Martin Gall

545 total citations
35 papers, 411 citations indexed

About

Martin Gall is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, Martin Gall has authored 35 papers receiving a total of 411 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Electrical and Electronic Engineering, 15 papers in Electronic, Optical and Magnetic Materials and 4 papers in Materials Chemistry. Recurrent topics in Martin Gall's work include Copper Interconnects and Reliability (15 papers), Electronic Packaging and Soldering Technologies (12 papers) and Semiconductor materials and devices (12 papers). Martin Gall is often cited by papers focused on Copper Interconnects and Reliability (15 papers), Electronic Packaging and Soldering Technologies (12 papers) and Semiconductor materials and devices (12 papers). Martin Gall collaborates with scholars based in United States, Germany and United Kingdom. Martin Gall's co-authors include Ehrenfried Zschech, Sarah Glover, Oliver Schönborn‐Kellenberger, Patrick Garnero, Dennis M. Black, Richard Eastell, Steven Boonen, Pierre D. Delmas, Michael Wagener and Jane A. Cauley and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Scientific Reports.

In The Last Decade

Martin Gall

31 papers receiving 398 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Martin Gall United States	10	196	134	123	96	87	35	411
Hiroshi Umeda Japan	12	160 0.8×	44 0.3×	6 0.0×	158 1.6×	42 0.5×	68	488
Inyong Moon South Korea	15	686 3.5×	53 0.4×	66 0.5×	1.2k 12.4×	26 0.3×	25	1.4k
Jacqueline Boumendil Switzerland	3	41 0.2×	18 0.1×	13 0.1×	71 0.7×	18 0.2×	3	290
W. D. A. M. de Boer Netherlands	9	210 1.1×	22 0.2×	60 0.5×	340 3.5×	15 0.2×	17	537
Gudrun C. Thurner Austria	11	61 0.3×	70 0.5×	4 0.0×	98 1.0×	29 0.3×	20	314
Kyu Jin Lee United States	13	170 0.9×	74 0.6×	18 0.1×	15 0.2×	20 0.2×	36	462
Shinji Tsuge Japan	9	18 0.1×	25 0.2×	17 0.1×	135 1.4×	55 0.6×	15	494
T. Tsuda Japan	11	35 0.2×	41 0.3×	13 0.1×	49 0.5×	22 0.3×	28	312
Henry Yu United States	13	153 0.8×	44 0.3×	14 0.1×	365 3.8×	5 0.1×	36	608
Maria Cristina Frassanito Italy	10	38 0.2×	36 0.3×	8 0.1×	43 0.4×	12 0.1×	12	260

Countries citing papers authored by Martin Gall

Since Specialization

Citations

This map shows the geographic impact of Martin Gall's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Martin Gall with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Martin Gall more than expected).

Fields of papers citing papers by Martin Gall

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Martin Gall. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Martin Gall. The network helps show where Martin Gall may publish in the future.

Co-authorship network of co-authors of Martin Gall

This figure shows the co-authorship network connecting the top 25 collaborators of Martin Gall. A scholar is included among the top collaborators of Martin Gall based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Martin Gall. Martin Gall is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Justison, Patrick, Martin Gall, Yusheng Bian, et al.. (2023). Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal. Th1A.5–Th1A.5.

Ho, Paul S., et al.. (2022). Electromigration in Metals. Cambridge University Press eBooks. 4 indexed citations

Gall, Martin, et al.. (2019). Von 400 auf 800 V - Auswirkungen auf das Hochvoltbordnetz. ATZelektronik. 14(7-8). 42–45. 1 indexed citations

Kuisma, Heikki, et al.. (2018). FO-WLP multi-DOF inertial sensor for automotive applications. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–7. 3 indexed citations

Gall, Martin, et al.. (2018). Rethinking functional safety requires optimized process organization. ATZ-Elektronik worldwide. 13(2). 52–55. 1 indexed citations

Liao, Zhongquan, Leonardo Medrano Sandonas, Tao Zhang, et al.. (2017). In-Situ Stretching Patterned Graphene Nanoribbons in the Transmission Electron Microscope. Scientific Reports. 7(1). 211–211. 29 indexed citations

Dianat, Arezoo, Zhongquan Liao, Martin Gall, et al.. (2017). Doping of graphene induced by boron/silicon substrate. Nanotechnology. 28(21). 215701–215701. 12 indexed citations

Li, Qiong, et al.. (2016). Pollen structure visualization using high-resolution laboratory-based hard X-ray tomography. Biochemical and Biophysical Research Communications. 479(2). 272–276. 13 indexed citations

Liao, Zhongquan, Martin Gall, Kong Boon Yeap, et al.. (2015). <em>In Situ</em> Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices. Journal of Visualized Experiments. e52447–e52447. 1 indexed citations

10.

Hauschildt, Meike, Martin Gall, Axel Preuße, et al.. (2014). Advanced metallization concepts and impact on reliability. Japanese Journal of Applied Physics. 53(5S2). 05GA11–05GA11. 11 indexed citations

11.

Gall, Martin, Kong Boon Yeap, & Ehrenfried Zschech. (2014). Advanced concepts for TDDB reliability in conjunction with 3D stress. AIP conference proceedings. 79–88. 5 indexed citations

12.

Yeap, Kong Boon, Martin Gall, Zhongquan Liao, et al.. (2014). In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms. Journal of Applied Physics. 115(12). 14 indexed citations

13.

Kopycinska‐Müller, Malgorzata, Lei Chen, R. Krause‐Rehberg, et al.. (2013). JMR volume 28 issue 9 Cover and Front matter. Journal of materials research/Pratt's guide to venture capital sources. 28(9). f1–f5. 1 indexed citations

14.

Roellig, M., et al.. (2012). A Critical Review on Multiscale Material Database Requirement for Accurate Three-Dimensional IC Simulation Input. IEEE Transactions on Device and Materials Reliability. 12(2). 217–224. 3 indexed citations

15.

Hauschildt, Meike, et al.. (2009). Large-Scale Electromigration Statistics for Cu Interconnects. MRS Proceedings. 1156. 1 indexed citations

16.

Eastell, Richard, Sarah Glover, Martin Gall, et al.. (2009). Defining a “Reference Population”: No Easy Task. Journal of Bone and Mineral Research. 24(9). 1639–1639. 2 indexed citations

17.

Glover, Sarah, Martin Gall, Oliver Schönborn‐Kellenberger, et al.. (2008). Establishing a Reference Interval for Bone Turnover Markers in 637 Healthy, Young, Premenopausal Women From the United Kingdom, France, Belgium, and the United States. Journal of Bone and Mineral Research. 24(3). 389–397. 132 indexed citations

18.

Gurrum, Siva P., et al.. (2008). A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method. Journal of Electronic Packaging. 130(3). 25 indexed citations

19.

Besser, Paul R., Ehrenfried Zschech, Richard Ortega, et al.. (2001). Microstructural characterization of inlaid copper interconnect lines. Journal of Electronic Materials. 30(4). 320–330. 54 indexed citations

20.

Gall, Martin. (1999). Investigation of electromigration reliability in Al(Cu) interconnects. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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