9× 35 445
S. Kadomura Japan 11 499 1.1× 79 0.6× 170 1.8× 34 0.5× 24 0.5× 43 542
J. Cotte United States 15 502 1.1× 150 1.1× 32 0.3× 155 2.3× 24 0.5× 31 591
В. В. Наумов Russia 10 245 0.5× 64 0.5× 33 0.3× 95 1.4× 43 0.9× 92 339
B. Roberds United States 9 461 1.0× 84 0.6× 41 0.4× 53 0.8× 19 0.4× 15 503
C. Deguet France 14 494 1.1× 197 1.4× 37 0.4× 142 2.1× 10 0.2× 34 565
M. Rivoire France 14 397 0.8× 96 0.7× 184 1.9× 163 2.4× 43 0.9× 47 552
Aditya P. Karmarkar United States 12 469 1.0× 105 0.7× 241 2.5× 60 0.9× 23 0.5× 24 607

Countries citing papers authored by Hideki Kitada

Since Specialization
Citations

This map shows the geographic impact of Hideki Kitada's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hideki Kitada with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hideki Kitada more than expected).

Fields of papers citing papers by Hideki Kitada

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hideki Kitada. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hideki Kitada. The network helps show where Hideki Kitada may publish in the future.

Co-authorship network of co-authors of Hideki Kitada

This figure shows the co-authorship network connecting the top 25 collaborators of Hideki Kitada. A scholar is included among the top collaborators of Hideki Kitada based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hideki Kitada. Hideki Kitada is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Sato, Masaru, Hideki Kitada, & Mayumi B. Takeyama. (2019). Characterization of TiN films sputter-deposited at low temperatures for Cu-through-silicon via. Japanese Journal of Applied Physics. 58(SB). SBBC03–SBBC03. 2 indexed citations
2.
Kitada, Hideki, et al.. (2017). 3D Packaging Technology to Realize Miniaturization/High-Density and High-Performance Servers. 53(2). 15–22. 2 indexed citations
3.
Kitada, Hideki, et al.. (2016). Analyzing and modeling methods for warpages of thin and large dies with redistribution layer. Japanese Journal of Applied Physics. 55(6S3). 06JC03–06JC03. 4 indexed citations
4.
Kitada, Hideki, et al.. (2016). Thermal stress reliability of copper through silicon via interconnects for 3D logic devices. 115–119. 4 indexed citations
5.
Nakamura, T., Hideki Kitada, Noritoshi Maeda, et al.. (2013). Influence of wafer thinning process on backside damage in 3D integration. 1–6. 3 indexed citations
6.
Kitada, Hideki, et al.. (2012). Influence of Via Stress on Surface Micro-roughness-induced Leakage Current in Through-Silicon Via Interconnects. IEICE Technical Report; IEICE Tech. Rep.. 111(463). 41–46.
7.
Nakamura, T., Hideki Kitada, Y. Mizushima, et al.. (2012). Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects. 1–4. 31 indexed citations
8.
Kitada, Hideki, et al.. (2012). Novel Through Silicon Vias Leakage Current Evaluation Using Infrared-Optical Beam Irradiation. Japanese Journal of Applied Physics. 51(5S). 05EE03–05EE03. 4 indexed citations
9.
Maeda, Noritoshi, Yukinobu Hikosaka, Takashi Eshita, et al.. (2012). Development of ultra-thinning technology for logic and memory heterogeneous stack applications. 1–4. 2 indexed citations
10.
Kitada, Hideki, et al.. (2011). Hot spot cooling evaluation using closed-channel cooling system (C 3 S) for MPU 3DI application. Symposium on VLSI Technology. 144–145. 1 indexed citations
11.
Kitada, Hideki, et al.. (2011). Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology. Japanese Journal of Applied Physics. 50(5S1). 05ED02–05ED02. 4 indexed citations
12.
Abe, Daisuke, et al.. (2010). Hybrid Electrochemical Mechanical Planarization Process for Cu Dual-Damascene Through-Silicon Via Using Noncontact Electrode Pad. Japanese Journal of Applied Physics. 49(5S2). 05FG01–05FG01. 10 indexed citations
13.
Kitada, Hideki, et al.. (2010). Stress and diffusion resistance of low temperature CVD dielectrics for multi-TSVs on bumpless Wafer-on-Wafer (WOW) technology. 123–124. 3 indexed citations
14.
Fujimoto, Koji, et al.. (2009). TSV (through silicon via) interconnection on wafer-on-a-wafer (WOW) with MEMS technology. TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference. 1877–1880. 12 indexed citations
15.
Kitada, Hideki, et al.. (2009). Influence of Titanium Liner on Resistivity of Copper Interconnects. Japanese Journal of Applied Physics. 48(4S). 04C026–04C026. 10 indexed citations
16.
Shimizu, Noriyoshi, Hideki Kitada, & Osamu Ueda. (1995). Al growth on Si(001) observed by scanning tunneling microscopy. Journal of Crystal Growth. 150. 1159–1163. 10 indexed citations
17.
Endoh, Akira, Hiroshi Arimoto, Hideki Kitada, Atsushi Tackeuchi, & Shunichi Muto. (1993). Effect of reactive ion beam etching damage on exciton absorption recovery time of multiple quantum well wires. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 11(2). 183–186. 1 indexed citations
18.
Kitada, Hideki, Hiroshi Arimoto, Atsushi Tackeuchi, et al.. (1992). Fabrication of Sub-100 nm Wires and Dots in GaAs/AlGaAs Multiquantum Well Using Focused Ion Beam Lithography. Japanese Journal of Applied Physics. 31(7B). L990–L990. 3 indexed citations
19.
Arimoto, Hiroshi, Akihiro Kawano, Hideki Kitada, Akira Endoh, & Toshio Fujii. (1991). I n s i t u two-dimensional electron gas fabrication by focused Si ion beam implantation and molecular beam epitaxy overgrowth. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 9(5). 2675–2678. 9 indexed citations
20.
Arimoto, Hiroshi, M. Kosugi, Hideki Kitada, & Eizo Miyauchi. (1989). Photochemical fine etching using FIB-induced damage in GaAs for in-situ dry processing. Microelectronic Engineering. 9(1-4). 321–324. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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