Hideki Kitada

782 citations

61 papers · 534 indexed · h-index 12

Impact in

Electrical and Electronic Engineering top 10%
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
Electronic, Optical and Magnetic Materials
- Copper Interconnects and Reliability

Papers in ⓘ

Electrical and Electronic Engineering 56
- 3D IC and TSV technologies 38
- Electronic Packaging and Soldering Technologies 27
- Semiconductor materials and devices 16
- Integrated Circuits and Semiconductor Failure Analysis 10
Electronic, Optical and Magnetic Materials 19
- Copper Interconnects and Reliability 19

Co-authors: T. Nakamura (30 shared papers)Takayuki Ohba (30 shared papers)Koji Fujimoto (20 shared papers)Noritoshi Maeda (11 shared papers)Noriyoshi Shimizu (2 shared papers)Osamu Ueda (2 shared papers)Hiroshi Arimoto (8 shared papers)Young Seok Kim (2 shared papers)
Journals: Japanese Journal of Applied Physics (13 papers)Microelectronic Engineering (3 papers)Applied Physics Letters (2 papers)Gastrointestinal Endoscopy (1 paper)IEEE Transactions on Electron Devices (1 paper)
Partner nations: Japan Taiwan United States

In The Last Decade

Hideki Kitada

58 papers receiving 520 citations

Peers

Countries citing papers authored by Hideki Kitada

Since Specialization

Citations

This map shows the geographic impact of Hideki Kitada's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hideki Kitada with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hideki Kitada more than expected).

Fields of papers citing papers by Hideki Kitada

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hideki Kitada. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hideki Kitada. The network helps show where Hideki Kitada may publish in the future.

