N. Owada

404 total citations
24 papers, 306 citations indexed

About

N. Owada is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, N. Owada has authored 24 papers receiving a total of 306 indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Electrical and Electronic Engineering, 9 papers in Electronic, Optical and Magnetic Materials and 8 papers in Biomedical Engineering. Recurrent topics in N. Owada's work include Copper Interconnects and Reliability (8 papers), Semiconductor materials and devices (8 papers) and Advanced Surface Polishing Techniques (5 papers). N. Owada is often cited by papers focused on Copper Interconnects and Reliability (8 papers), Semiconductor materials and devices (8 papers) and Advanced Surface Polishing Techniques (5 papers). N. Owada collaborates with scholars based in Japan. N. Owada's co-authors include K. Hinode, K. Mukai, Toshirou Nishida, N. Ohashi, Seiichi Kondo, Yoshio Homma, Yasushi Goto, J. Noguchi, Hiroshi Yamaguchi and Shigeki Hirasawa and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and IEEE Transactions on Electron Devices.

In The Last Decade

N. Owada

21 papers receiving 283 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
N. Owada Japan 9 214 140 126 77 65 24 306
James G. Ryan United States 10 224 1.0× 142 1.0× 68 0.5× 117 1.5× 82 1.3× 25 352
W. Cote United States 8 334 1.6× 170 1.2× 118 0.9× 71 0.9× 43 0.7× 15 411
W. Zhang Belgium 8 276 1.3× 104 0.7× 68 0.5× 61 0.8× 50 0.8× 14 354
Yi‐Wen Cheng United States 7 172 0.8× 83 0.6× 71 0.6× 111 1.4× 111 1.7× 16 302
D. Jawarani United States 10 284 1.3× 139 1.0× 67 0.5× 80 1.0× 44 0.7× 38 336
Kong Boon Yeap United States 13 241 1.1× 113 0.8× 90 0.7× 79 1.0× 120 1.8× 38 394
S. Nagata Japan 12 91 0.4× 140 1.0× 39 0.3× 121 1.6× 73 1.1× 22 358
R.D. Emery United States 8 163 0.8× 55 0.4× 113 0.9× 145 1.9× 146 2.2× 15 371
Jeff Gambino United States 10 310 1.4× 108 0.8× 48 0.4× 62 0.8× 27 0.4× 59 344
Dominique Averty France 10 152 0.7× 58 0.4× 127 1.0× 181 2.4× 37 0.6× 31 305

Countries citing papers authored by N. Owada

Since Specialization
Citations

This map shows the geographic impact of N. Owada's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by N. Owada with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites N. Owada more than expected).

Fields of papers citing papers by N. Owada

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by N. Owada. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by N. Owada. The network helps show where N. Owada may publish in the future.

Co-authorship network of co-authors of N. Owada

This figure shows the co-authorship network connecting the top 25 collaborators of N. Owada. A scholar is included among the top collaborators of N. Owada based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with N. Owada. N. Owada is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
2.
Iwasaka, Masakazu, Satoru Kurita, & N. Owada. (2012). Properties of bubbled gases transportation in a bromothymol blue aqueous solution under gradient magnetic fields. Journal of Applied Physics. 111(7).
3.
Yamaguchi, Hiroshi, N. Ohashi, T. Imai, et al.. (2002). A 7 level metallization with Cu damascene process using newly developed abrasive free polishing. 264–266. 7 indexed citations
5.
Noguchi, J., N. Ohashi, Hiroshi Yamaguchi, et al.. (2002). TDDB improvement in Cu metallization under bias stress. 339–343. 19 indexed citations
6.
Ohashi, N., J. Noguchi, T. Imai, et al.. (2002). Impact of low pressure long throw sputtering method on submicron copper metallization. 160–162. 4 indexed citations
8.
Kondo, S., et al.. (2002). Complete-abrasive-free process for copper damascene interconnection. 253–255. 9 indexed citations
9.
Kondo, Seiichi, et al.. (2000). Abrasive-Free Polishing for Copper Damascene Interconnection. Journal of The Electrochemical Society. 147(10). 3907–3907. 75 indexed citations
10.
Homma, Yoshio, Seiichi Kondo, K. Hinode, et al.. (2000). Control of Photocorrosion in the Copper Damascene Process. Journal of The Electrochemical Society. 147(3). 1193–1193. 34 indexed citations
11.
Saitō, Yōko, et al.. (1997). Molecular dynamics analysis of reflow process of sputtered aluminum films. IEEE Transactions on Semiconductor Manufacturing. 10(1). 131–136. 8 indexed citations
12.
Hirasawa, Shigeki, et al.. (1996). Thermal Analysis of SOI Transistor Devices in LSI Chips.. TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B. 62(593). 405–409. 1 indexed citations
13.
Ohashi, N., et al.. (1996). Improved spin‐on glass process with multilevel metallization. Electronics and Communications in Japan (Part II Electronics). 79(1). 75–82. 1 indexed citations
14.
Owada, N.. (1992). Special Issue on Key of High Yield of ULSI. Methods of Failure Analyses for ULSI.. Journal of the Japan Society for Precision Engineering. 58(2). 230–233. 1 indexed citations
15.
Wei, Long, Shoichiro Tanigawa, K. Hinode, et al.. (1992). Study of Interfacial Reactions in W/Si Systems by a Monoenergetic Positron Beam. Materials science forum. 105-110. 1463–1466. 2 indexed citations
16.
Kobayashi, Atsushi, et al.. (1990). Effects of the Grain Size on the Electrical Properties of Boron-Doped Polysilicon Films. MRS Proceedings. 182. 1 indexed citations
17.
Owada, N., et al.. (1990). Reliability Study on Polycrystalline Silicon Thin Film Resistors used in LSIs Under Thermal and Electrical Stress. Reliability physics. 276–280. 1 indexed citations
18.
Hinode, K., N. Owada, Toshirou Nishida, & K. Mukai. (1987). Stress-induced grain boundary fractures in Al–Si interconnects. Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena. 5(2). 518–522. 102 indexed citations
19.
Hinode, K., N. Owada, Tomoyuki Terada, & Setsuo Iwata. (1987). Silicon take-up by aluminum conductors layered with refractory metals. IEEE Transactions on Electron Devices. 34(3). 700–705. 6 indexed citations
20.
Takai, Osamu, Yoshihiro Hisamatsu, N. Owada, et al.. (1980). Effect of doping on positron annihilation in GaAs. Physics Letters A. 76(2). 157–159. 10 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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