Co-authors

The 25 scholars most cited alongside Hideki Kitada, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Hideki Kitada Line = papers co-authored together Hideki Kitada links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 61 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Thinned wafer multi-stack 3DI technology Microelectronic Engineering ·Takayuki Ohba, Nobuhide Maeda, Hideki Kitada, Koji Fujimoto, Kousuke Suzuki, T. Nakamura, Akihito Kawai, K. Arai	2009	83
2	Advanced wafer thinning technology and feasibility test for 3D integration Microelectronic Engineering ·Young Seok Kim, Nobuhide Maeda, Hideki Kitada, Koji Fujimoto, Shoichi Kodama, Akihito Kawai, K. Arai, Kousuke Suzuki, T. Nakamura, Takayuki Ohba	2013	70
3	Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects T. Nakamura, Hideki Kitada, Y. Mizushima, Noritoshi Maeda, Koji Fujimoto, Takayuki Ohba	2012	31
4	Ultra thinning down to 4-µm using 300-mm wafer proven by 40-nm node 2Gb DRAM for 3D multi-stack WOW applications Y. S. Kim, Shuhei Kodama, Y. Mizushima, Noritoshi Maeda, Hideki Kitada, Koji Fujimoto, T. Nakamura, Daniela Ota Hisayasu Suzuki, Akihito Kawai, K. Arai, Takayuki Ohba	2014	27
5	The influence of the size effect of copper interconnects on RC delay variability beyond 45nm technology Hideki Kitada, Takashi Suzuki, T. Kimura, Hiroshi Kudo, H. Ochimizu, Shun Okano, A. Tsukune, Satoshi Suda, Satoru Sakai, N. Ohtsuka, T. Tabira, T. Shirasu, M. Sakamoto, Akira Matsuura, Y. Asada, T. Nakamura	2007	25
6	Ultra thinning 300-mm wafer down to 7-µm for 3D wafer Integration on 45-nm node CMOS using strained silicon and Cu/Low-k interconnects Y. S. Kim, A. Tsukune, Noritoshi Maeda, Hideki Kitada, Akihito Kawai, K. Arai, Koji Fujimoto, Kimichi Suzuki, Y. Mizushima, T. Nakamura, Takayuki Ohba, T. Futatsugi, M. Miyajima	2009	22
7	Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology Japanese Journal of Applied Physics ·Hideki Kitada, Nobuhide Maeda, Koji Fujimoto, Yoriko Mizushima, Yoshihiro Nakata, T. Nakamura, Takayuki Ohba	2011	22
8	Development of sub 10-µm ultra-thinning technology using device wafers for 3D manufacturing of terabit memory Noritoshi Maeda, Y. S. Kim, Yukinobu Hikosaka, Takashi Eshita, Hideki Kitada, Koji Fujimoto, Y. Mizushima, Kimichi Suzuki, T. Nakamura, Akihito Kawai, K. Arai, Takayuki Ohba	2010	18
9	Stress sensitivity analysis on TSV structure of wafer-on-a-wafer (WOW) by the finite element method (FEM) Hideki Kitada, Noritoshi Maeda, Koji Fujimoto, Kosuke Suzuki, Akihito Kawai, K. Arai, Takashi Suzuki, T. Nakamura, Takayuki Ohba	2009	14
10	Cluster-ordered array on the Si(001) surface formed by Al deposition Physical review. B, Condensed matter ·Noriyoshi Shimizu, Hideki Kitada, Osamu Ueda	1995	14
11	TSV (through silicon via) interconnection on wafer-on-a-wafer (WOW) with MEMS technology TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference ·Koji Fujimoto, Nobuhide Maeda, Hideki Kitada, Kosuke Suzuki, T. Nakamura, Takayuki Ohba	2009	12
12	Development of low temperature dielectrics down to 150°C for multiple TSVs structure with Wafer-on-Wafer (WOW) technology Hideki Kitada, Noritoshi Maeda, Koji Fujimoto, Y. Mizushima, Yoshihiro Nakata, T. Nakamura, W. Lee, YS Kwon, Takayuki Ohba	2010	12
13	Al growth on Si(001) observed by scanning tunneling microscopy Journal of Crystal Growth ·Noriyoshi Shimizu, Hideki Kitada, Osamu Ueda	1995	10
14	Hybrid Electrochemical Mechanical Planarization Process for Cu Dual-Damascene Through-Silicon Via Using Noncontact Electrode Pad Japanese Journal of Applied Physics ·Shigeru Tominaga, Daisuke Abe, Taro Enomoto, Seiichi Kondo, Hideki Kitada, Takayuki Ohba	2010	10
15	Influence of Titanium Liner on Resistivity of Copper Interconnects Japanese Journal of Applied Physics ·Hideki Kitada, Takashi Suzuki, Shinich Akiyama, T. Nakamura	2009	10
16	Characterization of Local Strain around Through-Silicon Via Interconnects by Using X-ray Microdiffraction Japanese Journal of Applied Physics ·Osamu Nakatsuka, Hideki Kitada, Young-Suk Kim, Yoriko Mizushima, T. Nakamura, Takayuki Ohba, Shigeaki Zaima	2011	10
17	Impact of Thermomechanical Stresses on Bumpless Chip in Stacked Wafer Structure Japanese Journal of Applied Physics ·Yoriko Mizushima, Hideki Kitada, Chihiro J. Uchibori, Nobuhide Maeda, Shoichi Kodama, Young-Suk Kim, Koji Fujimoto, Seiichi Yoshimi, T. Nakamura, Takayuki Ohba	2013	10
18	STM studies of Si(hhm) surface with = 1.4–1.5 Surface Science ·Takayuki Suzuki, Hiroki Minoda, Y. Tanishiro, K. Yagi, Hideki Kitada, Nobutaka Shimizu	1996	10
19	I n s i t u two-dimensional electron gas fabrication by focused Si ion beam implantation and molecular beam epitaxy overgrowth Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena ·Hiroshi Arimoto, Akihiro Kawano, Hideki Kitada, Akira Endoh, Toshio Fujii	1991	9
20	Improved Electron Mobility of Two-Dimensional Electron Gas Formed Area-Selectively in GaAs/AlGaAs Heterostructure by Focused Si Ion Beam Implantation and MBE Overgrowth Japanese Journal of Applied Physics ·Akihiro Kawano, Hiroshi Arimoto, Hideki Kitada, Akira Endoh, Toshio Fujii	1991	8

About Hideki Kitada

Hideki Kitada is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Atomic and Molecular Physics, and Optics and Mechanical Engineering, having authored 61 papers that have together received 534 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (38 papers), Electronic Packaging and Soldering Technologies (27 papers), Copper Interconnects and Reliability (19 papers), Semiconductor materials and devices (16 papers), Integrated Circuits and Semiconductor Failure Analysis (10 papers), Advanced Surface Polishing Techniques (8 papers), Nanofabrication and Lithography Techniques (6 papers) and Semiconductor Quantum Structures and Devices (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (469 citations), Electronic, Optical and Magnetic Materials (96 citations), Automotive Engineering (48 citations), Biomedical Engineering (141 citations) and Nuclear Energy and Engineering (1 citation). Hideki Kitada has collaborated with scholars based in Japan, Taiwan and United States. Frequent co-authors include T. Nakamura, Takayuki Ohba, Koji Fujimoto, Noritoshi Maeda, Noriyoshi Shimizu, Osamu Ueda, Hiroshi Arimoto, Young Seok Kim, Takashi Suzuki and Akira Endoh. Their work appears in journals such as Japanese Journal of Applied Physics, Microelectronic Engineering, Applied Physics Letters, Gastrointestinal Endoscopy and IEEE Transactions on Electron Devices.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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